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B29C45/14655

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BPERFORMING OPERATIONS TRANSPORTING B29Plastic substance processing B29CSHAPING OR JOINING OF PLASTICS SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL AFTER-TREATMENT OF THE SHAPED PRODUCTS B29C45/00Injection moulding

Current Industry

B29C45/14655connected to or mounted on a carrier

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Resin molding apparatus and method for producing resin molded product
- Patent number 12,194,665
- Issue date Jan 14, 2025
- Towa Corporation
- Makoto Tsukiyama
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stack molding machine
- Patent number 12,138,832
- Issue date Nov 12, 2024
- ITM Semiconductor Co., Ltd.
- Hyuk Hwi Na
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,057,359
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 12,011,859
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting assembly and method for manufacturing a lighting assembly
- Patent number 12,007,081
- Issue date Jun 11, 2024
- Lumileds LLC
- Peter Henri Bancken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press, actuator set and method for encapsulating electronic compone...
- Patent number 11,842,909
- Issue date Dec 12, 2023
- Besi Netherlands B.V.
- Wilhelmus Gerardus Jozef Gal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus and manufacturing method of molded semiconductor...
- Patent number 11,731,327
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods providing tread sensor integration
- Patent number 11,673,436
- Issue date Jun 13, 2023
- Tyrata, Inc.
- David Alan Koester
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 11,575,816
- Issue date Feb 7, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Press part for supporting a mould part for encapsulating electronic...
- Patent number 11,554,523
- Issue date Jan 17, 2023
- Besi Netherlands B.V.
- Albertus Franciscus Gerardus van Driel
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,456,226
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding apparatus, manufacturing method of molded semiconductor dev...
- Patent number 11,446,851
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Camera module, and photosensitive component, electronic device, for...
- Patent number 11,433,584
- Issue date Sep 6, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Takehiko Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting assembly and method for manufacturing a lighting assembly
- Patent number 11,435,038
- Issue date Sep 6, 2022
- Lumileds LLC
- Peter Henri Bancken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level transfer molding and apparatus for performing the same
- Patent number 11,390,000
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,376,770
- Issue date Jul 5, 2022
- Seiko Epson Corporation
- Masataka Kazuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 11,363,184
- Issue date Jun 14, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods, devices, and systems for electronic device molding and enc...
- Patent number 11,289,393
- Issue date Mar 29, 2022
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Press, actuator set and method for encapsulating electronic compone...
- Patent number 11,217,463
- Issue date Jan 4, 2022
- Besi Netherlands B.V.
- Wilhelmus Gerardus Jozef Gal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level methods for manufacturing uniform layers of material on...
- Patent number 11,171,249
- Issue date Nov 9, 2021
- ams Sensors Singapore Pte. Ltd.
- Robert Lenart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface adhesion for transfer molded electronic components
- Patent number 11,140,786
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device, resin package, resin-molded body, and method...
- Patent number 11,094,854
- Issue date Aug 17, 2021
- Nichia Corporation
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow analysis method
- Patent number 11,060,962
- Issue date Jul 13, 2021
- Hitachi, Ltd.
- Tsutomu Kono
- G01 - MEASURING TESTING
Information Patent Grant
Package including lead component having recess
- Patent number 11,043,623
- Issue date Jun 22, 2021
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 10,986,258
- Issue date Apr 20, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding system for applying a uniform clamping pressure onto a subs...
- Patent number 10,960,583
- Issue date Mar 30, 2021
- ASM Technology Singapore Pte. Ltd.
- Shu Chuen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly, lead frame strip and unit...
- Patent number 10,957,633
- Issue date Mar 23, 2021
- Infineon Technologies AG
- Boon Teik Tee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmoulding an optical element on a thermoplastic frame
- Patent number 10,946,564
- Issue date Mar 16, 2021
- Valeo Vision
- Damien Revol
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for producing package for mounting a semiconductor element...
- Patent number 10,913,183
- Issue date Feb 9, 2021
- AGC Inc.
- Wataru Kasai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355691
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...
- Publication number 20240293962
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...
- Publication number 20240227258
- Publication date Jul 11, 2024
- Nissha Co., Ltd.
- Yasuisa TAKINISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE INJECTION MOLDING MOLD, INJECTION MOLDING DEV...
- Publication number 20240140007
- Publication date May 2, 2024
- JCET MANAGEMENT CO., LTD.
- Cheng Yang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...
- Publication number 20240131758
- Publication date Apr 25, 2024
- Nissha Co., Ltd.
- Yasuisa TAKINISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...
- Publication number 20230347561
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Mould for Encapsulating Electronic Components Mounted on...
- Publication number 20230211531
- Publication date Jul 6, 2023
- BESI NETHERLANDS B.V.
- Wilhelmus Gerardus Joseph Gal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20230154770
- Publication date May 18, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING DEVICE WITH SELF-BLOCKING FEED CHANNEL
- Publication number 20230050046
- Publication date Feb 16, 2023
- ROBERT BOSCH GmbH
- Martin Fleischmann
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220384288
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...
- Publication number 20220362975
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Feng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT, ELECTRONIC DEVICE, FOR...
- Publication number 20220362978
- Publication date Nov 17, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Takehiko TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Press, Actuator Set and Method for Encapsulating Electronic Compone...
- Publication number 20220301901
- Publication date Sep 22, 2022
- BESI NETHERLANDS B.V.
- Wilhelmus Gerardus Jozef Gal
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CAMERA MODULE, MOLDED CIRCUIT BOARD ASSEMBLY, MOLDED PHOTOSENSITIVE...
- Publication number 20220286592
- Publication date Sep 8, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RESIN MOLDED PRODUCT PRODUCTION METHOD, MOLDING DIE, AND RESIN MOLD...
- Publication number 20220262650
- Publication date Aug 18, 2022
- TOWA CORPORATION
- Ryota NAKATSUKASA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SENSOR AND MANUFACTURING METHOD
- Publication number 20220252483
- Publication date Aug 11, 2022
- CONTINENTAL AUTOMOTIVE GMBH
- Hervé Contet
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
In-mold Electronic Structure Using Plating Process and Method Therefor
- Publication number 20220184865
- Publication date Jun 16, 2022
- INTOPS CO., LTD.
- Tae yong HONG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Mould Half and Mould Method for Transfer Moulding Encapsulating Ele...
- Publication number 20210387389
- Publication date Dec 16, 2021
- BESI NETHERLANDS B.V.
- Wilhelmus Gerardus Jozef Gal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...
- Publication number 20210336094
- Publication date Oct 28, 2021
- Nichia Corporation.
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Camera Module, Molded Circuit Board Assembly, Molded Photosensitive...
- Publication number 20210203819
- Publication date Jul 1, 2021
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Press Part for Supporting a Mould Part for Encapsulating Electronic...
- Publication number 20210187803
- Publication date Jun 24, 2021
- BESI NETHERLANDS B.V.
- Albertus Franciscus Gerardus van Driel
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...
- Publication number 20210193543
- Publication date Jun 24, 2021
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEV...
- Publication number 20200338796
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Feng Weng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...
- Publication number 20200287096
- Publication date Sep 10, 2020
- Nichia Corporation.
- Hirofumi Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200258801
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20200254663
- Publication date Aug 13, 2020
- SEIKO EPSON CORPORATION
- Masataka KAZUNO
- G01 - MEASURING TESTING
Information Patent Application
INJECTION-MOLDING METHOD AND LIQUID CONTAINER FOR A MOTOR VEHICLE
- Publication number 20200206993
- Publication date Jul 2, 2020
- KAUTEX TEXTRON GmbH & Co. KG
- Roman BOUFFIER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER-LEVEL METHODS FOR MANUFACTURING UNIFORM LAYERS OF MATERIAL ON...
- Publication number 20200176615
- Publication date Jun 4, 2020
- ams Sensors Singapore Pte. Ltd.
- Robert Lenart
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS
- Publication number 20200154576
- Publication date May 14, 2020
- International Business Machines Corporation
- Timothy J. Chainer
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Wafer Level Transfer Molding and Apparatus for Performing the Same
- Publication number 20200114556
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

connected to or mounted on a carrier

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin molding apparatus and method for producing resin molded product

Stack molding machine

Semiconductor package and method of fabricating the same

Molding apparatus and manufacturing method of molded semiconductor...

Lighting assembly and method for manufacturing a lighting assembly

Press, actuator set and method for encapsulating electronic compone...

Molding apparatus and manufacturing method of molded semiconductor...

Structures and methods providing tread sensor integration

Component mounting system

Camera module, molded circuit board assembly, molded photosensitive...

Press part for supporting a mould part for encapsulating electronic...

Semiconductor package and method of fabricating the same

Molding apparatus, manufacturing method of molded semiconductor dev...

Camera module, and photosensitive component, electronic device, for...

Lighting assembly and method for manufacturing a lighting assembly

Wafer level transfer molding and apparatus for performing the same

Method of manufacturing electronic device

Camera module, molded circuit board assembly, molded photosensitive...

Methods, devices, and systems for electronic device molding and enc...

Press, actuator set and method for encapsulating electronic compone...

Wafer-level methods for manufacturing uniform layers of material on...

Thermal interface adhesion for transfer molded electronic components

Light emitting device, resin package, resin-molded body, and method...

Flow analysis method

Package including lead component having recess

Camera module, molded circuit board assembly, molded photosensitive...

Molding system for applying a uniform clamping pressure onto a subs...

Semiconductor device packaging assembly, lead frame strip and unit...

Overmoulding an optical element on a thermoplastic frame

Process for producing package for mounting a semiconductor element...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF MOLDED SEMI...

ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...

SEMICONDUCTOR PACKAGE INJECTION MOLDING MOLD, INJECTION MOLDING DEV...

ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...

Method and Mould for Encapsulating Electronic Components Mounted on...

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

MOLDING DEVICE WITH SELF-BLOCKING FEED CHANNEL

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MOLDING APPARATUS AND MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR...

CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT, ELECTRONIC DEVICE, FOR...

Press, Actuator Set and Method for Encapsulating Electronic Compone...

CAMERA MODULE, MOLDED CIRCUIT BOARD ASSEMBLY, MOLDED PHOTOSENSITIVE...

RESIN MOLDED PRODUCT PRODUCTION METHOD, MOLDING DIE, AND RESIN MOLD...

SENSOR AND MANUFACTURING METHOD

In-mold Electronic Structure Using Plating Process and Method Therefor

Mould Half and Mould Method for Transfer Moulding Encapsulating Ele...

LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...

Camera Module, Molded Circuit Board Assembly, Molded Photosensitive...

Press Part for Supporting a Mould Part for Encapsulating Electronic...

METHODS, DEVICES, AND SYSTEMS FOR ELECTRONIC DEVICE MOLDING AND ENC...

MOLDING APPARATUS, MANUFACTURING METHOD OF MOLDED SEMICONDUCTOR DEV...

LIGHT EMITTING DEVICE, RESIN PACKAGE, RESIN-MOLDED BODY, AND METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING ELECTRONIC DEVICE

INJECTION-MOLDING METHOD AND LIQUID CONTAINER FOR A MOTOR VEHICLE

WAFER-LEVEL METHODS FOR MANUFACTURING UNIFORM LAYERS OF MATERIAL ON...

THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS

Wafer Level Transfer Molding and Apparatus for Performing the Same