Core having one signal plane and one power plane

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CPC
H05K2201/09318

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09318Core having one signal plane and one power plane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,546,983
- Issue date Jan 3, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 10,849,218
- Issue date Nov 24, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit obfuscation using differing dielectric constants
- Patent number 10,499,491
- Issue date Dec 3, 2019
- The Boeing Company
- Robert Tilman Worl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with EMI protection
- Patent number 10,470,346
- Issue date Nov 5, 2019
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 10,455,689
- Issue date Oct 22, 2019
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, printed circuit board, and electronic apparatus
- Patent number 10,306,761
- Issue date May 28, 2019
- Canon Kabushiki Kaisha
- Takashi Numagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 10,034,366
- Issue date Jul 24, 2018
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with EMI protection
- Patent number 10,010,019
- Issue date Jun 26, 2018
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 9,807,869
- Issue date Oct 31, 2017
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board equipped with a high-frequency component emitting int...
- Patent number 9,801,268
- Issue date Oct 24, 2017
- Endress + Hauser GmbH + Co. KG
- Thomas Blodt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 9,775,231
- Issue date Sep 26, 2017
- Amphenol Corporation
- Marc B. Cartier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 9,730,313
- Issue date Aug 8, 2017
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit obfuscation using differing dielectric constants
- Patent number 9,565,749
- Issue date Feb 7, 2017
- The Boeing Company
- Robert Tilman Worl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 9,515,027
- Issue date Dec 6, 2016
- Canon Kabushiki Kaisha
- Hiroto Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer microwave corrugated printed circuit board and method
- Patent number 9,491,854
- Issue date Nov 8, 2016
- Raytheon Company
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structural body, printed board, antenna, transmission line waveguid...
- Patent number 9,269,999
- Issue date Feb 23, 2016
- NEC Corporation
- Hiroshi Toyao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise filter and transmission apparatus
- Patent number 9,198,279
- Issue date Nov 24, 2015
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device including a light emitting element mounted on...
- Patent number 9,119,304
- Issue date Aug 25, 2015
- Samsung Electronics Co., Ltd.
- Yu-Sik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module with EMI protection
- Patent number 8,964,409
- Issue date Feb 24, 2015
- GE Embedded Electronics Oy
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave connector substrate, method of manufacturing the same, meas...
- Patent number 8,839,513
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 8,759,846
- Issue date Jun 24, 2014
- LG Innotek Co., Ltd
- Jun Seok Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 8,760,815
- Issue date Jun 24, 2014
- Nitto Denko Corporation
- Jun Ishii
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board and layout method thereof
- Patent number 8,609,996
- Issue date Dec 17, 2013
- Hon Hai Precision Industry Co., Ltd.
- Yu-Hsu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of electromagnetic noise suppression devices using hybrid el...
- Patent number 8,595,924
- Issue date Dec 3, 2013
- William E. McKinzie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,581,110
- Issue date Nov 12, 2013
- Nitto Denko Corporation
- Yasuto Ishimaru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and display apparatus
- Patent number 8,576,567
- Issue date Nov 5, 2013
- Sharp Kabushiki Kaisha
- Tatsuya Katoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 8,569,629
- Issue date Oct 29, 2013
- Nitto Denko Corporation
- Tadao Ookawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave connector substrate, method of manufacturing the same, meas...
- Patent number 8,535,623
- Issue date Sep 17, 2013
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced electromagnetic coupling between a transmission line pair...
- Patent number 8,525,611
- Issue date Sep 3, 2013
- Broadcom Corporation
- Mohammad Tabatabai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20210076486
- Publication date Mar 11, 2021
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20200022252
- Publication date Jan 16, 2020
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic module with EMI protection
- Publication number 20180352689
- Publication date Dec 6, 2018
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20180324941
- Publication date Nov 8, 2018
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20180049312
- Publication date Feb 15, 2018
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20160150645
- Publication date May 26, 2016
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140247574
- Publication date Sep 4, 2014
- Canon Kabushiki Kaisha
- Hiroto Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
- Publication number 20130319732
- Publication date Dec 5, 2013
- Raytheon Company
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEAS...
- Publication number 20130318786
- Publication date Dec 5, 2013
- Hitachi Chemical Company, Ltd.
- Hidehiro NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
NOISE FILTER AND TRANSMISSION APPARATUS
- Publication number 20130161084
- Publication date Jun 27, 2013
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF
- Publication number 20130098661
- Publication date Apr 25, 2013
- HON HAI PRECISION INDUSTRY CO., LTD.
- YU-HSU LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUB-MOUNT, LIGHT EMITTING DEVICE INCLUDING SUB-MOUNT AND METHODS OF...
- Publication number 20130001606
- Publication date Jan 3, 2013
- Yu-Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT OBFUSCATION
- Publication number 20120210564
- Publication date Aug 23, 2012
- The Boeing Company
- Robert Tilman Worl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS, AND APPARATUS FOR ELECTRICAL FILTERS AND INPUT/OU...
- Publication number 20120172233
- Publication date Jul 5, 2012
- D-WAVE SYSTEMS INC.
- Sergey V. Uchaykin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transmission Line Pairs with Enhanced Coupling
- Publication number 20120146748
- Publication date Jun 14, 2012
- BROADCOM CORPORATION
- Mohammad Tabatabai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURAL BODY, PRINTED BOARD, ANTENNA, TRANSMISSION LINE WAVEGUID...
- Publication number 20120032865
- Publication date Feb 9, 2012
- Hiroshi Toyao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH ANTENNA FOR RFID CHIP AND METHOD FOR MAN...
- Publication number 20110226860
- Publication date Sep 22, 2011
- Industrial Technology Research Institute
- CHEN-JYH FAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE OF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110226518
- Publication date Sep 22, 2011
- Risato Ohhira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CAPACITANCE SENSOR
- Publication number 20110163763
- Publication date Jul 7, 2011
- FUJIKURA LTD.
- Takuya Osaki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS
- Publication number 20110139492
- Publication date Jun 16, 2011
- Fujitsu Limited
- Mitsuhiko Sugane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20110139489
- Publication date Jun 16, 2011
- Samsung Electro-Mechanics CO., LTD.
- Hee-Soo Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF
- Publication number 20110127069
- Publication date Jun 2, 2011
- HON HAI Precision Industry CO., LTD.
- YU-HSU LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device and Process for Making a Multilayer Circuit Device Having E...
- Publication number 20110083881
- Publication date Apr 14, 2011
- Vinh T. Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interference suppressor for suppressing high-frequency interference...
- Publication number 20110043060
- Publication date Feb 24, 2011
- Claus Schmiederer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20110030997
- Publication date Feb 10, 2011
- HON HAI Precision Industry CO., LTD.
- Shou-Kuo Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
- Publication number 20110024160
- Publication date Feb 3, 2011
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...
- Publication number 20100328868
- Publication date Dec 30, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-speed transmission circuit board connection structure
- Publication number 20100328920
- Publication date Dec 30, 2010
- Hitachi Cable, Ltd.
- Masayuki Nikaido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Core having one signal plane and one power plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mating backplane for high speed, high density electrical connector

Mating backplane for high speed, high density electrical connector

Mating backplane for high speed, high density electrical connector

Circuit obfuscation using differing dielectric constants

Electronic module with EMI protection

Mating backplane for high speed, high density electrical connector

Printed wiring board, printed circuit board, and electronic apparatus

Mating backplane for high speed, high density electrical connector

Electronic module with EMI protection

Mating backplane for high speed, high density electrical connector

Circuit board equipped with a high-frequency component emitting int...

Mating backplane for high speed, high density electrical connector

Mating backplane for high speed, high density electrical connector

Circuit obfuscation using differing dielectric constants

Printed circuit board

Multi-layer microwave corrugated printed circuit board and method

Structural body, printed board, antenna, transmission line waveguid...

Noise filter and transmission apparatus

Light emitting device including a light emitting element mounted on...

Electronic module with EMI protection

Concave connector substrate, method of manufacturing the same, meas...

Light emitting device

Wired circuit board

Printed circuit board and layout method thereof

Method of electromagnetic noise suppression devices using hybrid el...

Printed circuit board and method of manufacturing the same

Semiconductor device and display apparatus

Flexible printed circuit board

Concave connector substrate, method of manufacturing the same, meas...

Enhanced electromagnetic coupling between a transmission line pair...

Patents Applicationslast 30 patents

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

Electronic module with EMI protection

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

PRINTED CIRCUIT BOARD

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEAS...

NOISE FILTER AND TRANSMISSION APPARATUS

PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF

SUB-MOUNT, LIGHT EMITTING DEVICE INCLUDING SUB-MOUNT AND METHODS OF...

CIRCUIT OBFUSCATION

SYSTEMS, METHODS, AND APPARATUS FOR ELECTRICAL FILTERS AND INPUT/OU...

Transmission Line Pairs with Enhanced Coupling

STRUCTURAL BODY, PRINTED BOARD, ANTENNA, TRANSMISSION LINE WAVEGUID...

PRINTED CIRCUIT BOARD WITH ANTENNA FOR RFID CHIP AND METHOD FOR MAN...

SUBSTRATE OF CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

ELECTRICAL CAPACITANCE SENSOR

MULTILAYER FLEXIBLE PRINTED WIRING BOARD AND ELECTRONIC APPARATUS

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND LAYOUT METHOD THEREOF

Device and Process for Making a Multilayer Circuit Device Having E...

Interference suppressor for suppressing high-frequency interference...

FLEXIBLE PRINTED CIRCUIT BOARD

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...

High-speed transmission circuit board connection structure