consisting of metals or alloys or metallic inorganic compounds

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H05K3/062

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/062consisting of metals or alloys or metallic inorganic compounds

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,997,788
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic etching using photosensitive compound
- Patent number 11,937,379
- Issue date Mar 19, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board and resist laminate f...
- Patent number 11,937,378
- Issue date Mar 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,917,756
- Issue date Feb 27, 2024
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,606,863
- Issue date Mar 14, 2023
- Kateeva, Inc.
- Moshe Frenkel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foils with ordered crystal structure and method for producing...
- Patent number 10,980,130
- Issue date Apr 13, 2021
- The Curators of the University of Missouri
- Jay A. Switzer
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper plasma etching method and manufacturing method of display panel
- Patent number 10,910,232
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Sang Gab Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 10,743,420
- Issue date Aug 11, 2020
- Kateeva, Inc.
- Moshe Frenkel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective metallization of an integrated circuit (IC) substrate
- Patent number 10,290,557
- Issue date May 14, 2019
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating tamper-respondent sensor
- Patent number 10,257,939
- Issue date Apr 9, 2019
- International Business Machines Corporation
- John R. Dangler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent sensors with formed flexible layer(s)
- Patent number 10,172,239
- Issue date Jan 1, 2019
- International Business Machines Corporation
- John R. Dangler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a multilayer flexible printed circuit board
- Patent number 9,883,584
- Issue date Jan 30, 2018
- Nippon Mektron, Ltd.
- Ryoichi Toyoshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing substrate formed with copper thin layer, metho...
- Patent number 9,758,889
- Issue date Sep 12, 2017
- YMT CO., LTD.
- Sung Wook Chun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming stacked wiring
- Patent number 9,566,790
- Issue date Feb 14, 2017
- Seiko Epson Corporation
- Yoshihiko Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a printed circuit board
- Patent number 9,491,866
- Issue date Nov 8, 2016
- LG Innotek Co., Ltd
- Sang Myung Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation method of patterned film, display substrate and display...
- Patent number 9,445,506
- Issue date Sep 13, 2016
- BOE Technology Group Co., Ltd.
- Lin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate and method of fabricating the same
- Patent number 9,408,313
- Issue date Aug 2, 2016
- Unimicron Technology Corp.
- Chun-Ting Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and process for producing same
- Patent number 9,101,065
- Issue date Aug 4, 2015
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 9,084,342
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Chen-Chuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit structure
- Patent number 9,041,166
- Issue date May 26, 2015
- Subtron Technology Co., Ltd.
- Ching-Sheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting semiconductor chip and method for producing...
- Patent number 8,997,341
- Issue date Apr 7, 2015
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a capacitor-embedded printed circuit board
- Patent number 8,943,685
- Issue date Feb 3, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Do Kweon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit structure
- Patent number 8,853,102
- Issue date Oct 7, 2014
- Subtron Technology Co., Ltd.
- Ching-Sheng Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit structure and manufacturing method thereof
- Patent number 8,803,295
- Issue date Aug 12, 2014
- Subtron Technology Co., Ltd.
- Ching-Sheng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and process for producing same
- Patent number 8,785,785
- Issue date Jul 22, 2014
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure and manufacturing method thereof
- Patent number 8,552,303
- Issue date Oct 8, 2013
- Subtron Technology Co., Ltd.
- Ching-Sheng Chen
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...
- Publication number 20240121896
- Publication date Apr 11, 2024
- Unimicron Technology Corp.
- Chien Jung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
- Publication number 20240114627
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240107683
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE
- Publication number 20230371189
- Publication date Nov 16, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING PRINTED CIRCUIT BOARDS
- Publication number 20230284391
- Publication date Sep 7, 2023
- Gebr. Schmid GmbH
- Christian Buchner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20230189447
- Publication date Jun 15, 2023
- Kateeva, Inc.
- Moshe FRENKEL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230171888
- Publication date Jun 1, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...
- Publication number 20230092667
- Publication date Mar 23, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...
- Publication number 20230086970
- Publication date Mar 23, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER T...
- Publication number 20220132672
- Publication date Apr 28, 2022
- C3 Nano, Inc.
- Xiqiang Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220015231
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Yuji IKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic Etching Using Photosensitive Compound
- Publication number 20210315104
- Publication date Oct 7, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jolanta Klocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259115
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...
- Publication number 20210127503
- Publication date Apr 29, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20200396842
- Publication date Dec 17, 2020
- Kateeva, Inc.
- Moshe FRENKEL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200107439
- Publication date Apr 2, 2020
- IBIDEN CO., LTD.
- Yuji IKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER T...
- Publication number 20190364665
- Publication date Nov 28, 2019
- C3NANO INC.
- Xiqiang Yang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING...
- Publication number 20190132957
- Publication date May 2, 2019
- THE CURATORS OF THE UNIVERSITY OF MISSOURI
- Jay A. Switzer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER PLASMA ETCHING METHOD AND MANUFACTURING METHOD OF DISPLAY PANEL
- Publication number 20190103287
- Publication date Apr 4, 2019
- SAMSUNG DISPLAY CO., LTD.
- Sang Gab KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20180146556
- Publication date May 24, 2018
- Jet Cu Pcb Ltd.
- Moshe FRENKEL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT SUBSTRATE AND MASK STRUCTURE AND MA...
- Publication number 20180070452
- Publication date Mar 8, 2018
- Unimicron Technology Corp.
- Pu-Ju Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE METALLIZATION OF AN INTEGRATED CIRCUIT (IC) SUBSTRATE
- Publication number 20180033707
- Publication date Feb 1, 2018
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURI...
- Publication number 20170280554
- Publication date Sep 28, 2017
- NIPPON MEKTRON, LTD.
- Ryoichi TOYOSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS
- Publication number 20170275767
- Publication date Sep 28, 2017
- Atotech Deutschland GmbH
- Markku LAGER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A DOUBLE-SIDED PRINTED CIRCUIT BOARD
- Publication number 20160262271
- Publication date Sep 8, 2016
- OBSCHCHESTVO S OGRANICHENNOY OTVETSTVENNOSTYU "KOMPANIYA RMT"
- Aleksandr Aleksandrovich NAZARENKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

consisting of metals or alloys or metallic inorganic compounds

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems of forming metal interconnect layers using engi...

Printed circuit board and method of manufacturing the same

Anisotropic etching using photosensitive compound

Method of manufacturing printed circuit board and resist laminate f...

Printed wiring board and method for manufacturing printed wiring board

Catalyzed metal foil and uses thereof

Methods and systems of forming metal interconnect layers using engi...

Methods for producing an etch resist pattern on a metallic surface

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Metal foils with ordered crystal structure and method for producing...

Copper plasma etching method and manufacturing method of display panel

Methods for producing an etch resist pattern on a metallic surface

Selective metallization of an integrated circuit (IC) substrate

Method of fabricating tamper-respondent sensor

Tamper-respondent sensors with formed flexible layer(s)

Method of manufacturing a multilayer flexible printed circuit board

Method for producing substrate formed with copper thin layer, metho...

Method of forming stacked wiring

Method for manufacturing a printed circuit board

Preparation method of patterned film, display substrate and display...

Packaging substrate and method of fabricating the same

Ceramic circuit board and process for producing same

Manufacturing method of circuit board

Manufacturing method of circuit structure

Substrate for mounting semiconductor chip and method for producing...

Method of manufacturing a capacitor-embedded printed circuit board

Manufacturing method of circuit structure

Circuit structure and manufacturing method thereof

Ceramic circuit board and process for producing same

Circuit structure and manufacturing method thereof

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

CIRCUIT BOARD WITH LOW GRAIN BOUNDARY DENSITY AND FORMING METHOD TH...

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

PRINTED WIRING BOARD

WIRING CIRCUIT BOARD

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

METHOD FOR MANUFACTURING CIRCUIT BOARD AND STACKED STRUCTURE

METHOD OF PRODUCING PRINTED CIRCUIT BOARDS

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...

SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER T...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Anisotropic Etching Using Photosensitive Compound

CATALYZED METAL FOIL AND USES THEREOF

ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

SILVER-BASED TRANSPARENT CONDUCTIVE LAYERS INTERFACED WITH COPPER T...

METAL FOILS WITH ORDERED CRYSTAL STRUCTURE AND METHOD FOR PRODUCING...

COPPER PLASMA ETCHING METHOD AND MANUFACTURING METHOD OF DISPLAY PANEL

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE AND MASK STRUCTURE AND MA...

SELECTIVE METALLIZATION OF AN INTEGRATED CIRCUIT (IC) SUBSTRATE

MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURI...

COMPOSITION AND METHOD FOR MICRO ETCHING OF COPPER AND COPPER ALLOYS

METHOD FOR MANUFACTURING A DOUBLE-SIDED PRINTED CIRCUIT BOARD