Connection or disconnection of other leads to or from a metallisation

Industry

CPC
H01L21/4853

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4853Connection or disconnection of other leads to or from a metallisation

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
- Patent number 12,300,618
- Issue date May 13, 2025
- Taiwna Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for fabricating the same
- Patent number 12,300,588
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Yoshihiko Kawakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for package structure
- Patent number 12,300,511
- Issue date May 13, 2025
- University of Electronic Science and Technology of China
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnect substrate, an electrical device and a method for f...
- Patent number 12,300,613
- Issue date May 13, 2025
- Intel Corporation
- Robert Alan May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module having a compartment shield structure
- Patent number 12,293,975
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for forming the same
- Patent number 12,295,149
- Issue date May 6, 2025
- ANHUI CAMBRICON INFORMATION TECHNOLOGY CO., LTD.
- Shuai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with hybrid mold layers
- Patent number 12,288,740
- Issue date Apr 29, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating same
- Patent number 12,283,578
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Jeong Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device package and method of manufacturing the same
- Patent number 12,283,585
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,278,189
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,278,196
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including sub-interpose...
- Patent number 12,278,222
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with annular package lid structure
- Patent number 12,278,150
- Issue date Apr 15, 2025
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for high-frequency package
- Patent number 12,272,567
- Issue date Apr 8, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel package substrate with stair shaped substrate traces
- Patent number 12,266,597
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,126
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing stress in semiconductor chips
- Patent number 12,261,139
- Issue date Mar 25, 2025
- Ciena Corporation
- Jean-Sébastien Côté
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure
- Patent number 12,261,125
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR
- Publication number 20250157902
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250157900
- Publication date May 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE
- Publication number 20250157911
- Publication date May 15, 2025
- Mitsubishi Electric Corporation
- Kazuki NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...
- Publication number 20250157953
- Publication date May 15, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Packaging module and manufacturing method therefor
- Publication number 20250157903
- Publication date May 15, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH REINFORCED ELEMENT
- Publication number 20250149469
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PREFORMS WITH EMBEDDED BEADS TO ACT AS STANDOFFS
- Publication number 20250149487
- Publication date May 8, 2025
- Dell Products L.P.
- James L. PETIVAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-SIDED DIRECT COOLED POWER MODULE
- Publication number 20250149417
- Publication date May 8, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20250149419
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yushuang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
- Publication number 20250149454
- Publication date May 8, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250149415
- Publication date May 8, 2025
- JCET Group Co., LTD.
- Yun GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...
- Publication number 20250149416
- Publication date May 8, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...
- Publication number 20250149461
- Publication date May 8, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149471
- Publication date May 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250140773
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140671
- Publication date May 1, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20250140708
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
- Publication number 20250140769
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yunyi Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250140679
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SangHoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER
- Publication number 20250140771
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250132261
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chao Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20250132238
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Connection or disconnection of other leads to or from a metallisation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Aligning bumps in fan-out packaging process

Solder material

Semiconductor device having a heat dissipation structure connected...

Semiconductor module and method for fabricating the same

Fabrication method for package structure

Die interconnect substrate, an electrical device and a method for f...

High-frequency module having a compartment shield structure

Semiconductor package including shielding cover that covers molded...

Package comprising discrete antenna device

Integrated circuit package and method of forming same

Capacitor structure and method for forming the same

Semiconductor EMI shielding component, semiconductor package struct...

Semiconductor package with hybrid mold layers

Semiconductor packages

Semiconductor device with open cavity and method therefor

High density interconnection using fanout interposer chiplet

Semiconductor package and method of fabricating same

Optoelectronic device package and method of manufacturing the same

Electronic package and manufacturing method thereof

Semiconductor devices and methods of manufacturing semiconductor de...

Method of fabricating semiconductor package including sub-interpose...

Semiconductor package with annular package lid structure

Heterogeneous nested interposer package for IC chips

Manufacturing method for high-frequency package

Antenna apparatus and fabrication method

Integrated devices in semiconductor packages and methods of forming...

Multilevel package substrate with stair shaped substrate traces

Semiconductor package

Managing stress in semiconductor chips

Method for forming chip package structure

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR

MANUFACTURING METHOD OF PACKAGE DEVICE

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...

Packaging module and manufacturing method therefor

PACKAGE STRUCTURE WITH REINFORCED ELEMENT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SOLDER PREFORMS WITH EMBEDDED BEADS TO ACT AS STANDOFFS

SINGLE-SIDED DIRECT COOLED POWER MODULE

HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

Semiconductor Device and Methods of Making and Using Pre-Molded Bri...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...

MULTI-DEVICE GRADED EMBEDDING PACKAGE SUBSTRATE AND MANUFACTURING M...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK

ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A CORE LAYER

Semiconductor Device and Method of Forming Fan-Out Package Structur...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

PACKAGE WITH BACK-TO-BACK DIE STACKING

PACKAGE STRUCTURE