Conductors having a fine structure

Industry

CPC
H05K2201/0373

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0373Conductors having a fine structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,160,950
- Issue date Dec 3, 2024
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and wiring structure thereof
- Patent number 11,678,435
- Issue date Jun 13, 2023
- Innolux Corporation
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,678,440
- Issue date Jun 13, 2023
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,605,697
- Issue date Mar 14, 2023
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Method of forming a structure upon a substrate
- Patent number 11,490,526
- Issue date Nov 1, 2022
- XTPL S.A.
- Piotr Kowalczewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method therefor
- Patent number 11,464,117
- Issue date Oct 4, 2022
- LG Innotek Co., Ltd
- Hee Young Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrodeposited copper foil and electrode, and lithium-ion seconda...
- Patent number 11,362,337
- Issue date Jun 14, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electrodeposited copper foil, current collector, electrode, and lit...
- Patent number 11,283,080
- Issue date Mar 22, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device and wiring structure thereof
- Patent number 11,206,734
- Issue date Dec 21, 2021
- Roger Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip for an electronic device and manufacturing method thereof
- Patent number 11,172,569
- Issue date Nov 9, 2021
- Tai-Saw Technology Co., Ltd.
- Yu-Tung Huang
- G01 - MEASURING TESTING
Information Patent Grant
Surface treated copper foil
- Patent number 11,145,867
- Issue date Oct 12, 2021
- Chang Chun Petrochemical Co., Ltd.
- Chien-Ming Lai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip component having groove formed therein
- Patent number 10,905,015
- Issue date Jan 26, 2021
- LG Chem, Ltd.
- Ga Young Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 10,879,335
- Issue date Dec 29, 2020
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Method for manufacturing stretchable electronic device
- Patent number 10,856,425
- Issue date Dec 1, 2020
- Hyunmin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate film and electrode substrate film, and method of manufactu...
- Patent number 10,752,985
- Issue date Aug 25, 2020
- Sumitomo Metal Mining Co., Ltd.
- Hideharu Okami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stretchable conductive connection-based stretchable electronic devi...
- Patent number 10,721,824
- Issue date Jul 21, 2020
- Hyunmin Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 10,653,012
- Issue date May 12, 2020
- Gio Optoelectronics Corp.
- Chin-Tang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,510,640
- Issue date Dec 17, 2019
- Miitsubishi Electric Corporation
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ink, display substrate and fabrication method thereof, a...
- Patent number 10,442,945
- Issue date Oct 15, 2019
- BOE Technology Group Co., Ltd.
- Xujie Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Filter
- Patent number 10,312,564
- Issue date Jun 4, 2019
- Ambit Microsystems (Shanghai) Ltd.
- Ming-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced conductors
- Patent number 10,306,758
- Issue date May 28, 2019
- Atmel Corporation
- Harald Philipp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,104,775
- Issue date Oct 16, 2018
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive component and electronic device including the same
- Patent number 9,955,577
- Issue date Apr 24, 2018
- Samsung Electronics Co., Ltd.
- Youngjin Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image pickup apparatus and image pickup apparatus manufacturing method
- Patent number 9,929,201
- Issue date Mar 27, 2018
- Olympus Corporation
- Jumpei Yoneyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Buttoned soldering pad for use with fine-pitch hot bar soldering
- Patent number 9,900,982
- Issue date Feb 20, 2018
- Finisar Corporation
- Henry Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including wiring on a stretchable/contractible base
- Patent number 9,826,629
- Issue date Nov 21, 2017
- Samsung Display Co., Ltd.
- Won Il Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conducting package structure and manufacturing method thereof
- Patent number 9,807,888
- Issue date Oct 31, 2017
- Tai-Saw Technology Co., Ltd.
- Yu-Tung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp interconnect
- Patent number 9,711,879
- Issue date Jul 18, 2017
- Infinera Corporation
- John Michael Coronati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 9,655,240
- Issue date May 16, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250063653
- Publication date Feb 20, 2025
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230262885
- Publication date Aug 17, 2023
- InnoLux Corporation
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20230172021
- Publication date Jun 1, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND WIRING STRUCTURE THEREOF
- Publication number 20210385940
- Publication date Dec 9, 2021
- Roger HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A STRUCTURE UPON A SUBSTRATE
- Publication number 20210307176
- Publication date Sep 30, 2021
- XTPL S.A.
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20210118973
- Publication date Apr 22, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATED COPPER FOIL
- Publication number 20200248330
- Publication date Aug 6, 2020
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Chien-Ming LAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20200236789
- Publication date Jul 23, 2020
- LG Innotek Co., Ltd.
- Hee Young CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE CONDUCTIVE CONNECTION-BASED STRETCHABLE ELECTRONIC DEVI...
- Publication number 20200146159
- Publication date May 7, 2020
- Hyunmin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE CONDUCTIVE CONNECTION-BASED STRETCHABLE ELECTRONIC DEVI...
- Publication number 20200008307
- Publication date Jan 2, 2020
- Hyunmin CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE INK, DISPLAY SUBSTRATE AND FABRICATION METHOD THEREOF, A...
- Publication number 20190085197
- Publication date Mar 21, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Xujie Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILTER
- Publication number 20180302056
- Publication date Oct 18, 2018
- AMBIT MICROSYSTEMS (SHANGHAI) LTD.
- MING-HSIEN HSU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CONDUCTING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180027649
- Publication date Jan 25, 2018
- TAI-SAW Technology Co., Ltd.
- Yu-Tung Huang
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170309544
- Publication date Oct 26, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Hiroshi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170188456
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- Youngjin CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20160081185
- Publication date Mar 17, 2016
- Nitto Denko Corporation
- Jun ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACES
- Publication number 20140158407
- Publication date Jun 12, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140138134
- Publication date May 22, 2014
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140131068
- Publication date May 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Byeong Mun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT SURFACE ARRANGED ON A CARRIER FOR CONNECTING TO A COUNTER C...
- Publication number 20140048325
- Publication date Feb 20, 2014
- CONTINENTIAL AUTOMOTIVE GMBH
- Angelika Schingale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Arrangement and Method for Producing and Opera...
- Publication number 20140035118
- Publication date Feb 6, 2014
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20130319743
- Publication date Dec 5, 2013
- Nitto Denko Corporation
- Jun ISHII
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FABRICATING OF CIRCUIT BOARD
- Publication number 20130287935
- Publication date Oct 31, 2013
- TAIWAN TFT LCD ASSOCIATION
- Ngai Tsang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FASTENING DEVICE
- Publication number 20130140702
- Publication date Jun 6, 2013
- Micronas GmbH
- Christoph WILBERTZ
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...
- Publication number 20130130492
- Publication date May 23, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20120206891
- Publication date Aug 16, 2012
- Shingo Yoshioka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
UNINTERRUPTED FLOW PUMP APPARATUS AND METHOD
- Publication number 20120167998
- Publication date Jul 5, 2012
- THERAKOS, INC.
- Dennis A. Briggs
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MAKING SAME
- Publication number 20120162928
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING PREFORM
- Publication number 20120074210
- Publication date Mar 29, 2012
- ABB TECHNOLOGY AG
- Franc DUGAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...
- Publication number 20120073868
- Publication date Mar 29, 2012
- IBIDEN CO., LTD.
- Yoshinori TAKENAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Conductors having a fine structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Display apparatus having grooved terminals

Electronic device and wiring structure thereof

Printed wiring board and method for manufacturing printed wiring board

Display apparatus having grooved terminals

Method of forming a structure upon a substrate

Printed circuit board and manufacturing method therefor

Electrodeposited copper foil and electrode, and lithium-ion seconda...

Electrodeposited copper foil, current collector, electrode, and lit...

Electronic device and wiring structure thereof

Strip for an electronic device and manufacturing method thereof

Surface treated copper foil

Chip component having groove formed therein

Display apparatus having grooved terminals

Method for manufacturing stretchable electronic device

Laminate film and electrode substrate film, and method of manufactu...

Stretchable conductive connection-based stretchable electronic devi...

Electronic device and manufacturing method thereof

Semiconductor device and method for manufacturing semiconductor device

Conductive ink, display substrate and fabrication method thereof, a...

Filter

Enhanced conductors

Semiconductor device and method for manufacturing the same

Conductive component and electronic device including the same

Image pickup apparatus and image pickup apparatus manufacturing method

Buttoned soldering pad for use with fine-pitch hot bar soldering

Electronic device including wiring on a stretchable/contractible base

Conducting package structure and manufacturing method thereof

Clamp interconnect

Substrate

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

ELECTRONIC DEVICE

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

ELECTRONIC DEVICE AND WIRING STRUCTURE THEREOF

METHOD OF FORMING A STRUCTURE UPON A SUBSTRATE

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

SURFACE TREATED COPPER FOIL

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

STRETCHABLE CONDUCTIVE CONNECTION-BASED STRETCHABLE ELECTRONIC DEVI...

STRETCHABLE CONDUCTIVE CONNECTION-BASED STRETCHABLE ELECTRONIC DEVI...

CONDUCTIVE INK, DISPLAY SUBSTRATE AND FABRICATION METHOD THEREOF, A...

FILTER

CONDUCTING PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CONDUCTIVE COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACES

WIRING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CONTACT SURFACE ARRANGED ON A CARRIER FOR CONNECTING TO A COUNTER C...

Semiconductor Module Arrangement and Method for Producing and Opera...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

METHOD OF FABRICATING OF CIRCUIT BOARD

FASTENING DEVICE

SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...

UNINTERRUPTED FLOW PUMP APPARATUS AND METHOD

ELECTRONIC PACKAGE AND METHOD OF MAKING SAME

SOLDERING PREFORM

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTIL...