containing printed circuit boards [PCB]

Industry

CPC
G02B6/428

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/428containing printed circuit boards [PCB]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposer with feedback
- Patent number 12,204,149
- Issue date Jan 21, 2025
- TE Connectivity Solutions GmbH
- Jacobus Nicolaas Tuin
- G02 - OPTICS
Information Patent Grant
Connector assembly
- Patent number 12,199,381
- Issue date Jan 14, 2025
- Molex, LLC
- Sheng-Ping Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,189,193
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Keisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser apparatus
- Patent number 12,184,038
- Issue date Dec 31, 2024
- Furukawa Electric Co., Ltd.
- Yoshiki Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,169,312
- Issue date Dec 17, 2024
- Ibiden Co., Ltd.
- Keisuke Shimizu
- G02 - OPTICS
Information Patent Grant
Compact micro bench for optical transceiver sub-assembly
- Patent number 12,169,313
- Issue date Dec 17, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Wing Keung Mark Mak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multichannel optical tap devices
- Patent number 12,164,149
- Issue date Dec 10, 2024
- Panduit Corp.
- Jose M. Castro
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for increased volumetric and functional efficiencies o...
- Patent number 12,153,268
- Issue date Nov 26, 2024
- Apple Inc.
- Scott D. Morrison
- G02 - OPTICS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical cable connector and board connector
- Patent number 12,140,808
- Issue date Nov 12, 2024
- Samtec, Inc.
- Jignesh H. Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated coherent optical transceiver, light engine
- Patent number 12,136,951
- Issue date Nov 5, 2024
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Yield enhancement techniques for photonic communications platform
- Patent number 12,130,484
- Issue date Oct 29, 2024
- Lightmatter, Inc.
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Photonic coupler
- Patent number 12,117,659
- Issue date Oct 15, 2024
- X Development LLC
- Yi-Kuei Ryan Wu
- G02 - OPTICS
Information Patent Grant
Optical fiber signal direct guided optical module
- Patent number 12,105,334
- Issue date Oct 1, 2024
- SHENZHEN AFALIGHT CO., LTD.
- Junbin Huang
- G02 - OPTICS
Information Patent Grant
Circuit substrate light coupler
- Patent number 12,107,390
- Issue date Oct 1, 2024
- Ultra Communications, Inc.
- Charles B. Kuznia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical assemblies comprising a prism
- Patent number 12,105,333
- Issue date Oct 1, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- G02 - OPTICS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,092,861
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board connector for optical waveguides
- Patent number 12,092,883
- Issue date Sep 17, 2024
- MD Elektronik GmbH
- Helmut Pritz
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20250035868
- Publication date Jan 30, 2025
- Sumitomo Electric Industries, Ltd.
- Taisuke NAGASAKI
- G02 - OPTICS
Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20250038163
- Publication date Jan 30, 2025
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM
- Publication number 20250028130
- Publication date Jan 23, 2025
- Lightmatter, Inc
- Nicholas C. Harris
- G02 - OPTICS
Information Patent Application
SYSTEM FOR DETERMINING OPTICAL PROBE LOCATION RELATIVE TO A PHOTONI...
- Publication number 20250020880
- Publication date Jan 16, 2025
- KEYSIGHT TECHNOLOGIES, INC.
- Christopher Coleman
- G02 - OPTICS
Information Patent Application
OPTO-ELECTRONIC ASSEMBLY
- Publication number 20250020878
- Publication date Jan 16, 2025
- Hilight Semiconductor Limited
- Carl CARLEY
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250012987
- Publication date Jan 9, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Xiaokuo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL CIRCUIT
- Publication number 20250012988
- Publication date Jan 9, 2025
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER
- Publication number 20250004223
- Publication date Jan 2, 2025
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...
- Publication number 20250004206
- Publication date Jan 2, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
CONNECTOR ASSEMBLY WITH IMPROVED LIGHT GUIDE ELEMENT
- Publication number 20250004224
- Publication date Jan 2, 2025
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Bin HUANG
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS TO FACILITATE ALIGNMENT OF OPTICAL COMPONENTS
- Publication number 20250004217
- Publication date Jan 2, 2025
- Intel Corporation
- Waiyapot Suttawassuntorn
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVI...
- Publication number 20250004220
- Publication date Jan 2, 2025
- Intel Corporation
- Sufi R. Ahmed
- G02 - OPTICS
Information Patent Application
ADAPTERS FOR HETEROGENOUS OPTICAL CONNECTORS
- Publication number 20250004227
- Publication date Jan 2, 2025
- Intel Corporation
- Wesley B. Morgan
- G02 - OPTICS
Information Patent Application
MULTI-SUBSTRATE COUPLING FOR PHOTONIC INTEGRATED CIRCUITS
- Publication number 20240427095
- Publication date Dec 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ravi Prakash Srivastava
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20240427097
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME
- Publication number 20240411093
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- G02 - OPTICS
Information Patent Application
MEMS OPTICAL CIRCUIT SWITCH
- Publication number 20240409393
- Publication date Dec 12, 2024
- nEYE Systems, Inc.
- Xiaosheng ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL MODULE
- Publication number 20240402444
- Publication date Dec 5, 2024
- CIG Photonics Japan Limited
- Takuma BAN
- G02 - OPTICS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240402441
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Kuo-Hao LEE
- G02 - OPTICS
Information Patent Application
ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES
- Publication number 20240385400
- Publication date Nov 21, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Amit Oren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240369783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES
- Publication number 20240369785
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tse Tang
- G02 - OPTICS
Information Patent Application
Management interface handler to expedite module boot time in plugga...
- Publication number 20240369786
- Publication date Nov 7, 2024
- CIENA CORPORATION
- Michael J. Wingrove
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL TRANSMITTER AND PHOTONIC INTEGRATED CIRCUIT THEREOF
- Publication number 20240361548
- Publication date Oct 31, 2024
- Wistron Corporation
- Cheng-Hung LU
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240361520
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGING SEMICONDUCTOR DEVICES WITH SCALAB...
- Publication number 20240361547
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT HAVING ARRAY OF PHOTONIC DEVICES
- Publication number 20240361550
- Publication date Oct 31, 2024
- II-VI Delaware, Inc.
- Argishti Melikyan
- G02 - OPTICS
Information Patent Application
A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...
- Publication number 20240361544
- Publication date Oct 31, 2024
- ALTICE LABS, S.A.
- Cláudio Emanuel GOMES FERREIRINHO LIMA RODRIGUES
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTELLIGENT FIBER PORT MANAGEMENT
- Publication number 20240357264
- Publication date Oct 24, 2024
- Fiber Mountain, Inc.
- Mohammad H. Raza
- G08 - SIGNALLING

containing printed circuit boards [PCB]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer with feedback

Connector assembly

Semiconductor package

Laser apparatus

Apparatus and methods for optical interconnects

Semiconductor package

Compact micro bench for optical transceiver sub-assembly

Multichannel optical tap devices

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

High speed network device with orthogonal pluggable optics modules

Optical module

Active optical coupler

Technologies for increased volumetric and functional efficiencies o...

Active bridge enabled co-packaged photonic transceiver

Co-packaging photonic integrated circuits and application specific...

Optical multichip package with multiple system-on-chip dies

Electrical cable connector and board connector

Transceiver and interface for IC package

Integrated coherent optical transceiver, light engine

Yield enhancement techniques for photonic communications platform

Stacked-dies optically bridged multicomponent package

Optical module

Optical multi-die interconnect bridge with optical interface

Photonic coupler

Optical fiber signal direct guided optical module

Circuit substrate light coupler

Optical assemblies comprising a prism

Photonic semiconductor device and method of manufacture

Circuit board connector for optical waveguides

Patents Applicationslast 30 patents

OPTICAL MODULE

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

YIELD ENHANCEMENT TECHNIQUES FOR PHOTONIC COMMUNICATIONS PLATFORM

SYSTEM FOR DETERMINING OPTICAL PROBE LOCATION RELATIVE TO A PHOTONI...

OPTO-ELECTRONIC ASSEMBLY

OPTICAL MODULE

ELECTRO-OPTICAL CIRCUIT

PHOTONIC INTEGRATED CIRCUIT WITHIN A CAVITY OF INTERPOSER

STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...

CONNECTOR ASSEMBLY WITH IMPROVED LIGHT GUIDE ELEMENT

METHODS AND APPARATUS TO FACILITATE ALIGNMENT OF OPTICAL COMPONENTS

PHOTONIC INTEGRATED CIRCUIT AND OPTICAL COUPLER DESIGNS FOR IMPROVI...

ADAPTERS FOR HETEROGENOUS OPTICAL CONNECTORS

MULTI-SUBSTRATE COUPLING FOR PHOTONIC INTEGRATED CIRCUITS

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

SILICON-BASED OPTICAL COMPONENT AND METHOD OF FORMING THE SAME

MEMS OPTICAL CIRCUIT SWITCH

OPTICAL MODULE

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

PHOTONIC PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES WITH VERTICALLY STACKED WAVEGUIDES

Management interface handler to expedite module boot time in plugga...

OPTICAL TRANSMITTER AND PHOTONIC INTEGRATED CIRCUIT THEREOF

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SYSTEMS AND METHODS FOR PACKAGING SEMICONDUCTOR DEVICES WITH SCALAB...

PHOTONIC INTEGRATED CIRCUIT HAVING ARRAY OF PHOTONIC DEVICES

A DUAL XGS-PON 10 GIGABIT SMALL FORM FACTOR PLUGGABLE PLUS OPTICAL...

INTELLIGENT FIBER PORT MANAGEMENT