comprising only passive thin-film or thick-film elements formed on a common insulating substrate

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H01L27/01

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/01comprising only passive thin-film or thick-film elements formed on a common insulating substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal structure
- Patent number 11,961,880
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,955,292
- Issue date Apr 9, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, electronic device, and method of manufactu...
- Patent number 11,942,467
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell disturb prevention using a leaker device to reduce excess char...
- Patent number 11,937,433
- Issue date Mar 19, 2024
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- G11 - INFORMATION STORAGE
Information Patent Grant
Parallel-connected trench capacitor structure with multiple electro...
- Patent number 11,929,213
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land-side silicon capacitor design and semiconductor package using...
- Patent number 11,887,976
- Issue date Jan 30, 2024
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable lateral flux capacitor design
- Patent number 11,881,462
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic assembly
- Patent number 11,869,883
- Issue date Jan 9, 2024
- Innolux Corporation
- Chandra Lius
- G02 - OPTICS
Information Patent Grant
Three-dimensional capacitor-inductor based on high functional densi...
- Patent number 11,869,827
- Issue date Jan 9, 2024
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed LC filter structure
- Patent number 11,862,834
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 11,862,612
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,618
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,848,290
- Issue date Dec 19, 2023
- Realtek Semiconductor Corporation
- Cheng-Wei Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binary Ag—Cu amorphous thin-films for electronic applications
- Patent number 11,840,756
- Issue date Dec 12, 2023
- University of North Texas
- Santanu Das
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with multiple polarity groups
- Patent number 11,842,993
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Cheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor capacitor array layout with dummy capacitor structure
- Patent number 11,837,597
- Issue date Dec 5, 2023
- Realtek Semiconductor Corporation
- Shih-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming integrated inductor-capacitor oscillators an...
- Patent number 11,804,803
- Issue date Oct 31, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 11,776,947
- Issue date Oct 3, 2023
- TDK Corporation
- Yusuke Oba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing cross-wafer variability for minimum width resistors
- Patent number 11,764,111
- Issue date Sep 19, 2023
- Texas Instruments Incorporated
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 11,756,955
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In situ package integrated thin film capacitors for power delivery
- Patent number 11,756,948
- Issue date Sep 12, 2023
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a multi-capacitor integrated pas...
- Patent number 11,749,661
- Issue date Sep 5, 2023
- QUALCOMM Incorporated
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, capacitor device and manufacture method of ca...
- Patent number 11,749,669
- Issue date Sep 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Cheng-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a capacitor
- Patent number 11,728,374
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hong-Yang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated ultralong time constant time measurement device and fabr...
- Patent number 11,721,646
- Issue date Aug 8, 2023
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,699,646
- Issue date Jul 11, 2023
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thin film capacitors on a glass core substrate
- Patent number 11,688,729
- Issue date Jun 27, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 11,688,762
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR
- Publication number 20240136276
- Publication date Apr 25, 2024
- KEY FOUNDRY CO., LTD.
- Jong Yeul JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE
- Publication number 20240113096
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structures And Methods Of Forming The Same
- Publication number 20240105707
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD
- Publication number 20240105760
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY
- Publication number 20240105708
- Publication date Mar 28, 2024
- InnoLux Corporation
- CHANDRA LIUS
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES
- Publication number 20240088103
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088118
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Manho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE AND INSULATED MODULE
- Publication number 20240072031
- Publication date Feb 29, 2024
- ROHM CO., LTD.
- Koji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...
- Publication number 20240038753
- Publication date Feb 1, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TYPE ELECTRONIC COMPONENT
- Publication number 20240038754
- Publication date Feb 1, 2024
- TDK Corporation
- Yukio MITAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CHIP RESISTOR-CAPACITOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240029960
- Publication date Jan 25, 2024
- Yageo Corporation
- Shen-Li HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20240021439
- Publication date Jan 18, 2024
- TOPPAN INC.
- Tomoyuki ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION TRANSFORMER
- Publication number 20240021599
- Publication date Jan 18, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION TRANSFORMER
- Publication number 20240021598
- Publication date Jan 18, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING TRANSFORMER
- Publication number 20240014201
- Publication date Jan 11, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES IN RC-NETWORK COMPONENTS
- Publication number 20240006404
- Publication date Jan 4, 2024
- Murata Manufacturing Co., Ltd.
- Yohei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE BASED INTEGRATED PASSIVE DEVICES FOR IMPEDENCE MATC...
- Publication number 20230420439
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230411288
- Publication date Dec 21, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Atsuya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402443
- Publication date Dec 14, 2023
- RENESAS ELECTRONICS CORPORATION
- Yoshihiro MASUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING MIM CAPACITOR AND RESISTOR
- Publication number 20230395595
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hsiang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT, THREE-DIMENSIONAL DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20230395312
- Publication date Dec 7, 2023
- Murata Manufacturing Co., Ltd.
- Yoshimasa YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION MODULE AND GATE DRIVER
- Publication number 20230395454
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING CROSS-WAFER VARIABILITY FOR MINIMUM WIDTH RESISTORS
- Publication number 20230386923
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam Nandakumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230387185
- Publication date Nov 30, 2023
- ROHM CO., LTD.
- Masahiko ARIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20230378154
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20230369307
- Publication date Nov 16, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

comprising only passive thin-film or thick-film elements formed on a common insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal-insulator-metal structure

Parallel-connected trench capacitor structure with multiple electro...

Semiconductor structure, electronic device, and method of manufactu...

Cell disturb prevention using a leaker device to reduce excess char...

Parallel-connected trench capacitor structure with multiple electro...

Multilayer power, converter with devices having reduced lateral cur...

Land-side silicon capacitor design and semiconductor package using...

Reliable lateral flux capacitor design

Flexible electronic assembly

Three-dimensional capacitor-inductor based on high functional densi...

Distributed LC filter structure

3D trench capacitor for integrated passive devices

Semiconductor package

Semiconductor structure

Binary Ag—Cu amorphous thin-films for electronic applications

Semiconductor device with multiple polarity groups

Semiconductor capacitor array layout with dummy capacitor structure

Techniques for forming integrated inductor-capacitor oscillators an...

Electronic component and manufacturing method therefor

Reducing cross-wafer variability for minimum width resistors

Device including MIM capacitor and resistor

In situ package integrated thin film capacitors for power delivery

Package comprising a substrate and a multi-capacitor integrated pas...

Semiconductor device, capacitor device and manufacture method of ca...

Selective deposition of embedded thin-film resistors for semiconduc...

Semiconductor device including a capacitor

Integrated ultralong time constant time measurement device and fabr...

Semiconductor structure

Integrated thin film capacitors on a glass core substrate

Low warpage high density trench capacitor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING HIGH BREAKDOWN VOLTAGE CAPACITOR

DIELECTRIC FILMS OVER ELECTRODE FOR HIGH VOLTAGE PERFORMANCE

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

GALVANIC ISOLATION DEVICE

Semiconductor Structures And Methods Of Forming The Same

INDUCTIVE DEVICE STRUCTURE AND PROCESS METHOD

FLEXIBLE ELECTRONIC ASSEMBLY

3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES

SEMICONDUCTOR PACKAGE

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

SIGNAL TRANSMISSION DEVICE AND INSULATED MODULE

Packages with Chips Comprising Inductor-Vias and Methods Forming th...

DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL R...

CHIP-TYPE ELECTRONIC COMPONENT

THIN-FILM CHIP RESISTOR-CAPACITOR AND METHOD OF FABRICATING THE SAME

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

ISOLATION TRANSFORMER

ISOLATION TRANSFORMER

INSULATING TRANSFORMER

CONTACT STRUCTURES IN RC-NETWORK COMPONENTS

SILICON CARBIDE BASED INTEGRATED PASSIVE DEVICES FOR IMPEDENCE MATC...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

PASSIVE COMPONENT, THREE-DIMENSIONAL DEVICE, AND METHOD FOR MANUFAC...

INSULATION MODULE AND GATE DRIVER

REDUCING CROSS-WAFER VARIABILITY FOR MINIMUM WIDTH RESISTORS

SEMICONDUCTOR DEVICE

SHIELDED DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMING THE...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...