Concave hole or via

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CPC
H05K2201/09863

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09863Concave hole or via

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 11,589,457
- Issue date Feb 21, 2023
- Kyocera Corporation
- Seiichirou Itou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having through via and method of fabricating the same
- Patent number 11,406,022
- Issue date Aug 2, 2022
- Industrial Technology Research Institute
- Chih-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card and electronic apparatus including the same
- Patent number 10,903,592
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- Seung-wan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card and electronic apparatus including the same
- Patent number 10,374,342
- Issue date Aug 6, 2019
- Samsung Electronics Co., Ltd.
- Seung-wan Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 10,165,691
- Issue date Dec 25, 2018
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 10,076,044
- Issue date Sep 11, 2018
- Hitachi Chemical Company, Ltd.
- Nobuyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive micromachined ultrasonic transducer (CMUT) forming
- Patent number 9,937,528
- Issue date Apr 10, 2018
- Texas Instruments Incorporated
- Peter B Johnson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Base substrate which prevents burrs generated during the cutting pr...
- Patent number 9,913,381
- Issue date Mar 6, 2018
- Point Engineering Co., Ltd.
- Bum Mo Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and mounting structure using same
- Patent number 9,877,387
- Issue date Jan 23, 2018
- KYOCERA Corporation
- Satoshi Kajita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate, manufacturing method for the same, and componen...
- Patent number 9,814,139
- Issue date Nov 7, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,603,248
- Issue date Mar 21, 2017
- Ibiden Co., Ltd.
- Teruyoshi Hisada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,532,452
- Issue date Dec 27, 2016
- LG Innotek Co., Ltd
- Jeong Won Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,451,711
- Issue date Sep 20, 2016
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for multi-layered board
- Patent number 9,318,820
- Issue date Apr 19, 2016
- Molex, LLC
- Toshihiro Niitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,431,832
- Issue date Apr 30, 2013
- Kyocera Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect substrate, method of manufacturing interconnect substr...
- Patent number 8,367,939
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Kiminori Ishido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a multilayer printed wiring board having a bulged...
- Patent number 8,181,341
- Issue date May 22, 2012
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and manufacturing method thereof
- Patent number 8,148,643
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 7,973,249
- Issue date Jul 5, 2011
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing same, and semiconductor package
- Patent number 7,838,779
- Issue date Nov 23, 2010
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayered printed circuit board
- Patent number 7,832,098
- Issue date Nov 16, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 7,759,582
- Issue date Jul 20, 2010
- Ibiden Co., Ltd.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing wiring board, and liquid ejec...
- Patent number 7,630,207
- Issue date Dec 8, 2009
- FUJIFILM Corporation
- Toshiya Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board having a previously...
- Patent number 7,552,531
- Issue date Jun 30, 2009
- Ibiden Co., Ltd.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayered circuit board
- Patent number 7,415,761
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a plated microvia interconnect
- Patent number 7,328,506
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board, base for multilayer wiring board, printed...
- Patent number 7,312,400
- Issue date Dec 25, 2007
- Fujikura Ltd.
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 7,188,412
- Issue date Mar 13, 2007
- Denso Corporation
- Yoshitarou Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cost-reducing and process-simplifying wiring board and manufacturin...
- Patent number 6,998,291
- Issue date Feb 14, 2006
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed wiring board
- Patent number 6,972,070
- Issue date Dec 6, 2005
- Denso Corporation
- Yoshitaro Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240074062
- Publication date Feb 29, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Hsin-Fa HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20210127486
- Publication date Apr 29, 2021
- KYOCERA CORPORATION
- Seiichirou ITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY CARD AND ELECTRONIC APPARATUS INCLUDING THE SAME
- Publication number 20190305453
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Seung-wan KOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY CARD AND ELECTRONIC APPARATUS INCLUDING THE SAME
- Publication number 20190207334
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Seung-wan KOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB connector
- Publication number 20140315398
- Publication date Oct 23, 2014
- Knuerr GmbH
- Josef FEIGL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR FOR MULTI-LAYERED BOARD
- Publication number 20140295697
- Publication date Oct 2, 2014
- Molex Incorporated
- Toshihiro NIITSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140216794
- Publication date Aug 7, 2014
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140041923
- Publication date Feb 13, 2014
- IBIDEN CO., LTD.
- Teruyoshi HISADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20110114372
- Publication date May 19, 2011
- IBIDEN CO., LTD.
- Hisashi KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20110051386
- Publication date Mar 3, 2011
- KYOCERA CORPORATION
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Printed Wiring Board
- Publication number 20100155130
- Publication date Jun 24, 2010
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect substrate, method of manufacturing interconnect substr...
- Publication number 20100139963
- Publication date Jun 10, 2010
- NEC Electronics Corporation
- Kiminori Ishido
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20090255111
- Publication date Oct 15, 2009
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080189943
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080173473
- Publication date Jul 24, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT
- Publication number 20080017410
- Publication date Jan 24, 2008
- Miguel A. Jimarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board
- Publication number 20070154741
- Publication date Jul 5, 2007
- IBIDEN CO., LTD.
- Michimasa Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical circuit pattern design by injection mold
- Publication number 20070146974
- Publication date Jun 28, 2007
- Cleopatra Cabuz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method of manufacturing wiring board, and liquid ejec...
- Publication number 20070097154
- Publication date May 3, 2007
- Fuji Photo Film Co., Ltd.
- Toshiya Kojima
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Wiring board, method for manufacturing same, and semiconductor package
- Publication number 20060283625
- Publication date Dec 21, 2006
- NEC Corporation
- Shintaro Yamamichi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board, base for multilayer wiring board, printed...
- Publication number 20050155792
- Publication date Jul 21, 2005
- FUJIKURA LTD.
- Shoji Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cost-reducing and process-simplifying wiring board and manufacturin...
- Publication number 20040266060
- Publication date Dec 30, 2004
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board
- Publication number 20040066633
- Publication date Apr 8, 2004
- Yoshitarou Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a printed wiring board
- Publication number 20040052932
- Publication date Mar 18, 2004
- Yoshitaro Yazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20040025333
- Publication date Feb 12, 2004
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a double-sided wiring board
- Publication number 20030188429
- Publication date Oct 9, 2003
- International Business Machines Corporation
- Takayuki Haze
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method for manufacturing same
- Publication number 20030188888
- Publication date Oct 9, 2003
- Hirokazu Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP FABRICATION PROCESS
- Publication number 20030166331
- Publication date Sep 4, 2003
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method of manufacturing the same
- Publication number 20030150644
- Publication date Aug 14, 2003
- IBIDEN CO., LTD.
- Masaru Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Concave hole or via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Substrate having through via and method of fabricating the same

Memory card and electronic apparatus including the same

Memory card and electronic apparatus including the same

Method for manufacturing multilayer wiring substrate

Method for manufacturing multilayer wiring substrate

Capacitive micromachined ultrasonic transducer (CMUT) forming

Base substrate which prevents burrs generated during the cutting pr...

Wiring board and mounting structure using same

Mounting substrate, manufacturing method for the same, and componen...

Wiring board and method for manufacturing the same

Printed circuit board

Printed wiring board and method for manufacturing printed wiring board

Connector for multi-layered board

Circuit board, mounting structure, and method for manufacturing cir...

Interconnect substrate, method of manufacturing interconnect substr...

Method of forming a multilayer printed wiring board having a bulged...

Multilayered printed circuit board and manufacturing method thereof

Multilayer printed wiring board

Wiring board, method for manufacturing same, and semiconductor package

Method of manufacturing a multilayered printed circuit board

Multilayer printed wiring board

Wiring board, method of manufacturing wiring board, and liquid ejec...

Method of manufacturing a printed wiring board having a previously...

Method of manufacturing multilayered circuit board

Method for forming a plated microvia interconnect

Multilayer wiring board, base for multilayer wiring board, printed...

Method for manufacturing printed wiring board

Cost-reducing and process-simplifying wiring board and manufacturin...

Method of manufacturing a printed wiring board

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

WIRING BOARD

MEMORY CARD AND ELECTRONIC APPARATUS INCLUDING THE SAME

MEMORY CARD AND ELECTRONIC APPARATUS INCLUDING THE SAME

PCB connector

CONNECTOR FOR MULTI-LAYERED BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

Multilayer Printed Wiring Board

Interconnect substrate, method of manufacturing interconnect substr...

MULTILAYER PRINTED WIRING BOARD

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

Multilayer printed wiring board

Electrical circuit pattern design by injection mold

Wiring board, method of manufacturing wiring board, and liquid ejec...

Wiring board, method for manufacturing same, and semiconductor package

Multilayer wiring board, base for multilayer wiring board, printed...

Cost-reducing and process-simplifying wiring board and manufacturin...

Method for manufacturing printed wiring board

Method of manufacturing a printed wiring board

Multilayered printed circuit board and manufacturing method therefor

Method for producing a double-sided wiring board

Multilayer printed wiring board and method for manufacturing same

BUMP FABRICATION PROCESS

Printed wiring board and method of manufacturing the same