Cooling

Industry

CPC
H05K2203/1121

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1121Cooling

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow oven with a controllably connected blocked exhaust zone
- Patent number 11,697,168
- Issue date Jul 11, 2023
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for in-situ warpage monitoring during solder reflow for hea...
- Patent number 11,558,964
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card attachment for enhanced robustness of thermal performance
- Patent number 11,224,927
- Issue date Jan 18, 2022
- International Business Machines Corporation
- Michael Gaynes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding plastic component to printed circuit board
- Patent number 11,044,818
- Issue date Jun 22, 2021
- Forward Optics Co., Ltd
- Juei-Pin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device having a substrate configured to be thermoformed coupled to...
- Patent number 11,019,729
- Issue date May 25, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Mohammed Benwadih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a metal-ceramic substrate
- Patent number 10,759,714
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
- Patent number 10,625,378
- Issue date Apr 21, 2020
- Iowa State University Research Foundation, Inc.
- Iver E. Anderson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and arrangement for transferring electrically conductive mat...
- Patent number 10,085,350
- Issue date Sep 25, 2018
- Stora Enso Oyj
- Juha Maijala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rolled copper foil
- Patent number 9,457,389
- Issue date Oct 4, 2016
- Furukawa Electric Co., Ltd.
- Kazuo Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
System for removing an electronic component from a substrate
- Patent number 9,338,935
- Issue date May 10, 2016
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,282,650
- Issue date Mar 8, 2016
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus and manufacturing method of soldered product
- Patent number 9,156,101
- Issue date Oct 13, 2015
- Origin Electric Company, Limited
- Masami Kuroda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protecting a thermal sensitive component in a thermal process
- Patent number 9,059,373
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Cliff Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing an electronic component from a substrate
- Patent number 8,925,170
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip resistor substrate
- Patent number 8,496,866
- Issue date Jul 30, 2013
- CeramTec GmbH
- Claus Peter Kluge
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Double-sided touch sensitive panel and flex circuit bonding
- Patent number 8,446,386
- Issue date May 21, 2013
- Apple Inc.
- Mark Arthur Hamblin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate cutting apparatus and method of cutting substrate using t...
- Patent number 8,383,983
- Issue date Feb 26, 2013
- Samsung Display Co., Ltd.
- Hyun-Chul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of processing a substrate and forming a micromagnetic device
- Patent number 8,288,277
- Issue date Oct 16, 2012
- Enpirion, Inc.
- Ken Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus produced using lead-free bonding material for...
- Patent number 8,281,978
- Issue date Oct 9, 2012
- Sanyo Special Steel Co., Ltd.
- Hiroki Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for processing frozen adhesive particles
- Patent number 8,236,377
- Issue date Aug 7, 2012
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Erik Christian Nicolaas Puik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double-sided touch sensitive panel and flex circuit bonding
- Patent number 8,026,903
- Issue date Sep 27, 2011
- Apple Inc.
- Mark Arthur Hamblin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided touch sensitive panel and flex circuit bonding
- Patent number 8,026,905
- Issue date Sep 27, 2011
- Apple Inc.
- Mark Arthur Hamblin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240188226
- Publication date Jun 6, 2024
- Innolux Corporation
- Wei-Lun Shieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE
- Publication number 20230380073
- Publication date Nov 23, 2023
- Teradyne, Inc.
- Eric Boiselle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD
- Publication number 20220386474
- Publication date Dec 1, 2022
- Canatu Oy
- Ilkka VARJOS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD...
- Publication number 20210410295
- Publication date Dec 30, 2021
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING PLASTIC COMPONENT TO PRINTED CIRCUIT BOARD
- Publication number 20210212215
- Publication date Jul 8, 2021
- Forward Optics Co., LTD.
- JUEI-PIN CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW...
- Publication number 20210212218
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR PRINTED CIRCUIT BOARD
- Publication number 20200344890
- Publication date Oct 29, 2020
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA ASHING OF COATED SUBSTRATES
- Publication number 20200126769
- Publication date Apr 23, 2020
- HZO, Inc.
- Robert Askin
- B08 - CLEANING
Information Patent Application
Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic...
- Publication number 20180093927
- Publication date Apr 5, 2018
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method for Soldering a Circuit Carrier to a Carrier Plate
- Publication number 20160113123
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Patrick Jones
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...
- Publication number 20150276275
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Cliff Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROLLED COPPER FOIL
- Publication number 20140335372
- Publication date Nov 13, 2014
- FURUKAWA ELECTRlC CO., LTD.
- Kazuo YOSHIDA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder
- Publication number 20140158423
- Publication date Jun 12, 2014
- Iowa State University Research Foundation, Inc.
- Iver E. Anderson
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE
- Publication number 20130340249
- Publication date Dec 26, 2013
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTER DEVICE, TEMPERATURE ADJUSTMENT METHOD OF PRINTER DEVICE, AN...
- Publication number 20130188002
- Publication date Jul 25, 2013
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yusuke USUI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...
- Publication number 20130107460
- Publication date May 2, 2013
- International Business Machines Corporation
- Cliff Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROCESSING FROZEN ADHESIVE PARTICLES
- Publication number 20120304923
- Publication date Dec 6, 2012
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Erik Christian Nicolaas Puik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...
- Publication number 20120266459
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR COOLING OR HEATING WORK PIECE IN A VACUUM...
- Publication number 20120207916
- Publication date Aug 16, 2012
- George X. Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method Of Manufacturing Semiconductor Package Board
- Publication number 20120122278
- Publication date May 17, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwan Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING
- Publication number 20120004012
- Publication date Jan 5, 2012
- Mark Arthur HAMBLIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods of Processing a Substrate and Forming a Micromagnetic Device
- Publication number 20110217793
- Publication date Sep 8, 2011
- Ken Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING
- Publication number 20110094098
- Publication date Apr 28, 2011
- Mark Arthur HAMBLIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING
- Publication number 20110094993
- Publication date Apr 28, 2011
- Mark Arthur HAMBLIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING T...
- Publication number 20100243628
- Publication date Sep 30, 2010
- Samsung Mobile Display Co., Ltd.
- Hyun-Chul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Apparatus Produced using lead-Free bonding Material for...
- Publication number 20100246148
- Publication date Sep 30, 2010
- SANYO SPECIAL STEEL CO., LTD.
- Hiroki Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP RESISTOR SUBSTRATE
- Publication number 20100221478
- Publication date Sep 2, 2010
- Claus Peter Kluge
- B28 - WORKING CEMENT, CLAY, OR STONE

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for creating orthogonal solder interconnects

Layered device for pressure treatment and method

Methods of manufacturing circuit board and circuit board assembly

Reflow oven with a controllably connected blocked exhaust zone

Process for in-situ warpage monitoring during solder reflow for hea...

Circuit card attachment for enhanced robustness of thermal performance

Method for bonding plastic component to printed circuit board

Device having a substrate configured to be thermoformed coupled to...

Method for producing a metal-ceramic substrate

Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

Method and arrangement for transferring electrically conductive mat...

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Thermal compression bonding process cooling manifold

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Rolled copper foil

System for removing an electronic component from a substrate

Thermal compression bonding process cooling manifold

Soldering apparatus and manufacturing method of soldered product

Protecting a thermal sensitive component in a thermal process

Method for removing an electronic component from a substrate

Chip resistor substrate

Double-sided touch sensitive panel and flex circuit bonding

Substrate cutting apparatus and method of cutting substrate using t...

Methods of processing a substrate and forming a micromagnetic device

Electronic apparatus produced using lead-free bonding material for...

Method and system for processing frozen adhesive particles

Double-sided touch sensitive panel and flex circuit bonding

Double-sided touch sensitive panel and flex circuit bonding

Patents Applicationslast 30 patents

Circuit board

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE

LAYERED DEVICE FOR PRESSURE TREATMENT AND METHOD

CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD...

METHOD FOR BONDING PLASTIC COMPONENT TO PRINTED CIRCUIT BOARD

IN-SITU WARPAGE MONITORING DURING SOLDER REFLOW FOR HEAD-IN-PILLOW...

METHOD OF MANUFACTURING SUBSTRATE FOR PRINTED CIRCUIT BOARD

PLASMA ASHING OF COATED SUBSTRATES

Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic...

Method for Soldering a Circuit Carrier to a Carrier Plate

METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

ROLLED COPPER FOIL

Rapidly solidifying Pb-free Sn-Ag-Cu-Al or Sn-Cu-Al solder

METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE

PRINTER DEVICE, TEMPERATURE ADJUSTMENT METHOD OF PRINTER DEVICE, AN...

METHOD AND PROTECTION APPARATUS FOR PROTECTING A THERMAL SENSITIVE...

METHOD AND SYSTEM FOR PROCESSING FROZEN ADHESIVE PARTICLES

SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...

APPARATUS AND METHOD FOR COOLING OR HEATING WORK PIECE IN A VACUUM...

Method Of Manufacturing Semiconductor Package Board

DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING

Methods of Processing a Substrate and Forming a Micromagnetic Device

DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING

DOUBLE-SIDED TOUCH SENSITIVE PANEL AND FLEX CIRCUIT BONDING

SUBSTRATE CUTTING APPARATUS AND METHOD OF CUTTING SUBSTRATE USING T...

Electronic Apparatus Produced using lead-Free bonding Material for...

CHIP RESISTOR SUBSTRATE