Connection or disconnection of other leads to or from a metallisation

Industry

CPC
H01L21/4853

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4853Connection or disconnection of other leads to or from a metallisation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for providing electrical isolation in semiconductor devices
- Patent number 12,368,139
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chan-Hong Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side integration semiconductor package and method of forming...
- Patent number 12,368,142
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,253
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing an electronic package
- Patent number 12,362,267
- Issue date Jul 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including package substrate with elongated solder...
- Patent number 12,362,268
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,362,196
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including direct-contact heat paths and methods of manufa...
- Patent number 12,362,255
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,362,341
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including stepped surfaces and methods of forming the same
- Patent number 12,362,246
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing
- Patent number 12,354,938
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including photo imageable dielectric
- Patent number 12,354,974
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Yuseon Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, electronic structure and manufacturing method t...
- Patent number 12,354,885
- Issue date Jul 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus, manufacturing method of integrated circuit, a...
- Patent number 12,347,708
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for through interposer die level interconnect...
- Patent number 12,347,762
- Issue date Jul 1, 2025
- Rockwell Collin Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 12,345,935
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Window ball grid array (WBGA) package and method for manufacturing...
- Patent number 12,341,090
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,341,104
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thinning a semiconductor die
- Patent number 12,341,130
- Issue date Jun 24, 2025
- Western Digital Technologies, Inc.
- Meiqin Hao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES
- Publication number 20250233087
- Publication date Jul 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Arsalan Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20250233058
- Publication date Jul 17, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Shih-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING BONDING MATERIAL DEPOSITS
- Publication number 20250226237
- Publication date Jul 10, 2025
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226569
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20250226583
- Publication date Jul 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250226299
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- TAE OH HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218995
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218996
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...
- Publication number 20250218910
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...
- Publication number 20250218911
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPEC...
- Publication number 20250218920
- Publication date Jul 3, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218997
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218994
- Publication date Jul 3, 2025
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250219001
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JongTae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR
- Publication number 20250210536
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Heh-Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20250210544
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250210488
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chih Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIGH DENSITY SYSTEM ON CHIP MEMORY INTEGRATION
- Publication number 20250212422
- Publication date Jun 26, 2025
- Meta Platforms Technologies, LLC
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...
- Publication number 20250210429
- Publication date Jun 26, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210443
- Publication date Jun 26, 2025
- Mitsubishi Electric Corporation
- Yasuhiro SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210504
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Masashi ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE...
- Publication number 20250210461
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Manufacturing Method Thereof
- Publication number 20250210527
- Publication date Jun 26, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES
- Publication number 20250201689
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS

Connection or disconnection of other leads to or from a metallisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Structures for providing electrical isolation in semiconductor devices

Hybrid integrated circuit packages

Methods of forming semiconductor packages

Semiconductor chip package having underfill material surrounding a...

Method of manufacturing semiconductor device including passivation...

Double side integration semiconductor package and method of forming...

Supporting InFO packages to reduce warpage

Semiconductor package and method of fabricating the same

Electronic package and method for manufacturing an electronic package

Package assembly including package substrate with elongated solder...

Semiconductor package having a semiconductor device bonded to a cir...

Package structure

Package structure with underfill

Apparatus including direct-contact heat paths and methods of manufa...

Semiconductor package

Semiconductor devices and methods of manufacturing

Interposer including stepped surfaces and methods of forming the same

Chip package assembly, electronic device, and preparation method of...

Semiconductor package and methods of manufacturing

Semiconductor package including photo imageable dielectric

Electronic package, electronic structure and manufacturing method t...

Inspection apparatus, manufacturing method of integrated circuit, a...

Method and apparatus for through interposer die level interconnect...

Packaging of three-dimensional integrated circuit by encapsulation...

Package assembly and manufacturing method thereof

Package structure

Window ball grid array (WBGA) package and method for manufacturing...

Methods of manufacturing semiconductor devices

Method of thinning a semiconductor die

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR PACKAGES

SYSTEMS AND METHODS FOR EMBEDDING ELECTRONIC COMPONENTS IN SUBSTRATES

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

METHOD FOR MOUNTING BONDING MATERIAL DEPOSITS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...

ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...

APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPEC...

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

CHIP PACKAGE STRUCTURE WITH CONDUCTIVE PILLAR

PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

SEMICONDUCTOR DEVICE AND METHOD

SYSTEMS AND METHODS FOR HIGH DENSITY SYSTEM ON CHIP MEMORY INTEGRATION

INTEGRATED CIRCUIT PACKAGES WITH STIFFENERS CONTAINING SEMICONDUCTO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGES WITH DOUBLE-SIDE METAL PILLARS AND THE METHODS FORMING THE...

Electronic Package and Manufacturing Method Thereof

MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES