containing O

Industry

CPC
H05K1/0326

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0326containing O

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 12,052,814
- Issue date Jul 30, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating medium rubber film and production method thereof and mul...
- Patent number 11,993,704
- Issue date May 28, 2024
- SHENZHEN NEWFILMS NEW MATERIAL TECHNOLOGY CO., LTD
- Yueshan He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, and prepreg, resin-coated film, resin-coated met...
- Patent number 11,945,910
- Issue date Apr 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroaki Umehara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,931,177
- Issue date Mar 19, 2024
- General Electric Company
- Jussi Halinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Backlit user interface
- Patent number 11,910,524
- Issue date Feb 20, 2024
- Molex, LLC
- Steven Fulton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Curable composition and cured product thereof
- Patent number 11,901,249
- Issue date Feb 13, 2024
- DIC Corporation
- Yutaka Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film and laminate
- Patent number 11,879,041
- Issue date Jan 23, 2024
- Sumitomo Chemical Company, Limited
- Shohei Azami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film and laminate
- Patent number 11,773,226
- Issue date Oct 3, 2023
- Sumitomo Chemical Company, Limited
- Shohei Azami
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin, copper clad laminate made of resin, and printed circuit board
- Patent number 11,773,262
- Issue date Oct 3, 2023
- A.C.R. TECH CO., LTD.
- Shih-Hao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, metal foil with resin, laminate, printe...
- Patent number 11,691,389
- Issue date Jul 4, 2023
- Resonac Corporation
- Yuya Hirayama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, and prepreg and circuit material using the same
- Patent number 11,584,851
- Issue date Feb 21, 2023
- SHENGYI TECHNOLOGY CO., LTD.
- Jianying Shi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Backlit user interface
- Patent number 11,589,456
- Issue date Feb 21, 2023
- Molex, LLC
- Steven Fulton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,547,355
- Issue date Jan 10, 2023
- General Electric Company
- Juha Petri Virtanen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit-including film
- Patent number 11,541,640
- Issue date Jan 3, 2023
- Kuraray Europe GmbH
- Yuhi Shimazumi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 11,516,904
- Issue date Nov 29, 2022
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, metal foil provided with resin layer, metal clad...
- Patent number 11,419,210
- Issue date Aug 16, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for inkjet printing and printed wiring board prep...
- Patent number 11,390,766
- Issue date Jul 19, 2022
- MICROCRAFT KOREA CO., LTD.
- Yorio Hidehira
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 11,370,857
- Issue date Jun 28, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Component carrier with exposed layer
- Patent number 11,277,907
- Issue date Mar 15, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature-vulcanizing silane-containing resin composition an...
- Patent number 11,274,225
- Issue date Mar 15, 2022
- Shin-Etsu Chemical Co., Ltd.
- Akitsugu Fujiwara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Printed circuit board deformable in both length and width
- Patent number 11,246,212
- Issue date Feb 8, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of nanowire films
- Patent number 11,240,917
- Issue date Feb 1, 2022
- TECHNOLOGY INNOVATION MOMENTUM FUND (ISRAEL) LIMITED PARTNERSHIP
- Gil Markovich
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 11,206,730
- Issue date Dec 21, 2021
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High Tg epoxy formulation with good thermal properties
- Patent number 11,155,687
- Issue date Oct 26, 2021
- Isola USA Corp.
- David Bedner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aliphatic polycarbonate resin for forming partition, partition mate...
- Patent number 11,142,611
- Issue date Oct 12, 2021
- Sumitomo Seika Chemicals Co., Ltd.
- Kiyoshi Nishioka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition
- Patent number 11,111,382
- Issue date Sep 7, 2021
- Sumitomo Seika Chemicals Co., Ltd.
- Noriaki Fukuda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Touch sensor and manufacturing method thereof
- Patent number 11,086,465
- Issue date Aug 10, 2021
- SAMSUNG DISPLAY CO., LTD.
- Won Il Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Covalently-bound polybromocyclododecane flame retardants
- Patent number 11,072,744
- Issue date Jul 27, 2021
- International Business Machines Corporation
- Brandon M. Kobilka
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20240384022
- Publication date Nov 21, 2024
- Elite Electronic Material (kunShan) Co., Ltd.
- Yan ZHANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
- Publication number 20240389227
- Publication date Nov 21, 2024
- JSR Corporation
- Ryouji TATARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...
- Publication number 20240287360
- Publication date Aug 29, 2024
- AJINOMOTO CO., INC.
- Kenji KAWAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANODE FOR HIGH-ENERGY BATTERIES
- Publication number 20240258513
- Publication date Aug 1, 2024
- HYDRO-QUEBEC
- Karim ZAGHIB
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240096378
- Publication date Mar 21, 2024
- Kabushiki Kaisha Toshiba
- Nobuhiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET
- Publication number 20240034874
- Publication date Feb 1, 2024
- AJINOMOTO CO., INC.
- Shu IKEHIRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYESTER RESIN
- Publication number 20230391949
- Publication date Dec 7, 2023
- AJINOMOTO CO., INC.
- Ichiro OGURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORORESIN FILM, COPPER-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT
- Publication number 20230363090
- Publication date Nov 9, 2023
- DAIKIN INDUSTRIES, LTD.
- Hirokazu KOMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL, FLEXIBLE COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT MAD...
- Publication number 20230354517
- Publication date Nov 2, 2023
- DUPONT ELECTRONICS, INC.
- Shih-Ching LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PR...
- Publication number 20230323000
- Publication date Oct 12, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Hiroaki UMEHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER FILM AND LAMINATE
- Publication number 20230303836
- Publication date Sep 28, 2023
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- B32 - LAYERED PRODUCTS
Information Patent Application
PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN...
- Publication number 20230272155
- Publication date Aug 31, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masahiro SOH
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF
- Publication number 20230227601
- Publication date Jul 20, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masahiro SOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY HAVING COPPER FOIL AND EPOXY RESIN COMPOSITION LAYER
- Publication number 20230128897
- Publication date Apr 27, 2023
- Sumitomo Seika Chemicals Co., Ltd.
- Ryota HARISAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
BACKLIT USER INTERFACE
- Publication number 20230120952
- Publication date Apr 20, 2023
- Molex, LLC
- Steven FULTON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE HYBRID INTERCONNECT CIRCUITS
- Publication number 20230116550
- Publication date Apr 13, 2023
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC LIQUID CRYSTAL POLYMER MOLDED BODY, METAL-CLAD LAMINA...
- Publication number 20230105357
- Publication date Apr 6, 2023
- Kuraray Co., Ltd
- Shoma SASAKI
- B32 - LAYERED PRODUCTS
Information Patent Application
CAPACITIVE LEADWIRE FOR PHYSIOLOGICAL PATIENT MONITORING
- Publication number 20230043358
- Publication date Feb 9, 2023
- GENERAL ELECTRIC COMPANY
- Jussi Halinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM AND LAMINATE FOR ELECTRONIC BOARD, AND ELECTRONIC BOARD COMPRI...
- Publication number 20220348713
- Publication date Nov 3, 2022
- SKC CO., LTD.
- Young Min HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWIN-MONOMER COMPOSITION AND DIELECTRIC FILM THEREOF
- Publication number 20220324885
- Publication date Oct 13, 2022
- BASF SE
- Szilard CSIHONY
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20220155681
- Publication date May 19, 2022
- Hayato SAWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM AND LAMINATE
- Publication number 20220153937
- Publication date May 19, 2022
- Sumitomo Chemical Company, Limited
- Shohei AZAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...
- Publication number 20220112414
- Publication date Apr 14, 2022
- AJINOMOTO CO., INC.
- Kenji KAWAI
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE HYBRID INTERCONNECT CIRCUITS
- Publication number 20220078902
- Publication date Mar 10, 2022
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING MEDIUM RUBBER FILM AND PRODUCTION METHOD THEREOF AND MUL...
- Publication number 20220033642
- Publication date Feb 3, 2022
- SHENZHEN NEWCCESS INDUSTRIAL CO., LTD.
- Yueshan HE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE PRINTED ARTICLES
- Publication number 20220007515
- Publication date Jan 6, 2022
- Hewlett-Packard Development Company, L.P.
- Robert C. Ionescu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL-CLAD LAMINATE, WIRING BOARD, METAL FOIL PROVIDED WITH RESIN,...
- Publication number 20210395452
- Publication date Dec 23, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya ARISAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE EPOXY RESIN COMPOSITION FOR FORMATION OF OPTICAL WAV...
- Publication number 20210277173
- Publication date Sep 9, 2021
- NITTO DENKO CORPORATION
- Kazuaki Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20210206892
- Publication date Jul 8, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

containing O

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible hybrid interconnect circuits

Insulating medium rubber film and production method thereof and mul...

Resin composition, and prepreg, resin-coated film, resin-coated met...

Capacitive leadwire for physiological patient monitoring

Backlit user interface

Curable composition and cured product thereof

Film and laminate

Film and laminate

Resin, copper clad laminate made of resin, and printed circuit board

Resin composition, prepreg, metal foil with resin, laminate, printe...

Resin composition, and prepreg and circuit material using the same

Backlit user interface

Capacitive leadwire for physiological patient monitoring

Circuit-including film

Flexible hybrid interconnect circuits

Application specific electronics packaging systems, methods and dev...

Resin composition, metal foil provided with resin layer, metal clad...

Resin composition for inkjet printing and printed wiring board prep...

Resin composition, resin sheet, multilayer printed wiring board, an...

Component carrier with exposed layer

Room temperature-vulcanizing silane-containing resin composition an...

Printed circuit board deformable in both length and width

Printing of nanowire films

Flexible hybrid interconnect circuits

High Tg epoxy formulation with good thermal properties

Aliphatic polycarbonate resin for forming partition, partition mate...

Bare die integration with printed components on flexible substrate...

Epoxy resin composition

Touch sensor and manufacturing method thereof

Covalently-bound polybromocyclododecane flame retardants

Patents Applicationslast 30 patents

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

Flexible Hybrid Interconnect Circuits

RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...

ANODE FOR HIGH-ENERGY BATTERIES

ELECTRONIC DEVICE

RESIN SHEET

POLYESTER RESIN

FLUORORESIN FILM, COPPER-CLAD LAMINATE AND SUBSTRATE FOR CIRCUIT

COPPER FOIL, FLEXIBLE COPPER-CLAD LAMINATE, AND PRINTED CIRCUIT MAD...

RESIN COMPOSITION, PREPREG, FILM PROVIDED WITH RESIN, METAL FOIL PR...

POLYMER FILM AND LAMINATE

PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN...

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

LAMINATED BODY HAVING COPPER FOIL AND EPOXY RESIN COMPOSITION LAYER

BACKLIT USER INTERFACE

FLEXIBLE HYBRID INTERCONNECT CIRCUITS

THERMOPLASTIC LIQUID CRYSTAL POLYMER MOLDED BODY, METAL-CLAD LAMINA...

CAPACITIVE LEADWIRE FOR PHYSIOLOGICAL PATIENT MONITORING

FILM AND LAMINATE FOR ELECTRONIC BOARD, AND ELECTRONIC BOARD COMPRI...

TWIN-MONOMER COMPOSITION AND DIELECTRIC FILM THEREOF

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

FILM AND LAMINATE

RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...

FLEXIBLE HYBRID INTERCONNECT CIRCUITS

INSULATING MEDIUM RUBBER FILM AND PRODUCTION METHOD THEREOF AND MUL...

FLEXIBLE PRINTED ARTICLES

METAL-CLAD LAMINATE, WIRING BOARD, METAL FOIL PROVIDED WITH RESIN,...

PHOTOSENSITIVE EPOXY RESIN COMPOSITION FOR FORMATION OF OPTICAL WAV...

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...