containing printed circuit boards [PCB]

Industry

CPC
G02B6/428

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/428containing printed circuit boards [PCB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical module with detachable optical port, and test method of AOC...
- Patent number 12,270,849
- Issue date Apr 8, 2025
- Wuhan HGGenuine Optics Tech Co., Ltd.
- Kun Shu
- G02 - OPTICS
Information Patent Grant
Reverse clamping compression device for CPO or NPO
- Patent number 12,271,045
- Issue date Apr 8, 2025
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Chao Sun
- G02 - OPTICS
Information Patent Grant
Opto-electric hybrid board
- Patent number 12,271,044
- Issue date Apr 8, 2025
- Nitto Denko Corporation
- Naoyuki Tanaka
- G02 - OPTICS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Optical structure, optical coupling method, and photonic integrated...
- Patent number 12,259,588
- Issue date Mar 25, 2025
- NANJING GUANGZHIYUAN TECHNOLOGY CO., LTD.
- Yichen Shen
- G02 - OPTICS
Information Patent Grant
Fiber shuffle embedded optical connector
- Patent number 12,253,724
- Issue date Mar 18, 2025
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Biased connector system
- Patent number 12,248,190
- Issue date Mar 11, 2025
- Molex, LLC
- Gianni Ryan Bardella
- G02 - OPTICS
Information Patent Grant
Device for optical applications
- Patent number 12,247,877
- Issue date Mar 11, 2025
- FiSensGmbh
- Christian Waltermann
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically intra-die bridged assembly
- Patent number 12,242,122
- Issue date Mar 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multi-layer planar waveguide interconnects
- Patent number 12,242,102
- Issue date Mar 4, 2025
- AvicenaTech, Corp.
- Robert Kalman
- G02 - OPTICS
Information Patent Grant
Optoelectronic module, optoelectronic plug connector and optoelectr...
- Patent number 12,242,120
- Issue date Mar 4, 2025
- Harting Electronics GmbH
- Andreas Schwarz
- G02 - OPTICS
Information Patent Grant
Fiber optic cassette arrangement
- Patent number 12,235,505
- Issue date Feb 25, 2025
- CommScope Technologies LLC
- Cyle D. Petersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Manufacturing method and application of optical interconnection module
- Patent number 12,235,498
- Issue date Feb 25, 2025
- Electronics and Telecommunications Research Institute
- Sae-Kyoung Kang
- G02 - OPTICS
Information Patent Grant
Multi-channel optical sub-assembly
- Patent number 12,216,317
- Issue date Feb 4, 2025
- Electronics and Telecommunications Research Institute
- Eun Kyu Kang
- G02 - OPTICS
Information Patent Grant
External laser source physical contact verification of a fiber opti...
- Patent number 12,216,316
- Issue date Feb 4, 2025
- US Conec Ltd.
- Michael E. Hughes
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical bridging element for separately stacked electrical ICs
- Patent number 12,216,318
- Issue date Feb 4, 2025
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Interposer with feedback
- Patent number 12,204,149
- Issue date Jan 21, 2025
- TE Connectivity Solutions GmbH
- Jacobus Nicolaas Tuin
- G02 - OPTICS
Information Patent Grant
Connector assembly
- Patent number 12,199,381
- Issue date Jan 14, 2025
- Molex, LLC
- Sheng-Ping Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,189,193
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser apparatus
- Patent number 12,184,038
- Issue date Dec 31, 2024
- Furukawa Electric Co., Ltd.
- Yoshiki Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,169,312
- Issue date Dec 17, 2024
- Ibiden Co., Ltd.
- Keisuke Shimizu
- G02 - OPTICS
Information Patent Grant
Compact micro bench for optical transceiver sub-assembly
- Patent number 12,169,313
- Issue date Dec 17, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Wing Keung Mark Mak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multichannel optical tap devices
- Patent number 12,164,149
- Issue date Dec 10, 2024
- Panduit Corp.
- Jose M. Castro
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for increased volumetric and functional efficiencies o...
- Patent number 12,153,268
- Issue date Nov 26, 2024
- Apple Inc.
- Scott D. Morrison
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
MULTICHANNEL OPTICAL TAP DEVICES
- Publication number 20250116811
- Publication date Apr 10, 2025
- Panduit Corp.
- Jose M. Castro
- G02 - OPTICS
Information Patent Application
Optical Module
- Publication number 20250110297
- Publication date Apr 3, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Tao WU
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS
- Publication number 20250110303
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Stefan RUSU
- G02 - OPTICS
Information Patent Application
ACTIVE OPTICAL CABLE AND METHOD FOR SWITCHING COMMUNICATION MODE TH...
- Publication number 20250112699
- Publication date Apr 3, 2025
- EverPro Technologies Company Limited
- Weiran Cao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICALLY INTERCONNECTED PROCESSOR AND MEMORY MODULES
- Publication number 20250110299
- Publication date Apr 3, 2025
- AvicenaTech, Corp.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HOUSING STRUCTURE OF OPTICAL MODULE AND OPTICAL MODULECONTAINING TH...
- Publication number 20250102747
- Publication date Mar 27, 2025
- Source Photonics (Chengdu) Co.,Ltd.
- Libing ZHU
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250102749
- Publication date Mar 27, 2025
- ABSOLICS INC.
- Sungjin KIM
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250102750
- Publication date Mar 27, 2025
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin LIU
- G02 - OPTICS
Information Patent Application
ROBUST WAVEGUIDE ALIGNMENT MECHANISM
- Publication number 20250102745
- Publication date Mar 27, 2025
- Intel Corporation
- Mohanraj Prabhugoud
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250102748
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE ASSEMBLY
- Publication number 20250093599
- Publication date Mar 20, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Won-Bae KWON
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250093598
- Publication date Mar 20, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Wanju Sun
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND OPTICAL CONNECTOR CABLE
- Publication number 20250085493
- Publication date Mar 13, 2025
- Sumitomo Electric Industries, Ltd.
- Kensaku SHIMADA
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT CHIP
- Publication number 20250085496
- Publication date Mar 13, 2025
- Wistron Corporation
- Ching Pao Sun
- G02 - OPTICS
Information Patent Application
PACKAGING STRUCTURE OF OPTOELECTRONIC ASSEMBLY, OPTOELECTRONIC ASSE...
- Publication number 20250076598
- Publication date Mar 6, 2025
- EverPro (Wuhan) Technologies Company Limited.
- Qunze Wang
- G02 - OPTICS
Information Patent Application
OPTICAL RECEIVING MODULE ASSEMBLY
- Publication number 20250076601
- Publication date Mar 6, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Won-Bae KWON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERPOSER WITH PLANAR SIDEWALL SURFACE FOR OPTICAL COUPLING AND ME...
- Publication number 20250076599
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
PHOTONIC CHIP, LIDAR, AND MOBILE DEVICE
- Publication number 20250076600
- Publication date Mar 6, 2025
- SUTENG INNOVATION TECHNOLOGY CO., LTD.
- Hao Wang
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250067946
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AND OPTICAL FIBER INTERFACE
- Publication number 20250060547
- Publication date Feb 20, 2025
- CommScope Technologies LLC
- Thomas P. HUEGERICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SHIELDING ELECTROMAGNETIC INTEFERENCE IN P...
- Publication number 20250060545
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Venkatesh Seetharam
- G02 - OPTICS
Information Patent Application
PHOTONIC ASSEMBLY INCLUDING AN EMBEDDED OPTICAL CONNECTOR DIE AND M...
- Publication number 20250052962
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20250052966
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Yi HUANG
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE
- Publication number 20250052959
- Publication date Feb 13, 2025
- Kyocera Corporation
- Saki TSUJINO
- G02 - OPTICS
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20250038163
- Publication date Jan 30, 2025
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20250035868
- Publication date Jan 30, 2025
- Sumitomo Electric Industries, Ltd.
- Taisuke NAGASAKI
- G02 - OPTICS
Information Patent Application
YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM
- Publication number 20250028130
- Publication date Jan 23, 2025
- Lightmatter, Inc
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Application
SYSTEM FOR DETERMINING OPTICAL PROBE LOCATION RELATIVE TO A PHOTONI...
- Publication number 20250020880
- Publication date Jan 16, 2025
- KEYSIGHT TECHNOLOGIES, INC.
- Christopher Coleman
- G02 - OPTICS
Information Patent Application
OPTO-ELECTRONIC ASSEMBLY
- Publication number 20250020878
- Publication date Jan 16, 2025
- Hilight Semiconductor Limited
- Carl CARLEY
- G02 - OPTICS

containing printed circuit boards [PCB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical module with detachable optical port, and test method of AOC...

Reverse clamping compression device for CPO or NPO

Opto-electric hybrid board

Heatsink for co-packaged optical switch rack package

Optical structure, optical coupling method, and photonic integrated...

Fiber shuffle embedded optical connector

Biased connector system

Device for optical applications

Multicomponent photonically intra-die bridged assembly

Multi-layer planar waveguide interconnects

Optoelectronic module, optoelectronic plug connector and optoelectr...

Fiber optic cassette arrangement

Manufacturing method and application of optical interconnection module

Multi-channel optical sub-assembly

External laser source physical contact verification of a fiber opti...

Optical bridging element for separately stacked electrical ICs

Interposer with feedback

Connector assembly

Semiconductor package

Laser apparatus

Apparatus and methods for optical interconnects

Semiconductor package

Compact micro bench for optical transceiver sub-assembly

Multichannel optical tap devices

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

High speed network device with orthogonal pluggable optics modules

Optical module

Active optical coupler

Technologies for increased volumetric and functional efficiencies o...

Patents Applicationslast 30 patents

MULTICHANNEL OPTICAL TAP DEVICES

Optical Module

APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS

ACTIVE OPTICAL CABLE AND METHOD FOR SWITCHING COMMUNICATION MODE TH...

OPTICALLY INTERCONNECTED PROCESSOR AND MEMORY MODULES

HOUSING STRUCTURE OF OPTICAL MODULE AND OPTICAL MODULECONTAINING TH...

MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ROBUST WAVEGUIDE ALIGNMENT MECHANISM

SEMICONDUCTOR PACKAGE

OPTICAL MODULE ASSEMBLY

OPTICAL MODULE

OPTICAL MODULE AND OPTICAL CONNECTOR CABLE

PHOTONIC INTEGRATED CIRCUIT CHIP

PACKAGING STRUCTURE OF OPTOELECTRONIC ASSEMBLY, OPTOELECTRONIC ASSE...

OPTICAL RECEIVING MODULE ASSEMBLY

INTERPOSER WITH PLANAR SIDEWALL SURFACE FOR OPTICAL COUPLING AND ME...

PHOTONIC CHIP, LIDAR, AND MOBILE DEVICE

OPTICAL DEVICES AND METHODS OF MANUFACTURE

POWER AND OPTICAL FIBER INTERFACE

METHOD AND STRUCTURE FOR SHIELDING ELECTROMAGNETIC INTEFERENCE IN P...

PHOTONIC ASSEMBLY INCLUDING AN EMBEDDED OPTICAL CONNECTOR DIE AND M...

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

OPTICAL MODULE

YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM

SYSTEM FOR DETERMINING OPTICAL PROBE LOCATION RELATIVE TO A PHOTONI...

OPTO-ELECTRONIC ASSEMBLY