Conductive particles having an insulating coating

Industry

CPC
H05K2201/0224

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0224Conductive particles having an insulating coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stable PCB for solid state light source application
- Patent number 11,882,651
- Issue date Jan 23, 2024
- SIGNIFY HOLDING B.V.
- Rifat Ata Mustafa Hikmet
- F21 - LIGHTING
Information Patent Grant
Barrier layer
- Patent number 11,612,062
- Issue date Mar 21, 2023
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ink for screen printing
- Patent number 11,597,851
- Issue date Mar 7, 2023
- Daicel Corporation
- Tsugio Watanabe
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Photosensitive resin composition, method of producing electrically...
- Patent number 11,422,464
- Issue date Aug 23, 2022
- Toray Industries, Inc.
- Yohei Konoshima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electrically conductive adhesive film, ele...
- Patent number 11,248,148
- Issue date Feb 15, 2022
- Dexerials Corporation
- Yasushi Akutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Metallic pigment particles
- Patent number 11,236,248
- Issue date Feb 1, 2022
- HP INDIGO B.V.
- Olga Kagan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing electrically conductive adhesive film, ele...
- Patent number 11,139,629
- Issue date Oct 5, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing dispersion liquid containing silver nanopartic...
- Patent number 11,091,663
- Issue date Aug 17, 2021
- Daicel Corporation
- Kazuki Okamoto
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Barrier layer
- Patent number 11,058,011
- Issue date Jul 6, 2021
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electrically conductive adhesive film, ele...
- Patent number 10,501,661
- Issue date Dec 10, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive patterns and methods of using them
- Patent number 10,462,908
- Issue date Oct 29, 2019
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor unit
- Patent number 10,355,372
- Issue date Jul 16, 2019
- Yazaki Corporation
- Hayato Iizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical wiring member production method, electrical wiring membe...
- Patent number 10,299,376
- Issue date May 21, 2019
- Seiko Epson Corporation
- Hidefumi Nakamura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Prepreg, metal-clad laminated plate and printed wiring board
- Patent number 9,894,761
- Issue date Feb 13, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Hoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, metal foil-clad laminate and printed wi...
- Patent number 9,832,870
- Issue date Nov 28, 2017
- Mitsubishi Gas Chemical Company, Inc.
- Hiroaki Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electrically conductive adhesive film, ele...
- Patent number 9,816,012
- Issue date Nov 14, 2017
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite nanometal paste containing copper filler and joining method
- Patent number 9,796,052
- Issue date Oct 24, 2017
- APPLIED NANOPARTICLE LABORATORY CORPORATION
- Teruo Komatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, conductive paste, and method for manufacturin...
- Patent number 9,786,463
- Issue date Oct 10, 2017
- Hitachi, Ltd.
- Takuya Aoyagi
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed circuit boards and methods of manufacturing thereof
- Patent number 9,648,735
- Issue date May 9, 2017
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-aspect ratio conductive pattern on a su...
- Patent number 9,615,463
- Issue date Apr 4, 2017
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper metal film, method for producing same, copper metal pattern,...
- Patent number 9,457,406
- Issue date Oct 4, 2016
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
ESD protection device
- Patent number 9,413,168
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Kosuke Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and method for manufacturing the same, wiring usin...
- Patent number 9,330,807
- Issue date May 3, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Kazufumi Ogawa
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material comprising coated silver nanoparticles and bonded...
- Patent number 9,273,235
- Issue date Mar 1, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Particles and inks and films using them
- Patent number 9,217,088
- Issue date Dec 22, 2015
- Alpha Metals, Inc.
- Sachin Parashar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing electric wiring layer, member for forming e...
- Patent number 9,219,218
- Issue date Dec 22, 2015
- Seiko Epson Corporation
- Hideki Ishigami
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing silver miniwire films
- Patent number 9,040,114
- Issue date May 26, 2015
- Rohm and Haas Electronic Material LLC
- Garo Khanarian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INK FOR SCREEN PRINTING
- Publication number 20230174812
- Publication date Jun 8, 2023
- Daicel Corporation
- Tsugio WATANABE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Barrier Layer
- Publication number 20220022325
- Publication date Jan 20, 2022
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME
- Publication number 20190185684
- Publication date Jun 20, 2019
- YAZAKI CORPORATION
- Maki YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INK FOR SCREEN PRINTING
- Publication number 20190119519
- Publication date Apr 25, 2019
- DAICEL CORPORATION
- Tsugio WATANABE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20180287273
- Publication date Oct 4, 2018
- DEXERIALS CORPORATION
- Hiromi KUBODE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTOR UNIT
- Publication number 20180261930
- Publication date Sep 13, 2018
- Yazaki Corporation
- Hayato Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELE...
- Publication number 20180044558
- Publication date Feb 15, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING ELECTRIC WIRING LAYER, MEMBER FOR FORMING E...
- Publication number 20150188024
- Publication date Jul 2, 2015
- SEIKO EPSON CORPORATION
- Hideki ISHIGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WI...
- Publication number 20150181707
- Publication date Jun 25, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Hiroaki Kobayashi
- B32 - LAYERED PRODUCTS
Information Patent Application
PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE
- Publication number 20140287158
- Publication date Sep 25, 2014
- Intrinsiq Materials, Inc.
- Janet Heyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME
- Publication number 20140113109
- Publication date Apr 24, 2014
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING THE SAME, WIRING USIN...
- Publication number 20140077137
- Publication date Mar 20, 2014
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Kazufumi OGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of Manufacturing Silver Miniwire Films
- Publication number 20140065300
- Publication date Mar 6, 2014
- Garo Khanarian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130292168
- Publication date Nov 7, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE SINTERED LAYER FORMING COMPOSITION
- Publication number 20130119322
- Publication date May 16, 2013
- Hitachi Ltd.
- Eiichi Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE CIRCUIT
- Publication number 20130092423
- Publication date Apr 18, 2013
- Yoshitaka HAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...
- Publication number 20130081759
- Publication date Apr 4, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Application
Interconnect Schemes, and Materials and Methods for Producing the Same
- Publication number 20130021758
- Publication date Jan 24, 2013
- Jonathan J. Bernstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCTING ELECTRONIC CIRCUIT BOARDS USING ELECTROPHOTOGR...
- Publication number 20130004892
- Publication date Jan 3, 2013
- Thomas N. Tombs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURIN...
- Publication number 20120318559
- Publication date Dec 20, 2012
- Hitachi Chemical Company, Ltd.
- Takuya Aoyagi
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
DIELECTRIC PROTECTIVE LAYER FOR A SELF-ORGANIZING MONOLAYER (SAM)
- Publication number 20120216713
- Publication date Aug 30, 2012
- Siemens Aktiengesellschaft
- Tarik Cheema
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING BONDED PARTICLE CONST...
- Publication number 20120217450
- Publication date Aug 30, 2012
- Lex Kosowsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER NANO PASTE, METHOD FOR FORMING THE COPPER NANO PASTE, AND ME...
- Publication number 20120220072
- Publication date Aug 30, 2012
- Samsung Electro-Mechanics CO., LTD.
- Dong Hoon KIM
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PROCESS FOR PRODUCTION OF CORE-SHELL PARTICLES, CORE-SHELL PARTICLE...
- Publication number 20120183775
- Publication date Jul 19, 2012
- Yoichi Shinba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...
- Publication number 20120175147
- Publication date Jul 12, 2012
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL...
- Publication number 20120138868
- Publication date Jun 7, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMP...
- Publication number 20120125670
- Publication date May 24, 2012
- Takahiko Kato
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTED ELECTRONIC CIRCUIT BOARDS AND OTHER ARTICLES HAVING PATTERN...
- Publication number 20120110843
- Publication date May 10, 2012
- Thomas N. Tombs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
- Publication number 20120104618
- Publication date May 3, 2012
- Yusuke Yasuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Conductive particles having an insulating coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stable PCB for solid state light source application

Barrier layer

Ink for screen printing

Photosensitive resin composition, method of producing electrically...

Multi-layer circuit board with traces thicker than a circuit board

Method for manufacturing electrically conductive adhesive film, ele...

Metallic pigment particles

Method for manufacturing electrically conductive adhesive film, ele...

Method for producing dispersion liquid containing silver nanopartic...

Barrier layer

Multi-layer circuit board with traces thicker than a circuit board...

Method for manufacturing electrically conductive adhesive film, ele...

Conductive patterns and methods of using them

Conductor unit

Electrical wiring member production method, electrical wiring membe...

Prepreg, metal-clad laminated plate and printed wiring board

Resin composition, prepreg, metal foil-clad laminate and printed wi...

Method for manufacturing electrically conductive adhesive film, ele...

Composite nanometal paste containing copper filler and joining method

Electronic component, conductive paste, and method for manufacturin...

Printed circuit boards and methods of manufacturing thereof

Method for producing a high-aspect ratio conductive pattern on a su...

Copper metal film, method for producing same, copper metal pattern,...

ESD protection device

Conductive paste and method for manufacturing the same, wiring usin...

Circuit board

Bonding material comprising coated silver nanoparticles and bonded...

Particles and inks and films using them

Method of manufacturing electric wiring layer, member for forming e...

Method of manufacturing silver miniwire films

Patents Applicationslast 30 patents

INK FOR SCREEN PRINTING

Barrier Layer

ELECTRICALLY CONDUCTIVE PASTE AND WIRING BOARD USING THE SAME

INK FOR SCREEN PRINTING

ANISOTROPIC CONDUCTIVE FILM AND CONNECTION STRUCTURE

CONDUCTOR UNIT

METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELE...

METHOD OF MANUFACTURING ELECTRIC WIRING LAYER, MEMBER FOR FORMING E...

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WI...

PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE

BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME

CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING THE SAME, WIRING USIN...

Method of Manufacturing Silver Miniwire Films

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

CONDUCTIVE SINTERED LAYER FORMING COMPOSITION

METHOD FOR FORMING CONDUCTIVE CIRCUIT

LOW-TEMPERATURE-SINTERABLE BONDING MATERIAL, AND BONDING METHOD USI...

Interconnect Schemes, and Materials and Methods for Producing the Same

METHOD OF PRODUCTING ELECTRONIC CIRCUIT BOARDS USING ELECTROPHOTOGR...

ELECTRONIC COMPONENT, CONDUCTIVE PASTE, AND METHOD FOR MANUFACTURIN...

DIELECTRIC PROTECTIVE LAYER FOR A SELF-ORGANIZING MONOLAYER (SAM)

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL HAVING BONDED PARTICLE CONST...

COPPER NANO PASTE, METHOD FOR FORMING THE COPPER NANO PASTE, AND ME...

PROCESS FOR PRODUCTION OF CORE-SHELL PARTICLES, CORE-SHELL PARTICLE...

COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN,...

CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL...

Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMP...

PRINTED ELECTRONIC CIRCUIT BOARDS AND OTHER ARTICLES HAVING PATTERN...

LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD