containing printed circuit boards [PCB]

Industry

CPC
G02B6/428

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/428containing printed circuit boards [PCB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laser apparatus
- Patent number 12,184,038
- Issue date Dec 31, 2024
- Furukawa Electric Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,169,312
- Issue date Dec 17, 2024
- Ibiden Co., Ltd.
- Keisuke Shimizu
- G02 - OPTICS
Information Patent Grant
Compact micro bench for optical transceiver sub-assembly
- Patent number 12,169,313
- Issue date Dec 17, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Wing Keung Mark Mak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multichannel optical tap devices
- Patent number 12,164,149
- Issue date Dec 10, 2024
- Panduit Corp.
- Jose M. Castro
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for increased volumetric and functional efficiencies o...
- Patent number 12,153,268
- Issue date Nov 26, 2024
- Apple Inc.
- Scott D. Morrison
- G02 - OPTICS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical cable connector and board connector
- Patent number 12,140,808
- Issue date Nov 12, 2024
- Samtec, Inc.
- Jignesh H. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated coherent optical transceiver, light engine
- Patent number 12,136,951
- Issue date Nov 5, 2024
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Yield enhancement techniques for photonic communications platform
- Patent number 12,130,484
- Issue date Oct 29, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Photonic coupler
- Patent number 12,117,659
- Issue date Oct 15, 2024
- X Development LLC
- Yi-Kuei Ryan Wu
- G02 - OPTICS
Information Patent Grant
Circuit substrate light coupler
- Patent number 12,107,390
- Issue date Oct 1, 2024
- Ultra Communications, Inc.
- Charles B. Kuznia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fiber signal direct guided optical module
- Patent number 12,105,334
- Issue date Oct 1, 2024
- SHENZHEN AFALIGHT CO., LTD.
- Junbin Huang
- G02 - OPTICS
Information Patent Grant
Optical assemblies comprising a prism
- Patent number 12,105,333
- Issue date Oct 1, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,092,861
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board connector for optical waveguides
- Patent number 12,092,883
- Issue date Sep 17, 2024
- MD Elektronik GmbH
- Helmut Pritz
- G02 - OPTICS
Information Patent Grant
Optical electrical connector with improved heat dissipation perform...
- Patent number 12,092,882
- Issue date Sep 17, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Yi-Tseng Lin
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,092,881
- Issue date Sep 17, 2024
- InnoLight Technology Pte. Ltd.
- Yuzhou Sun
- G02 - OPTICS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 12,087,987
- Issue date Sep 10, 2024
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SUBSTRATE COUPLING FOR PHOTONIC INTEGRATED CIRCUITS
- Publication number 20240427095
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ravi Prakash Srivastava
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME
- Publication number 20240411093
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- G02 - OPTICS
Information Patent Application
MEMS OPTICAL CIRCUIT SWITCH
- Publication number 20240409393
- Publication date Dec 12, 2024
- nEYE Systems, Inc.
- Xiaosheng ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL MODULE
- Publication number 20240402444
- Publication date Dec 5, 2024
- CIG Photonics Japan Limited
- Takuma BAN
- G02 - OPTICS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240402441
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Kuo-Hao LEE
- G02 - OPTICS
Information Patent Application
ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES
- Publication number 20240385400
- Publication date Nov 21, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Amit Oren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240369783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20240369785
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
Management interface handler to expedite module boot time in plugga...
- Publication number 20240369786
- Publication date Nov 7, 2024
- CIENA CORPORATION
- Michael J. Wingrove
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL TRANSMITTER AND PHOTONIC INTEGRATED CIRCUIT THEREOF
- Publication number 20240361548
- Publication date Oct 31, 2024
- Wistron Corporation
- Cheng-Hung LU
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240361520
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGING SEMICONDUCTOR DEVICES WITH SCALAB...
- Publication number 20240361547
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT HAVING ARRAY OF PHOTONIC DEVICES
- Publication number 20240361550
- Publication date Oct 31, 2024
- II-VI Delaware, Inc.
- Argishti Melikyan
- G02 - OPTICS
Information Patent Application
A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...
- Publication number 20240361544
- Publication date Oct 31, 2024
- ALTICE LABS, S.A.
- Cláudio Emanuel GOMES FERREIRINHO LIMA RODRIGUES
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTELLIGENT FIBER PORT MANAGEMENT
- Publication number 20240357264
- Publication date Oct 24, 2024
- Fiber Mountain, Inc.
- Mohammad H. Raza
- G08 - SIGNALLING
Information Patent Application
MANAGING RELATIVE THERMAL DRIFT OF CARRIER-MOUNTED INTEGRATED CIRCUITS
- Publication number 20240353634
- Publication date Oct 24, 2024
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC CONVERSION MODULE PLUG AND OPTICAL CABLE
- Publication number 20240353636
- Publication date Oct 24, 2024
- Nitto Denko Corporation
- Naoyuki TANAKA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE
- Publication number 20240353631
- Publication date Oct 24, 2024
- Intel Corporation
- Vivek RAGHUNATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDING COMPONENT, OPTICAL FIBER ADAPTER MODULE HAVING THE SA...
- Publication number 20240345346
- Publication date Oct 17, 2024
- Cloud Light Technology Limited
- CHIEH-TSE HUANG
- G02 - OPTICS
Information Patent Application
WAVELENGTH-DETECTING OPTICAL FIBER INDENTIFIER APPARATUS AND METHOD
- Publication number 20240345347
- Publication date Oct 17, 2024
- AFL TELECOMMUNICATIONS LLC
- Bin Liu
- G01 - MEASURING TESTING
Information Patent Application
PHOTON INFORMATION FIELD ENABLING MULTIPLE DYNAMIC INTERCONNECTIONS...
- Publication number 20240345348
- Publication date Oct 17, 2024
- Valère Fontaine-Picoureix
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MAGNETIC-FIELD-TUNABLE TERAHERTZ OPTOELECTRONIC TRANSDUCER
- Publication number 20240345338
- Publication date Oct 17, 2024
- Wisconsin Alumni Research Foundation
- Jiamian Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
Platform Supports the Shortest Direct Electrical Connections betwee...
- Publication number 20240337798
- Publication date Oct 10, 2024
- Shuang Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...
- Publication number 20240329343
- Publication date Oct 3, 2024
- Nitto Denko Corporation
- Atsushi Yamagishi
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SUBASSEMBLY, AND OPTICAL MODULE
- Publication number 20240332908
- Publication date Oct 3, 2024
- Lumentum Japan, Inc.
- Atsushi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Transmitter
- Publication number 20240322910
- Publication date Sep 26, 2024
- Nippon Telegraph and Telephone Corporation
- Shigeru Kanazawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL FIBER MODULE
- Publication number 20240319459
- Publication date Sep 26, 2024
- Sumitomo Electric Industries, Ltd.
- Hong Chuyen NGUYEN
- G02 - OPTICS

containing printed circuit boards [PCB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser apparatus

Apparatus and methods for optical interconnects

Semiconductor package

Compact micro bench for optical transceiver sub-assembly

Multichannel optical tap devices

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

High speed network device with orthogonal pluggable optics modules

Optical module

Active optical coupler

Technologies for increased volumetric and functional efficiencies o...

Active bridge enabled co-packaged photonic transceiver

Co-packaging photonic integrated circuits and application specific...

Optical multichip package with multiple system-on-chip dies

Electrical cable connector and board connector

Transceiver and interface for IC package

Integrated coherent optical transceiver, light engine

Yield enhancement techniques for photonic communications platform

Stacked-dies optically bridged multicomponent package

Optical module

Optical multi-die interconnect bridge with optical interface

Photonic coupler

Circuit substrate light coupler

Optical fiber signal direct guided optical module

Optical assemblies comprising a prism

Photonic semiconductor device and method of manufacture

Circuit board connector for optical waveguides

Optical electrical connector with improved heat dissipation perform...

Optical module

Printed circuit boards and methods for manufacturing thereof for RF...

Patents Applicationslast 30 patents

MULTI-SUBSTRATE COUPLING FOR PHOTONIC INTEGRATED CIRCUITS

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME

MEMS OPTICAL CIRCUIT SWITCH

OPTICAL MODULE

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

Management interface handler to expedite module boot time in plugga...

OPTICAL TRANSMITTER AND PHOTONIC INTEGRATED CIRCUIT THEREOF

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SYSTEMS AND METHODS FOR PACKAGING SEMICONDUCTOR DEVICES WITH SCALAB...

PHOTONIC INTEGRATED CIRCUIT HAVING ARRAY OF PHOTONIC DEVICES

A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...

INTELLIGENT FIBER PORT MANAGEMENT

MANAGING RELATIVE THERMAL DRIFT OF CARRIER-MOUNTED INTEGRATED CIRCUITS

PHOTOELECTRIC CONVERSION MODULE PLUG AND OPTICAL CABLE

SEMICONDUCTOR PACKAGE WITH EMBEDDED OPTICAL DIE

EMI SHIELDING COMPONENT, OPTICAL FIBER ADAPTER MODULE HAVING THE SA...

WAVELENGTH-DETECTING OPTICAL FIBER INDENTIFIER APPARATUS AND METHOD

PHOTON INFORMATION FIELD ENABLING MULTIPLE DYNAMIC INTERCONNECTIONS...

MAGNETIC-FIELD-TUNABLE TERAHERTZ OPTOELECTRONIC TRANSDUCER

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

Platform Supports the Shortest Direct Electrical Connections betwee...

PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...

OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SUBASSEMBLY, AND OPTICAL MODULE

Optical Transmitter

OPTICAL FIBER MODULE