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Connection or disconnection of other leads to or from wire-like parts
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4889
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device and method of compartment shielding using bond...
Patent number
12,009,314
Issue date
Jun 11, 2024
STATS ChipPAC Pte. Ltd.
YoungCheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing electronic components, corresponding electronic...
Patent number
11,935,818
Issue date
Mar 19, 2024
STMicroelectronics S.r.l.
Fabio Marchisi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having EMI shielding structure and related met...
Patent number
11,855,000
Issue date
Dec 26, 2023
Amkor Technology Singapore Holding Pte Ltd.
Young Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Over and under interconnects
Patent number
11,830,804
Issue date
Nov 28, 2023
Invensas LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having conductive wire with increased attachme...
Patent number
11,804,447
Issue date
Oct 31, 2023
Amkor Technology Singapore Holding Pte Ltd.
Jun Ho Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including distributed write driving arrangement
Patent number
11,783,890
Issue date
Oct 10, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hidehiro Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing chip packaging structure with dissipation l...
Patent number
11,735,503
Issue date
Aug 22, 2023
HEFEI SMAT TECHNOLOGY CO., LTD.
Xiaochun Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,705,401
Issue date
Jul 18, 2023
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,682,629
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,658,102
Issue date
May 23, 2023
Advanced Semiconductor Engineering, Inc.
Yuanhao Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor device manufacturing method
Patent number
11,600,589
Issue date
Mar 7, 2023
Lapis Semiconductor Co., Ltd.
Masanori Shindo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
11,515,270
Issue date
Nov 29, 2022
Advanced Semiconductor Engineering, Inc.
Yu-Lin Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including a wire and a method of fabricating...
Patent number
11,502,028
Issue date
Nov 15, 2022
SK hynix Inc.
Chae Sung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package including electromagnetic shielding structure an...
Patent number
11,462,485
Issue date
Oct 4, 2022
Orient Semiconductor Electronics, Limited
Yueh-Ming Tung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of compartment shielding using bond...
Patent number
11,450,618
Issue date
Sep 20, 2022
STATS ChipPAC Pte. Ltd.
YoungCheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and method for manufacturing the same
Patent number
11,437,302
Issue date
Sep 6, 2022
Fuji Electric Co., Ltd.
Naoyuki Kanai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor device including distributed write...
Patent number
11,423,974
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hidehiro Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for multi-die interconnection
Patent number
11,367,686
Issue date
Jun 21, 2022
Cerebras Systems Inc.
Jean-Philippe Fricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having EMI shielding structure and related met...
Patent number
11,355,449
Issue date
Jun 7, 2022
Amkor Technology Singapore Holding Pte Ltd.
Young Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for generating wire loop profiles for wire loops, and metho...
Patent number
11,289,448
Issue date
Mar 29, 2022
Kulicke and Soffa Industries, Inc.
Basil Milton
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip packaging structure with heat dissipation layer, flange and se...
Patent number
11,239,140
Issue date
Feb 1, 2022
HEFEI SMAT TECHNOLOGY CO., LTD.
Xiaochun Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module and semiconductor module manufacturing method
Patent number
11,189,547
Issue date
Nov 30, 2021
Fuji Electric Co., Ltd.
Nobuhiro Higashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with nanowire plugs and method for fabricating...
Patent number
11,107,809
Issue date
Aug 31, 2021
NANYA TECHNOLOGY CORPORATION
Kuo-Hui Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing electronic components, corresponding electronic...
Patent number
11,018,078
Issue date
May 25, 2021
STMicroelectronics S.r.l.
Fabio Marchisi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,004,799
Issue date
May 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor device manufacturing method
Patent number
10,957,630
Issue date
Mar 23, 2021
Shindengen Electric Manufacturing Co., Ltd.
Soichiro Umeda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having conductive wire with increased attachme...
Patent number
10,943,871
Issue date
Mar 9, 2021
Amkor Technology Singapore Holding Pte Ltd.
Jun Ho Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out antenna packaging structure and preparation thereof
Patent number
10,886,243
Issue date
Jan 5, 2021
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
10,879,199
Issue date
Dec 29, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor vertical wire bonding structure and method
Patent number
10,854,476
Issue date
Dec 1, 2020
SJ Semiconductor (Jiangyin) Corporation
Han Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
OVER AND UNDER INTERCONNECTS
Publication number
20240347443
Publication date
Oct 17, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE STRUCTURE
Publication number
20240304450
Publication date
Sep 12, 2024
Advanced Semiconductor Engineering, Inc.
An-Hsuan HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20240234269
Publication date
Jul 11, 2024
Samsung Electronics Co., Ltd.
DONGHYEON JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
Publication number
20240234258
Publication date
Jul 11, 2024
NXP B.V.
Frank.zy Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...
Publication number
20240203834
Publication date
Jun 20, 2024
STMicroelectronics S.r.l.
Fabio MARCHISI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
Publication number
20240136256
Publication date
Apr 25, 2024
NXP B.V.
Frank.zy Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20240136262
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
DONGHYEON JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...
Publication number
20240088059
Publication date
Mar 14, 2024
Amkor Technology Singapore Holding Pte. Ltd
Young Woo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING DISTRIBUTED WRITE DRIVING ARRANGEMENT
Publication number
20240046979
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hidehiro FUJIWARA
G11 - INFORMATION STORAGE
Information
Patent Application
PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING M...
Publication number
20230326833
Publication date
Oct 12, 2023
PANJIT INTERNATIONAL INC.
Yung-Hui WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230298985
Publication date
Sep 21, 2023
Advanced Semiconductor Engineering, Inc.
Yuanhao YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Compartment Shielding Using Bond...
Publication number
20220384361
Publication date
Dec 1, 2022
STATS ChipPAC Pte Ltd.
YoungCheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING DISTRIBUTED WRITE DRIVING ARRANGEMENT
Publication number
20220366965
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hidehiro FUJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220328416
Publication date
Oct 13, 2022
Advanced Semiconductor Engineering, Inc.
You-Lung YEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...
Publication number
20220302043
Publication date
Sep 22, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Young Woo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR MULTI-DIE INTERCONNECTION
Publication number
20220278043
Publication date
Sep 1, 2022
Cerebras Systems Inc.
Jean-Philippe Fricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF
Publication number
20220270981
Publication date
Aug 25, 2022
ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
YUEH-MING TUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220115339
Publication date
Apr 14, 2022
Advanced Semiconductor Engineering, Inc.
Yu-Lin Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220115299
Publication date
Apr 14, 2022
Hefei SMAT Technology Co., LTD
Xiaochun Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A WIRE AND A METHOD OF FABRICATING...
Publication number
20220108942
Publication date
Apr 7, 2022
SK HYNIX INC.
Chae Sung LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210398880
Publication date
Dec 23, 2021
Fuji Electric Co., Ltd.
Naoyuki KANAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210384109
Publication date
Dec 9, 2021
NISSAN ARC, LTD.
Satoshi Tanimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING ELECTRONIC COMPONENTS, CORRESPONDING ELECTRONIC...
Publication number
20210305134
Publication date
Sep 30, 2021
STMicroelectronics S.r.l.
Fabio MARCHISI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING DISTRIBUTED WRITE...
Publication number
20210280437
Publication date
Sep 9, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hidehiro FUJIWARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20210265276
Publication date
Aug 26, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20210242155
Publication date
Aug 5, 2021
LAPIS SEMICONDUCTOR CO., LTD.
MASANORI SHINDO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Compartment Shielding Using Bond...
Publication number
20210225778
Publication date
Jul 22, 2021
STATS ChipPAC Pte Ltd.
YoungCheol Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210225747
Publication date
Jul 22, 2021
Advanced Semiconductor Engineering, Inc.
Yuanhao YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
Publication number
20210143105
Publication date
May 13, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Jun Ho JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH NANOWIRE PLUGS AND METHOD FOR FABRICATING...
Publication number
20210091073
Publication date
Mar 25, 2021
NANYA TECHNOLOGY CORPORATION
KUO-HUI SU
H01 - BASIC ELECTRIC ELEMENTS