Cooling

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CPC
G02B6/4268

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4268Cooling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of recovery of optical fiber expended during launch of a spa...
- Patent number 12,210,192
- Issue date Jan 28, 2025
- Stone Aerospace, Inc.
- William C. Stone
- E21 - EARTH DRILLING MINING
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 12,210,199
- Issue date Jan 28, 2025
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical waveguide package and light-emitting device
- Patent number 12,181,723
- Issue date Dec 31, 2024
- Kyocera Corporation
- Yoshiaki Itakura
- G02 - OPTICS
Information Patent Grant
Active bridge enabled co-packaged photonic transceiver
- Patent number 12,148,742
- Issue date Nov 19, 2024
- Intel Corporation
- Thomas Liljeberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS
Information Patent Grant
System and method of refining optical fiber
- Patent number 12,117,663
- Issue date Oct 15, 2024
- Macleon, LLC
- Edward McKenna
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Silicon photonic package and method of fabricating the same
- Patent number 12,092,874
- Issue date Sep 17, 2024
- OIP TECHNOLOGY PTE LTD.
- Yonggang Jin
- G02 - OPTICS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breathable outdoor network terminal enclosure
- Patent number 12,078,858
- Issue date Sep 3, 2024
- FRONTIER COMMUNICATIONS HOLDINGS, LLC
- Erwin Wardojo
- G02 - OPTICS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic structure with heat-activated optical transmission
- Patent number 12,038,616
- Issue date Jul 16, 2024
- Viavi Solutions Inc.
- William D. Houck
- G02 - OPTICS
Information Patent Grant
Communication systems having pluggable modules
- Patent number 12,019,289
- Issue date Jun 25, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Grant
Electronic equipment and light transmission device with cold plate...
- Patent number 12,022,637
- Issue date Jun 25, 2024
- Fujitsu Limited
- Tsubasa Hashimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lamp for vehicle and vehicle including the same
- Patent number 11,988,348
- Issue date May 21, 2024
- Hyundai Mobis Co., Ltd.
- Hyun Soo Lee
- F21 - LIGHTING
Information Patent Grant
Liquid cooling high-density pluggable modules for a network element
- Patent number 11,980,009
- Issue date May 7, 2024
- Ciena Corporation
- Behzad Mohajer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Breathable outdoor network terminal enclosure
- Patent number 11,971,595
- Issue date Apr 30, 2024
- FRONTIER COMMUNICATIONS HOLDINGS, LLC
- Erwin Wardojo
- G02 - OPTICS
Information Patent Grant
Heterogeneous packaging integration of photonic and electronic elem...
- Patent number 11,966,090
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated photonics device having integrated edge outcouplers
- Patent number 11,960,131
- Issue date Apr 16, 2024
- Michael J. Bishop
- G02 - OPTICS
Information Patent Grant
Connector and method for manufacturing same
- Patent number 11,956,886
- Issue date Apr 9, 2024
- I-PEX Inc.
- Yoichi Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical receptacle connector for an optical communication system
- Patent number 11,906,801
- Issue date Feb 20, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Eric David Briant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of power and optics through cold plates for delivery to...
- Patent number 11,906,799
- Issue date Feb 20, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum fluctuation quantum random number generator chip based on ph...
- Patent number 11,853,720
- Issue date Dec 26, 2023
- SHRONG ENERGY TECHNOLOGY CO., LTD.
- Qiechun Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack-mountable equipment with a high-heat-dissipation module, and t...
- Patent number 11,828,908
- Issue date Nov 28, 2023
- SAMTEC, INC.
- Eric J. Zbinden
- G02 - OPTICS
Information Patent Grant
Optical transceiver
- Patent number 11,817,905
- Issue date Nov 14, 2023
- NEC Corporation
- Akira Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 11,774,692
- Issue date Oct 3, 2023
- InnoLight Technology (Suzhou) LTD.
- Long Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical fiber cable
- Patent number 11,774,695
- Issue date Oct 3, 2023
- Macleon, LLC
- Edward McKenna
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic structure using optical heater
- Patent number 11,733,468
- Issue date Aug 22, 2023
- Viavi Solutions Inc.
- William D. Houck
- G02 - OPTICS
Information Patent Grant
Optical transmission module
- Patent number 11,719,896
- Issue date Aug 8, 2023
- Sony Group Corporation
- Hiizu Ootorii
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
- Publication number 20250038163
- Publication date Jan 30, 2025
- Intel Corporation
- Zhichao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF REFINING OPTICAL FIBER
- Publication number 20250012994
- Publication date Jan 9, 2025
- Macleon, LLC
- Edward McKenna
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...
- Publication number 20240402442
- Publication date Dec 5, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC STRUCTURE WITH HEAT-ACTIVATED OPTICAL TRANSMISSION
- Publication number 20240329338
- Publication date Oct 3, 2024
- VIAVI SOLUTIONS INC.
- William D. HOUCK
- G02 - OPTICS
Information Patent Application
400G SILICON PHOTONIC PACKAGE WITH SELF-ALIGNED FIBER
- Publication number 20240280766
- Publication date Aug 22, 2024
- SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Mark Tieu Ming Seng
- G02 - OPTICS
Information Patent Application
LAMP FOR VEHICLE AND VEHICLE INCLUDING THE SAME
- Publication number 20240263754
- Publication date Aug 8, 2024
- HYUNDAI MOBIS CO., LTD.
- Hyun Soo LEE
- F21 - LIGHTING
Information Patent Application
HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEM...
- Publication number 20240241329
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Stefan RUSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE OPTOELECTRONIC TRANSCEIVER
- Publication number 20240231021
- Publication date Jul 11, 2024
- FORMERICA OPTOELECTRONICS INC.
- Peter Sin-Te Liu
- G02 - OPTICS
Information Patent Application
CONNECTOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20240215148
- Publication date Jun 27, 2024
- I-PEX Inc.
- Yoichi HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL EMISSION ASSEMBLY AND OPTICAL MODULE
- Publication number 20240210639
- Publication date Jun 27, 2024
- DONGGUAN XUNTAO ELECTRONIC CO., LTD.
- Chung-Hsin FU
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTOR, OPTICAL CONNECTOR CONNECTING STRUCTURE, AND OPTI...
- Publication number 20240176083
- Publication date May 30, 2024
- HAKUSAN INC.
- Motohito TAKEZAKI
- G02 - OPTICS
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES
- Publication number 20240159979
- Publication date May 16, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTOELECTRONIC TRANSCEIVER
- Publication number 20240134135
- Publication date Apr 25, 2024
- FORMERICA OPTOELECTRONICS INC.
- Peter Sin-Te Liu
- G02 - OPTICS
Information Patent Application
INTEGRATION OF POWER AND OPTICS THROUGH COLD PLATES FOR DELIVERY TO...
- Publication number 20240085646
- Publication date Mar 14, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RACK-MOUNTABLE EQUIPMENT WITH A HIGH-HEAT-DISSIPATION MODULE, AND T...
- Publication number 20240061193
- Publication date Feb 22, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- G02 - OPTICS
Information Patent Application
DUAL-SIDED OPTICAL PACKAGE
- Publication number 20240053554
- Publication date Feb 15, 2024
- nLIGHT, Inc.
- Bryce TOKMAKIAN
- G02 - OPTICS
Information Patent Application
MOUNTING STRUCTURE OF OPTICAL MODULE AND OPTICAL MOUNTING BOARD
- Publication number 20240053553
- Publication date Feb 15, 2024
- Nippon Telegraph and Telephone Corporation
- Kota Shikama
- G02 - OPTICS
Information Patent Application
TRANSMITTER OPTICAL SUB-ASSEMBLY STRUCTURE AND ACTIVE ALIGNMENT MET...
- Publication number 20240045157
- Publication date Feb 8, 2024
- Cloud Light Technology Limited
- Yvonne Xiaoming Yu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
3D High Bandwidth Memory and Optical Connectivity Stacking
- Publication number 20240036278
- Publication date Feb 1, 2024
- Google LLC
- Horia Alexandru Toma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20240012212
- Publication date Jan 11, 2024
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Guangchao DU
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240006396
- Publication date Jan 4, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20240004150
- Publication date Jan 4, 2024
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- QianBing YAN
- G02 - OPTICS
Information Patent Application
OPTICAL APPARATUS, LIGHT SOURCE APPARATUS, AND OPTICAL FIBER LASER
- Publication number 20230375791
- Publication date Nov 23, 2023
- FURUKAWA ELECTRIC CO., LTD.
- Masaya NAKAZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230369274
- Publication date Nov 16, 2023
- Taiwan Semiconduction Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES
- Publication number 20230358979
- Publication date Nov 9, 2023
- Nubis Communications, Inc.
- Peter Johannes Winzer
- G02 - OPTICS
Information Patent Application
PHOTONIC STRUCTURE
- Publication number 20230358977
- Publication date Nov 9, 2023
- VIAVI SOLUTIONS INC.
- William D. HOUCK
- G02 - OPTICS
Information Patent Application
System-Level Power Distribution, Optical Signal Distribution, and T...
- Publication number 20230324636
- Publication date Oct 12, 2023
- Fathom Radiant, PBC
- Dipankar Behera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pluggable Device, Information Communication Device, Heat Dissipatio...
- Publication number 20230280553
- Publication date Sep 7, 2023
- Huawei Technologies Co.,Ltd.
- Cheng Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of recovery of optical fiber expended during launch of a spa...

Integration of power and optics through cold plates for delivery to...

Optical waveguide package and light-emitting device

Active bridge enabled co-packaged photonic transceiver

Optical multichip package with multiple system-on-chip dies

Optical module

System and method of refining optical fiber

Completely encapsulated optical multi chip package

Silicon photonic package and method of fabricating the same

Integrated circuit device and method

Breathable outdoor network terminal enclosure

Patch on interposer architecture for low cost optical co-packaging

Photonic structure with heat-activated optical transmission

Communication systems having pluggable modules

Electronic equipment and light transmission device with cold plate...

Lamp for vehicle and vehicle including the same

Liquid cooling high-density pluggable modules for a network element

Breathable outdoor network terminal enclosure

Heterogeneous packaging integration of photonic and electronic elem...

Integrated photonics device having integrated edge outcouplers

Connector and method for manufacturing same

Optical receptacle connector for an optical communication system

Integration of power and optics through cold plates for delivery to...

Vacuum fluctuation quantum random number generator chip based on ph...

Rack-mountable equipment with a high-heat-dissipation module, and t...

Optical transceiver

Optical module

Optical fiber cable

Photonic structure using optical heater

Optical transmission module

Patents Applicationslast 30 patents

OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES

SYSTEM AND METHOD OF REFINING OPTICAL FIBER

PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

PHOTONIC STRUCTURE WITH HEAT-ACTIVATED OPTICAL TRANSMISSION

400G SILICON PHOTONIC PACKAGE WITH SELF-ALIGNED FIBER

LAMP FOR VEHICLE AND VEHICLE INCLUDING THE SAME

HETEROGENEOUS PACKAGING INTEGRATION OF PHOTONIC AND ELECTRONIC ELEM...

PLUGGABLE OPTOELECTRONIC TRANSCEIVER

CONNECTOR AND METHOD FOR MANUFACTURING SAME

OPTICAL EMISSION ASSEMBLY AND OPTICAL MODULE

OPTICAL CONNECTOR, OPTICAL CONNECTOR CONNECTING STRUCTURE, AND OPTI...

COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES

PLUGGABLE OPTOELECTRONIC TRANSCEIVER

INTEGRATION OF POWER AND OPTICS THROUGH COLD PLATES FOR DELIVERY TO...

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

RACK-MOUNTABLE EQUIPMENT WITH A HIGH-HEAT-DISSIPATION MODULE, AND T...

DUAL-SIDED OPTICAL PACKAGE

MOUNTING STRUCTURE OF OPTICAL MODULE AND OPTICAL MOUNTING BOARD

TRANSMITTER OPTICAL SUB-ASSEMBLY STRUCTURE AND ACTIVE ALIGNMENT MET...

3D High Bandwidth Memory and Optical Connectivity Stacking

OPTICAL MODULE

OPTICAL DEVICE

OPTICAL MODULE

OPTICAL APPARATUS, LIGHT SOURCE APPARATUS, AND OPTICAL FIBER LASER

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

COMMUNICATION SYSTEMS HAVING PLUGGABLE MODULES

PHOTONIC STRUCTURE

System-Level Power Distribution, Optical Signal Distribution, and T...

Pluggable Device, Information Communication Device, Heat Dissipatio...