Conductor shape

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CPC
H05K2201/0364

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0364Conductor shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing belt of wearable device, method for manufacturing the same,...
- Patent number 11,968,788
- Issue date Apr 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Quan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding circuit board, display apparatus and electrical appliance
- Patent number 11,874,988
- Issue date Jan 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Hui Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 11,842,958
- Issue date Dec 12, 2023
- Chun-Ming Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thermal dissipation and shielding improvement using merged PCB bott...
- Patent number 11,723,143
- Issue date Aug 8, 2023
- Avago Technologies International Sales Pte. Limited
- Chang Kyu Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated laminate and printed circuit board
- Patent number 11,499,233
- Issue date Nov 15, 2022
- YMT CO., LTD.
- Sung Wook Chun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive pattern
- Patent number 11,360,612
- Issue date Jun 14, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive pattern
- Patent number 10,884,555
- Issue date Jan 5, 2021
- Dongwoo Fine-Chem Co., Ltd.
- Byung Hoon Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 10,736,210
- Issue date Aug 4, 2020
- Lotes Co., Ltd.
- Chin Chi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS film for semiconductor device test socket including MEMS bump
- Patent number 10,506,714
- Issue date Dec 10, 2019
- Okins Electronics Co., Ltd.
- Jin Kook Jun
- G01 - MEASURING TESTING
Information Patent Grant
Touch panel
- Patent number 10,300,679
- Issue date May 28, 2019
- Tsinghua University
- Yuan-Hao Jin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Flexible printed circuit board, antenna, and wireless charging device
- Patent number 10,292,273
- Issue date May 14, 2019
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Masahiko Kouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support structure and manufacture method thereof
- Patent number 10,149,384
- Issue date Dec 4, 2018
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Yung-Tai Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal nanowires structure
- Patent number 10,124,561
- Issue date Nov 13, 2018
- Tsinghua University
- Yuan-Hao Jin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device wiring pattern and connections
- Patent number 10,070,528
- Issue date Sep 4, 2018
- Fuji Electric Co., Ltd.
- Hideyo Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support structure and manufacture method thereof
- Patent number 10,021,783
- Issue date Jul 10, 2018
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Yung-Tai Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch panel
- Patent number 9,987,827
- Issue date Jun 5, 2018
- Tsinghua University
- Yuan-Hao Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Transparent conductive film and method for producing transparent co...
- Patent number 9,820,380
- Issue date Nov 14, 2017
- FUJIFILM Corporation
- Kensuke Katagiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device components with surface-embedded additives and related manuf...
- Patent number 9,713,254
- Issue date Jul 18, 2017
- TPK Holding Co., Ltd
- Michael Eugene Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal nanowires film
- Patent number 9,656,912
- Issue date May 23, 2017
- Tsinghua University
- Yuan-Hao Jin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming stacked wiring
- Patent number 9,566,790
- Issue date Feb 14, 2017
- Seiko Epson Corporation
- Yoshihiko Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed wiring board manufacturing method, an...
- Patent number 9,549,473
- Issue date Jan 17, 2017
- Toyo Ink SC Holdings Co., Ltd.
- Satoshi Nishinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-free monolithic epitaxial graphene-on-diamond PWB with optica...
- Patent number 9,402,322
- Issue date Jul 26, 2016
- Lockheed Martin Corporation
- David G. Findley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device components with surface-embedded additives and related manuf...
- Patent number 9,185,798
- Issue date Nov 10, 2015
- Innova Dynamics, Inc.
- Michael Eugene Young
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Fuse and Method of Fabricating the Same
- Publication number 20240429013
- Publication date Dec 26, 2024
- LG ENERGY SOLUTION, LTD.
- Chang Bog Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389234
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS
- Publication number 20240381541
- Publication date Nov 14, 2024
- Microsoft Technology Licensing, LLC
- Jason HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...
- Publication number 20240063110
- Publication date Feb 22, 2024
- CHUN-MING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MODULE
- Publication number 20230105635
- Publication date Apr 6, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-PROFILE FASTENERS WITH SPRINGS FOR HEAT TRANSFER DEVICE LOADING
- Publication number 20230093095
- Publication date Mar 23, 2023
- Intel Corporation
- Samarth Alva
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Component Carrier With Embedded Semiconductor Component and Embedde...
- Publication number 20230055435
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes STAHR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXING BELT OF WEARABLE DEVICE, METHOD FOR MANUFACTURING THE SAME,...
- Publication number 20220338356
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YONG-QUAN YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE FOR INSERTION LOSS REDUCTION IN SIGNAL TRANS...
- Publication number 20220319865
- Publication date Oct 6, 2022
- YUAN ZE UNIVERSITY
- Cheng EN HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING CIRCUIT BOARD, DISPLAY APPARATUS AND ELECTRICAL APPLIANCE
- Publication number 20220291799
- Publication date Sep 15, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hui WEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210385949
- Publication date Dec 9, 2021
- Murata Manufacturing Co., Ltd.
- Masato NOMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20200084884
- Publication date Mar 12, 2020
- LOTES CO., LTD
- Chin Chi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SHIELDING MEMBER, METHOD FOR MANUFACTURING THE SAME AND CAMER...
- Publication number 20190170915
- Publication date Jun 6, 2019
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- SHENG-JIE DING
- G02 - OPTICS
Information Patent Application
SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF
- Publication number 20180332704
- Publication date Nov 15, 2018
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Yung-Tai SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF
- Publication number 20170332490
- Publication date Nov 16, 2017
- CHUNGHWA PRECISION TEST TECH. CO., LTD.
- Yung-Tai SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CONDUCTIVE FILM AND METHOD FOR PRODUCING TRANSPARENT CO...
- Publication number 20170171972
- Publication date Jun 15, 2017
- FUJIFILM CORPORATION
- Kensuke KATAGIRI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, ANTENNA, AND WIRELESS CHARGING DEVICE
- Publication number 20170164483
- Publication date Jun 8, 2017
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Masahiko KOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mems Film for Semiconductor Device Test Socket Including Mems Bump
- Publication number 20170027056
- Publication date Jan 26, 2017
- OKINS ELECTRONICS CO., LTD.
- Jin Kook Jun
- G01 - MEASURING TESTING
Information Patent Application
METAL NANOWIRES FILM
- Publication number 20160345434
- Publication date Nov 24, 2016
- Hon Hai Precision Industry Co., Ltd.
- YUAN-HAO JIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED WIRING BOARD MANUFACTURING METHOD, AN...
- Publication number 20160270243
- Publication date Sep 15, 2016
- TOYO INK SC HOLDINGS CO., LTD
- Satoshi NISHINOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME
- Publication number 20160234930
- Publication date Aug 11, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Chan Woo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20160219696
- Publication date Jul 28, 2016
- SAMSUNG DISPLAY CO., LTD.
- Won Il Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE DISPLAY SUBSTRATE,...
- Publication number 20160178948
- Publication date Jun 23, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- Ji Li
- G02 - OPTICS
Information Patent Application
STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160157344
- Publication date Jun 2, 2016
- Industrial Technology Research Institute
- Yu-Ming WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160037629
- Publication date Feb 4, 2016
- IBIDEN CO., LTD.
- Nobuya TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUF...
- Publication number 20160029482
- Publication date Jan 28, 2016
- INNOVA DYNAMICS, INC.
- Michael Eugene Young
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160014898
- Publication date Jan 14, 2016
- IBIDEN CO., LTD.
- Takema Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150223339
- Publication date Aug 6, 2015
- Fuji Electric Co., Ltd.
- Hideyo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE MATERIAL
- Publication number 20150146395
- Publication date May 28, 2015
- LOTES CO., LTD
- Ted Ju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD
- Publication number 20150084167
- Publication date Mar 26, 2015
- KABUSHIKI KAISHA TOSHIBA
- Tadahiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS

Conductor shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with embedded semiconductor component and embedde...

Fixing belt of wearable device, method for manufacturing the same,...

Electronic component

Bonding circuit board, display apparatus and electrical appliance

Conductive structure including copper-phosphorous alloy and a metho...

Thermal dissipation and shielding improvement using merged PCB bott...

Plated laminate and printed circuit board

Conductive pattern

Conductive pattern

Circuit board

MEMS film for semiconductor device test socket including MEMS bump

Touch panel

Flexible printed circuit board, antenna, and wireless charging device

Support structure and manufacture method thereof

Metal nanowires structure

Semiconductor device wiring pattern and connections

Support structure and manufacture method thereof

Touch panel

Transparent conductive film and method for producing transparent co...

Device components with surface-embedded additives and related manuf...

Metal nanowires film

Method of forming stacked wiring

Printed wiring board, printed wiring board manufacturing method, an...

Metal-free monolithic epitaxial graphene-on-diamond PWB with optica...

Device components with surface-embedded additives and related manuf...

Patents Applicationslast 30 patents

Fuse and Method of Fabricating the Same

CIRCUIT MODULE

MODULAR ROUTABLE CIRCUIT BOARD CONDUCTOR BLOCKS

CONDUCTIVE STRUCTURE INCLUDING COPPER-PHOSPHOROUS ALLOY AND A METHO...

MODULE

LOW-PROFILE FASTENERS WITH SPRINGS FOR HEAT TRANSFER DEVICE LOADING

Component Carrier With Embedded Semiconductor Component and Embedde...

FIXING BELT OF WEARABLE DEVICE, METHOD FOR MANUFACTURING THE SAME,...

INTERCONNECT STRUCTURE FOR INSERTION LOSS REDUCTION IN SIGNAL TRANS...

BONDING CIRCUIT BOARD, DISPLAY APPARATUS AND ELECTRICAL APPLIANCE

ELECTRONIC COMPONENT

CIRCUIT BOARD

LIGHT SHIELDING MEMBER, METHOD FOR MANUFACTURING THE SAME AND CAMER...

SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF

SUPPORT STRUCTURE AND MANUFACTURE METHOD THEREOF

TRANSPARENT CONDUCTIVE FILM AND METHOD FOR PRODUCING TRANSPARENT CO...

FLEXIBLE PRINTED CIRCUIT BOARD, ANTENNA, AND WIRELESS CHARGING DEVICE

Mems Film for Semiconductor Device Test Socket Including Mems Bump

METAL NANOWIRES FILM

PRINTED WIRING BOARD, PRINTED WIRING BOARD MANUFACTURING METHOD, AN...

STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME

ELECTRONIC DEVICE

DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE DISPLAY SUBSTRATE,...

STRUCTURE OF CONDUCTIVE LINES AND METHOD OF MANUFACTURING THE SAME

PRINTED WIRING BOARD

DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUF...

PRINTED WIRING BOARD

SEMICONDUCTOR DEVICE

ELECTRICALLY CONDUCTIVE MATERIAL

EBG STRUCTURE, SEMICONDUCTOR DEVICE, AND CIRCUIT BOARD