connecting to other rigid printed circuits or like structures

Industry

CPC
H01R12/52

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HELECTRICITY H01Electric elements H01RLINE CONNECTORS CURRENT COLLECTORS H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits

Current Industry

H01R12/52connecting to other rigid printed circuits or like structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Liquid ejecting apparatus
- Patent number 12,128,682
- Issue date Oct 29, 2024
- Seiko Epson Corporation
- Yusuke Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board unit, attachment unit, and image forming apparatus
- Patent number 12,130,565
- Issue date Oct 29, 2024
- Ricoh Company, Ltd.
- Yuki Oshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector for fitting with a docking connector comprising an electr...
- Patent number 12,132,274
- Issue date Oct 29, 2024
- STARCONN ELECTRONIC (SU ZHOU) CO., LTD.
- Chung Nan Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,130,979
- Issue date Oct 29, 2024
- Samsung Display Co., Ltd.
- Min-Hong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable mounting substrate
- Patent number 12,127,339
- Issue date Oct 22, 2024
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression mounted technology (CMT) socket retention mechanisms to...
- Patent number 12,127,363
- Issue date Oct 22, 2024
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass mounted electronic assembly
- Patent number 12,126,126
- Issue date Oct 22, 2024
- Aptiv Technologies AG
- M. Jarod Scherer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature measuring device for measuring the temperature of a ter...
- Patent number 12,100,916
- Issue date Sep 24, 2024
- Tyco Electronics France SAS
- Olivier Pamart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Built-in connector for board-to-board and flex-to-rigid board conne...
- Patent number 12,095,185
- Issue date Sep 17, 2024
- Apple Inc.
- Lan H. Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra slim module form factor and connector architecture for top mo...
- Patent number 12,095,189
- Issue date Sep 17, 2024
- Intel Corporation
- Richard S. Perry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,057,670
- Issue date Aug 6, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for establishing an electrically conductive co...
- Patent number 12,046,863
- Issue date Jul 23, 2024
- Vitesco Technologies, GmbH
- Thomas Riepl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Header and package with integrated cooler for electronic components
- Patent number 12,009,634
- Issue date Jun 11, 2024
- Schott AG
- Andreas Krause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics unit comprising a circuit board and a power modul...
- Patent number 11,990,697
- Issue date May 21, 2024
- Audi AG
- Andreas Apelsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug-in device
- Patent number 11,990,696
- Issue date May 21, 2024
- Allstate Insurance Company
- Chad W. Bohlmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication board and electronic device having same
- Patent number 11,968,783
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jongwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector including signal pins shielded by buried ground vias
- Patent number 11,967,782
- Issue date Apr 23, 2024
- NEOCONIX, INC
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including a compression assembly for cable conn...
- Patent number 11,943,886
- Issue date Mar 26, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate unit and manufacturing method of substrate unit
- Patent number 11,942,712
- Issue date Mar 26, 2024
- Yazaki Corporation
- Masashi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,942,260
- Issue date Mar 26, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coplanar card edge connector
- Patent number 11,929,575
- Issue date Mar 12, 2024
- Amphenol Commercial Products (ChengDu) Co., LTD.
- Jun Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device, multilayer board included in the same, and...
- Patent number 11,923,125
- Issue date Mar 5, 2024
- Sumitomo Electric Industries, Ltd.
- Keiji Tashiro
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible catheter-based in vivo detection device and system
- Patent number 11,903,565
- Issue date Feb 20, 2024
- Innovex Medical Co., Ltd.
- Hang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting printed circuit boards
- Patent number 11,901,654
- Issue date Feb 13, 2024
- Amphenol Corporation
- Michael A. Hoyack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect with conductive polymer contacts having tip...
- Patent number 11,894,629
- Issue date Feb 6, 2024
- Tyco Electronics Japan G.K.
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module, terminal assembly, and method for producing module
- Patent number 11,895,769
- Issue date Feb 6, 2024
- Murata Manufacturing Co., Ltd.
- Kazuya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT SLEEVE, RF MODULE, AND METHOD
- Publication number 20240413547
- Publication date Dec 12, 2024
- Rohde& Schwarz GmbH & Co. KG
- Nico RIEDMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA SLIM MODULE FORM FACTOR AND CONNECTOR ARCHITECTURE FOR TOP MO...
- Publication number 20240413553
- Publication date Dec 12, 2024
- Intel Corporation
- Richard S. PERRY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Modular Printed Circuit Boards with Connectors
- Publication number 20240405459
- Publication date Dec 5, 2024
- Intel Corporation
- Navneet K. SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...
- Publication number 20240388019
- Publication date Nov 21, 2024
- HARTING ELECTRONICS GMBH
- Markus FRIESEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS
- Publication number 20240363520
- Publication date Oct 31, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR MODULE AND ELECTRONIC DEVICE
- Publication number 20240356284
- Publication date Oct 24, 2024
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Kunlin YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bus Bar Subassembly and Electrical Assembly
- Publication number 20240291180
- Publication date Aug 29, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Jie (Roger) Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB
- Publication number 20240291181
- Publication date Aug 29, 2024
- GUANGZHOU KANGLONG ELECTRONICS CO., LTD.
- Tielong KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT FASTENERS FOR SECURING COMPONENTS TOGETHER
- Publication number 20240292515
- Publication date Aug 29, 2024
- Tesla, Inc.
- Rameez Hasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE ADJUSTMENT METHOD AND CONNECTOR FOR HIGH-SPEED TRANSMISSION
- Publication number 20240243523
- Publication date Jul 18, 2024
- Japan Aviation Electronics Industry, Ltd.
- Junji OOSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector
- Publication number 20240235074
- Publication date Jul 11, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Xinlei (Tony) Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240235071
- Publication date Jul 11, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL RECEPTACLE WITH GROUND FAULT CIRCUIT INTERRUPTER AND POW...
- Publication number 20240222918
- Publication date Jul 4, 2024
- HUBBELL INCORPORATED
- John E. Brower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND CONTACT ARRANGEMENT
- Publication number 20240215170
- Publication date Jun 27, 2024
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND APPARATUS
- Publication number 20240194390
- Publication date Jun 13, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS
- Publication number 20240170867
- Publication date May 23, 2024
- Neoconix, Inc.
- Woody Maynard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR POSITION ALIGNMENT ASSEMBLY AND BATTERY MODULE INCLUDING...
- Publication number 20240145875
- Publication date May 2, 2024
- SK On Co., Ltd.
- Gang U LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector
- Publication number 20240136741
- Publication date Apr 25, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Xinlei (Tony) Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20240136739
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH
- Publication number 20240106137
- Publication date Mar 28, 2024
- Apple Inc.
- James M. Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
- Publication number 20240106139
- Publication date Mar 28, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND POWER MODULE
- Publication number 20240096543
- Publication date Mar 21, 2024
- DELTA ELECTRONICS, INC.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPLIANCE SOCKET
- Publication number 20240088584
- Publication date Mar 14, 2024
- HARTING Electric Stiftung & Co. KG
- Wilhelm KLIEVER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240072459
- Publication date Feb 29, 2024
- InnoLux Corporation
- Chia-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DESIGNS FOR MEMORY SYSTEMS
- Publication number 20240039185
- Publication date Feb 1, 2024
- Micron Technology, Inc.
- Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGING CONNECTOR, CONNECTION ASSEMBLY, VEHICLE LAMP, AND VEHICLE
- Publication number 20240014612
- Publication date Jan 11, 2024
- Valeo Vision
- Cyril DUBUC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Prototyping Interoperability
- Publication number 20240006833
- Publication date Jan 4, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward HODGES
- H01 - BASIC ELECTRIC ELEMENTS

connecting to other rigid printed circuits or like structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Liquid ejecting apparatus

Circuit board unit, attachment unit, and image forming apparatus

Connector for fitting with a docking connector comprising an electr...

Circuit board and display device including the same

Stretchable mounting substrate

Compression mounted technology (CMT) socket retention mechanisms to...

Glass mounted electronic assembly

Flexible jumper with a mounting frame

Connection structure and manufacturing method therefor

Temperature measuring device for measuring the temperature of a ter...

Built-in connector for board-to-board and flex-to-rigid board conne...

Ultra slim module form factor and connector architecture for top mo...

Semiconductor package structure and method for manufacturing the same

Apparatus and method for establishing an electrically conductive co...

Header and package with integrated cooler for electronic components

Power electronics unit comprising a circuit board and a power modul...

Plug-in device

Wireless communication board and electronic device having same

Connector including signal pins shielded by buried ground vias

Via bond attachment

Electronic assembly including a compression assembly for cable conn...

Substrate unit and manufacturing method of substrate unit

Power module

Coplanar card edge connector

Power conversion device, multilayer board included in the same, and...

Flexible catheter-based in vivo detection device and system

Edge connector, circuit board, and connector component

Method of interconnecting printed circuit boards

Electrical interconnect with conductive polymer contacts having tip...

Module, terminal assembly, and method for producing module

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRICAL CONTACT SLEEVE, RF MODULE, AND METHOD

ULTRA SLIM MODULE FORM FACTOR AND CONNECTOR ARCHITECTURE FOR TOP MO...

Modular Printed Circuit Boards with Connectors

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...

SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS

CONNECTOR MODULE AND ELECTRONIC DEVICE

Bus Bar Subassembly and Electrical Assembly

BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB

PRESS-FIT FASTENERS FOR SECURING COMPONENTS TOGETHER

BONDING SHEET AND METHOD FOR PRODUCING SAME

IMPEDANCE ADJUSTMENT METHOD AND CONNECTOR FOR HIGH-SPEED TRANSMISSION

Electrical Connector

CIRCUIT MODULE

ELECTRICAL RECEPTACLE WITH GROUND FAULT CIRCUIT INTERRUPTER AND POW...

ELECTRONIC MODULE AND CONTACT ARRANGEMENT

POWER MODULE AND APPARATUS

CONNECTOR INCLUDING SIGNAL PINS SHIELDED BY BURIED GROUND VIAS

CONNECTOR POSITION ALIGNMENT ASSEMBLY AND BATTERY MODULE INCLUDING...

Electrical Connector

CIRCUIT MODULE

CONNECTOR HAVING NARROW SURFACE-MOUNT CONTACT PITCH

CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES

APPARATUS AND POWER MODULE

APPLIANCE SOCKET

ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE

CONNECTION DESIGNS FOR MEMORY SYSTEMS

BRIDGING CONNECTOR, CONNECTION ASSEMBLY, VEHICLE LAMP, AND VEHICLE

Electronic Prototyping Interoperability