Conductive planes

Industry

CPC
H05K2201/0929

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0929Conductive planes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and probe card
- Patent number 12,114,423
- Issue date Oct 8, 2024
- Kyocera Corporation
- Youichiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit with laminated magnetic core inductor and magnet...
- Patent number 12,048,097
- Issue date Jul 23, 2024
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing laminated magnetic core inductor with insul...
- Patent number 11,903,130
- Issue date Feb 13, 2024
- Ferric Inc.
- Noah Sturcken
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated switched inductor power converter having first and secon...
- Patent number 11,197,374
- Issue date Dec 7, 2021
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated magnetic core inductor with magnetic flux closure path pa...
- Patent number 11,116,081
- Issue date Sep 7, 2021
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parking management system
- Patent number 11,071,204
- Issue date Jul 20, 2021
- Exposure Illumination Architects, Inc.
- Daniel S. Spiro
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Laminated magnetic core inductor with insulating and interface layers
- Patent number 11,064,610
- Issue date Jul 13, 2021
- Ferric Inc.
- Noah Sturcken
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Integrated circuit with laminated magnetic core inductor and magnet...
- Patent number 11,058,001
- Issue date Jul 6, 2021
- Ferric Inc.
- Noah Sturcken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package level power gating
- Patent number 10,957,651
- Issue date Mar 23, 2021
- NVIDIA Corp.
- Don Templeton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with laminated magnetic core inductor including...
- Patent number 10,893,609
- Issue date Jan 12, 2021
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an intermediate device structure
- Patent number 10,653,014
- Issue date May 12, 2020
- Daniel S. Spiro
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a flexible circuit board incorporating sun...
- Patent number 10,531,578
- Issue date Jan 7, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated switched inductor power converter
- Patent number 10,244,633
- Issue date Mar 26, 2019
- Ferric Inc.
- Noah Sturcken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and multiple substrate, and method for producing thereof
- Patent number 10,206,279
- Issue date Feb 12, 2019
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation structures using partially meshed ground pl...
- Patent number 10,158,339
- Issue date Dec 18, 2018
- Intel Corporation
- Jackson Chung Peng Kong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antimicrobial copper sheet overlays and related methods for making...
- Patent number 10,064,273
- Issue date Aug 28, 2018
- MR Label Company
- Patrick H. Meehan
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Method of manufacturing a processor
- Patent number 10,028,385
- Issue date Jul 17, 2018
- Ferric, Inc.
- Noah Andrew Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing conductive layer and wiring board
- Patent number 10,015,890
- Issue date Jul 3, 2018
- Fujikura Ltd.
- Masahiro Kaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D EMI suppression structure and electronic device having the same
- Patent number 9,967,968
- Issue date May 8, 2018
- SK Hynix Inc.
- Kuo Ying Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuitry assembly and method for manufacturing the same
- Patent number 9,844,146
- Issue date Dec 12, 2017
- Flextronics Automotive GmbH & Co. KG
- Peter Lutz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic core inductor integrated with multilevel wiring network
- Patent number 9,844,141
- Issue date Dec 12, 2017
- Ferric, Inc.
- Noah Andrew Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrates having radial cut metallic planes
- Patent number 9,818,682
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making magnetic core inductor integrated with multilevel...
- Patent number 9,357,650
- Issue date May 31, 2016
- Ferric Inc.
- Noah Andrew Sturcken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic core inductor integrated with multilevel wiring network
- Patent number 9,357,651
- Issue date May 31, 2016
- Ferric Inc.
- Noah Andrew Sturcken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor circuit board, semiconductor device using the same, a...
- Patent number 9,277,639
- Issue date Mar 1, 2016
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Air transport unit
- Publication number 20230147184
- Publication date May 11, 2023
- LED iBond International A/S
- Lars FREDERIKSEN
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
CIRCUIT BOARD AND PROBE CARD
- Publication number 20230076558
- Publication date Mar 9, 2023
- KYOCERA CORPORATION
- Youichiro HONDA
- G01 - MEASURING TESTING
Information Patent Application
INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLU...
- Publication number 20230034551
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Wooram KI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220361325
- Publication date Nov 10, 2022
- Itabashi Seiki Co., Ltd.
- Tetsuya TADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PARKING MANAGEMENT SYSTEM
- Publication number 20200236787
- Publication date Jul 23, 2020
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD INCORPORATING SUNKEN RESISTOR AND METHOD FOR...
- Publication number 20190200464
- Publication date Jun 27, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- MEI YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20190150284
- Publication date May 16, 2019
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Core Inductor Integrated with Multilevel Wiring Network
- Publication number 20180139846
- Publication date May 17, 2018
- Ferric Inc.
- Noah Andrew Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Switched Inductor Power Converter
- Publication number 20180110123
- Publication date Apr 19, 2018
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD
- Publication number 20180027668
- Publication date Jan 25, 2018
- FUJIKURA LTD.
- Masahiro Kaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUITRY ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170332492
- Publication date Nov 16, 2017
- Flextronics Automotive GmbH & Co. KG
- Peter Lutz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate and Multiple Substrate, and Method for Producing Thereof
- Publication number 20170257945
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTIMICROBIAL COPPER SHEET OVERLAYS AND RELATED METHODS FOR MAKING...
- Publication number 20170111992
- Publication date Apr 20, 2017
- MR Label Company
- Patrick H. Meehan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ANTIMICROBIAL COPPER SHEET OVERLAYS AND RELATED METHODS FOR MAKING...
- Publication number 20170111991
- Publication date Apr 20, 2017
- MR Label Company
- Patrick H. Meehan
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Application
3D EMI SUPPRESSION STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20170064815
- Publication date Mar 2, 2017
- SK HYNIX INC.
- Kuo Ying HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20160242278
- Publication date Aug 18, 2016
- HITACHI CHEMICAL COMPANY, LTD.
- Nobuyuki YOSHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160037629
- Publication date Feb 4, 2016
- IBIDEN CO., LTD.
- Nobuya TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CIRCUIT BOARD, SEMICONDUCTOR DEVICE USING THE SAME, A...
- Publication number 20150257252
- Publication date Sep 10, 2015
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD
- Publication number 20150084167
- Publication date Mar 26, 2015
- KABUSHIKI KAISHA TOSHIBA
- Tadahiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Core Inductor Integrated with Multilevel Wiring Network
- Publication number 20150036308
- Publication date Feb 5, 2015
- Ferric Semiconductor Inc.
- Noah Andrew Stucken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Magnetic Core Inductor Integrated with Multilevel Wiring Network
- Publication number 20140068932
- Publication date Mar 13, 2014
- FERRIC SEMICONDUCTOR, INC.
- Noah Andrew Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Core Inductor Integrated with Multilevel Wiring Network
- Publication number 20140071636
- Publication date Mar 13, 2014
- FERRIC SEMICONDUCTOR, INC.
- Noah Andrew Sturcken
- H01 - BASIC ELECTRIC ELEMENTS

Conductive planes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and probe card

Integrated circuit with laminated magnetic core inductor and magnet...

Method of manufacturing laminated magnetic core inductor with insul...

Integrated switched inductor power converter having first and secon...

Laminated magnetic core inductor with magnetic flux closure path pa...

Parking management system

Laminated magnetic core inductor with insulating and interface layers

Integrated circuit with laminated magnetic core inductor and magnet...

Package level power gating

Integrated circuit with laminated magnetic core inductor including...

Systems and methods for an intermediate device structure

Method for manufacturing a flexible circuit board incorporating sun...

Integrated switched inductor power converter

Substrate and multiple substrate, and method for producing thereof

Capacitive compensation structures using partially meshed ground pl...

Antimicrobial copper sheet overlays and related methods for making...

Method of manufacturing a processor

Method of manufacturing conductive layer and wiring board

3D EMI suppression structure and electronic device having the same

Electrical circuitry assembly and method for manufacturing the same

Magnetic core inductor integrated with multilevel wiring network

Laminate substrates having radial cut metallic planes

Method of making magnetic core inductor integrated with multilevel...

Magnetic core inductor integrated with multilevel wiring network

Semiconductor circuit board, semiconductor device using the same, a...

Patents Applicationslast 30 patents

Air transport unit

CIRCUIT BOARD AND PROBE CARD

INSULATING MEMBER ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLU...

PRINTED CIRCUIT BOARD

PARKING MANAGEMENT SYSTEM

FLEXIBLE CIRCUIT BOARD INCORPORATING SUNKEN RESISTOR AND METHOD FOR...

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

Magnetic Core Inductor Integrated with Multilevel Wiring Network

Integrated Switched Inductor Power Converter

METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD

ELECTRICAL CIRCUITRY ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

Substrate and Multiple Substrate, and Method for Producing Thereof

ANTIMICROBIAL COPPER SHEET OVERLAYS AND RELATED METHODS FOR MAKING...

ANTIMICROBIAL COPPER SHEET OVERLAYS AND RELATED METHODS FOR MAKING...

3D EMI SUPPRESSION STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD

SEMICONDUCTOR CIRCUIT BOARD, SEMICONDUCTOR DEVICE USING THE SAME, A...

EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD

Magnetic Core Inductor Integrated with Multilevel Wiring Network

Magnetic Core Inductor Integrated with Multilevel Wiring Network

Magnetic Core Inductor Integrated with Multilevel Wiring Network