comprising only passive thin-film or thick-film elements formed on a common insulating substrate

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H01L27/01

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/01comprising only passive thin-film or thick-film elements formed on a common insulating substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
On-chip electrostatic discharge sensor
- Patent number 12,148,748
- Issue date Nov 19, 2024
- The Regents of the University of California
- Subramanian Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded deep trench capacitor structure and methods of forming the...
- Patent number 12,094,868
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,068,234
- Issue date Aug 20, 2024
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero mask high density capacitor
- Patent number 12,062,652
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a capacitor
- Patent number 12,062,687
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Yang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,062,586
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mill-Jer Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid reconstituted substrate for electronic packaging
- Patent number 12,046,545
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor
- Patent number 12,034,003
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chih Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power, double-sided thin film filter
- Patent number 12,034,425
- Issue date Jul 9, 2024
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a capacitive structure of the metal-in...
- Patent number 12,021,074
- Issue date Jun 25, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Embedded precision resistor for non-planar semiconductor device arc...
- Patent number 11,973,105
- Issue date Apr 30, 2024
- Intel Corporation
- Chieh-Jen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, electronic device, and method of manufactu...
- Patent number 11,942,467
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell disturb prevention using a leaker device to reduce excess char...
- Patent number 11,937,433
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- G11 - INFORMATION STORAGE
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,929,213
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land-side silicon capacitor design and semiconductor package using...
- Patent number 11,887,976
- Issue date Jan 30, 2024
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable lateral flux capacitor design
- Patent number 11,881,462
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic assembly
- Patent number 11,869,883
- Issue date Jan 9, 2024
- Innolux Corporation
- Chandra Lius
- G02 - OPTICS
Information Patent Grant
Three-dimensional capacitor-inductor based on high functional densi...
- Patent number 11,869,827
- Issue date Jan 9, 2024
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed LC filter structure
- Patent number 11,862,834
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,862,612
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,618
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,848,290
- Issue date Dec 19, 2023
- Realtek Semiconductor Corporation
- Cheng-Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binary Ag—Cu amorphous thin-films for electronic applications
- Patent number 11,840,756
- Issue date Dec 12, 2023
- University of North Texas
- Santanu Das
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,842,993
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor capacitor array layout with dummy capacitor structure
- Patent number 11,837,597
- Issue date Dec 5, 2023
- Realtek Semiconductor Corporation
- Shih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming integrated inductor-capacitor oscillators an...
- Patent number 11,804,803
- Issue date Oct 31, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379646
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20240379650
- Publication date Nov 14, 2024
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Qichang AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick Film Single Layer Capacitor
- Publication number 20240379649
- Publication date Nov 14, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR
- Publication number 20240363680
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Yang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...
- Publication number 20240363604
- Publication date Oct 31, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zero Mask High Density Capacitor
- Publication number 20240363614
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL THIN FILM RESISTOR
- Publication number 20240339448
- Publication date Oct 10, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hung-Chih YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20240332277
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Hisashi Sugie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20240321850
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Yusuke IMAIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240321858
- Publication date Sep 26, 2024
- Vanguard International Semiconductor Corporation
- Cheng-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER ARRANGEMENT
- Publication number 20240312975
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-IN...
- Publication number 20240312977
- Publication date Sep 19, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...
- Publication number 20240297165
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Changhan Hobie YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT MODULE
- Publication number 20240297112
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL STRUCTURE
- Publication number 20240274653
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR
- Publication number 20240234296
- Publication date Jul 11, 2024
- KEY FOUNDRY CO., LTD.
- Jong Yeul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER CHIP
- Publication number 20240222353
- Publication date Jul 4, 2024
- Rohm Co., Ltd.
- Toru HIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE BASED LOW-POWER, TEMPERATURE DEPENDENT, THIN-OXIDE ONL...
- Publication number 20240222354
- Publication date Jul 4, 2024
- Xilinx, Inc.
- Narendra Kumar PULIPATI
- G05 - CONTROLLING REGULATING
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIFUSE DEVICES AND METHODS OF MAKING THEREOF
- Publication number 20240203873
- Publication date Jun 20, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- SHU HUI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND APPARATUS
- Publication number 20240203972
- Publication date Jun 20, 2024
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...
- Publication number 20240194663
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- I-SHENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240194662
- Publication date Jun 13, 2024
- Mitsubishi Electric Corporation
- Toshihiro IMASAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP
- Publication number 20240186310
- Publication date Jun 6, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP
- Publication number 20240186309
- Publication date Jun 6, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PROVIDING GALVANIC ISOLATION AND DEVICE INCLUDIN...
- Publication number 20240170476
- Publication date May 23, 2024
- WELLANG CO., LTD.
- Jong Tae HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240146277
- Publication date May 2, 2024
- TDK Corporation
- Toshiyuki TAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR
- Publication number 20240136276
- Publication date Apr 25, 2024
- KEY FOUNDRY CO., LTD.
- Jong Yeul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE
- Publication number 20240113096
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS

comprising only passive thin-film or thick-film elements formed on a common insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

On-chip electrostatic discharge sensor

Shielded deep trench capacitor structure and methods of forming the...

Semiconductor structure

Zero mask high density capacitor

Semiconductor device including a capacitor

Semiconductor device structure with magnetic element

Hybrid reconstituted substrate for electronic packaging

Thin film resistor

High power, double-sided thin film filter

Integrated circuit including a capacitive structure of the metal-in...

LED with internally confined current injection area

Embedded precision resistor for non-planar semiconductor device arc...

Metal-insulator-metal structure

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor structure, electronic device, and method of manufactu...

Cell disturb prevention using a leaker device to reduce excess char...

Parallel-connected trench capacitor structure with multiple electro...

Multilayer power, converter with devices having reduced lateral cur...

Land-side silicon capacitor design and semiconductor package using...

Reliable lateral flux capacitor design

Flexible electronic assembly

Three-dimensional capacitor-inductor based on high functional densi...

Distributed LC filter structure

3D trench capacitor for integrated passive devices

Semiconductor package

Semiconductor structure

Binary Ag—Cu amorphous thin-films for electronic applications

Semiconductor device with multiple polarity groups

Semiconductor capacitor array layout with dummy capacitor structure

Techniques for forming integrated inductor-capacitor oscillators an...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

FILTER AND MANUFACTURING METHOD THEREFOR

Thick Film Single Layer Capacitor

SEMICONDUCTOR DEVICE INCLUDING A CAPACITOR

MULTILAYER POWER, CONVERTER WITH DEVICES HAVING REDUCED LATERAL CUR...

Zero Mask High Density Capacitor

NOVEL THIN FILM RESISTOR

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT

ISOLATOR

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

TRANSFORMER ARRANGEMENT

INTEGRATED CIRCUIT INCLUDING A CAPACITIVE STRUCTURE OF THE METAL-IN...

DOUBLE-SIDED REDISTRIBUTION LAYER (RDL) SUBSTRATE WITH DOUBLE-SIDED...

PASSIVE COMPONENT MODULE

METAL-INSULATOR-METAL STRUCTURE

SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR

TRANSFORMER CHIP

HIGH-VOLTAGE BASED LOW-POWER, TEMPERATURE DEPENDENT, THIN-OXIDE ONL...

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

ANTIFUSE DEVICES AND METHODS OF MAKING THEREOF

ELECTRONIC COMPONENT AND APPARATUS

SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTU...

TRANSFORMER DEVICE AND SEMICONDUCTOR DEVICE

SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP

SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP

INTEGRATED CIRCUIT PROVIDING GALVANIC ISOLATION AND DEVICE INCLUDIN...

MULTILAYER ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR

DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE