Correcting or repairing of printed circuits

Industry

CPC
H05K3/225

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/225Correcting or repairing of printed circuits

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Buried lines and related fabrication techniques
- Patent number 12,087,758
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short or near short etch rework
- Patent number 12,004,307
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Colin Edward Masterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, maintenance method and display device
- Patent number 11,864,326
- Issue date Jan 2, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hongda Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automatic trimming of a PCB-based LC circuit
- Patent number 11,696,406
- Issue date Jul 4, 2023
- Microchip Technology Incorporated
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System producing a conductive path on a substrate
- Patent number 11,464,114
- Issue date Oct 4, 2022
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repairing conductor tracks
- Patent number 11,419,219
- Issue date Aug 16, 2022
- XTPL S.A.
- Piotr Kowalczewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current redistribution in a printed circuit board
- Patent number 11,277,918
- Issue date Mar 15, 2022
- Cisco Technology, Inc.
- Goutham Sabavat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tool for shaping contact tab interconnects at a circuit card edge
- Patent number 11,245,238
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Timothy P. Younger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for repairing a fine line
- Patent number 11,212,921
- Issue date Dec 28, 2021
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Chengqiang Cui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin reforming tool
- Patent number 11,198,165
- Issue date Dec 14, 2021
- Westinghouse Electric Company LLC
- James A. Kisic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Post-production substrate modification with FIB deposition
- Patent number 11,139,217
- Issue date Oct 5, 2021
- BAE Systems Information and Electronic Systems Integration Inc.
- Jeffrey A. Zimmerman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Repairing defective through-holes
- Patent number 10,952,330
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting body manufacturing method and anisotropic conductive film
- Patent number 10,887,999
- Issue date Jan 5, 2021
- Dexerials Corporation
- Yasunobu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recondition process for BGA using flux
- Patent number 10,881,007
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clearance size reduction for backdrilled differential vias
- Patent number 10,863,628
- Issue date Dec 8, 2020
- Juniper Networks, Inc.
- Matthew Twarog
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards and circuit board assemblies
- Patent number 10,764,994
- Issue date Sep 1, 2020
- Hamilton Sundstrand Corporation
- Tran Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly inspection method
- Patent number 10,736,221
- Issue date Aug 4, 2020
- UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD
- Yi-Ming Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buried lines and related fabrication techniques
- Patent number 10,729,012
- Issue date Jul 28, 2020
- Micron Technology, Inc.
- Hernan A. Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lift printing of multi-composition material structures
- Patent number 10,629,442
- Issue date Apr 21, 2020
- Orbotech Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of reducing warpage of an organic substrate
- Patent number 10,595,399
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,576,566
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
FPC flattening jig and FPC flattening method
- Patent number 10,575,409
- Issue date Feb 25, 2020
- BOE Technology Group Co., Ltd.
- Yongkang Hou
- B30 - PRESSES
Information Patent Grant
Current redistribution in a printed circuit board
- Patent number 10,548,227
- Issue date Jan 28, 2020
- Cisco Technology, Inc.
- Goutham Sabavat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ball grid array rework
- Patent number 10,546,828
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing apparatus for holding circuit board in place
- Patent number 10,455,720
- Issue date Oct 22, 2019
- Fu Tai Hua Industry (Shenzhen) Co., Ltd.
- Li-Chin Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-repairing wiring
- Patent number 10,356,896
- Issue date Jul 16, 2019
- Waseda University
- Eiji Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dry film solder mask composite laminate materials
- Patent number 10,327,336
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Sarah K. Czaplewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,286,471
- Issue date May 14, 2019
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,286,472
- Issue date May 14, 2019
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD
- Publication number 20240408701
- Publication date Dec 12, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20240224430
- Publication date Jul 4, 2024
- Prashant Patil
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240074065
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORK PATCH FOR AN ELECTRONIC CIRCUIT
- Publication number 20240040706
- Publication date Feb 1, 2024
- Jabil Inc.
- Muhammad Irsyad Bin Suhaimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE TRACE INTERCONNECTION TAPE
- Publication number 20240015886
- Publication date Jan 11, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE
- Publication number 20230380073
- Publication date Nov 23, 2023
- Teradyne, Inc.
- Eric Boiselle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHORT OR NEAR SHORT ETCH REWORK
- Publication number 20220400556
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Colin Edward Masterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK
- Publication number 20220400557
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS A...
- Publication number 20220377907
- Publication date Nov 24, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Elad MENTOVICH
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SUBSTRATE, MAINTENANCE METHOD AND DISPLAY DEVICE
- Publication number 20220346237
- Publication date Oct 27, 2022
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hongda LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR REPAIRING CONDUCTOR TRACKS
- Publication number 20210227700
- Publication date Jul 22, 2021
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System Producing a Conductive Path on a Substrate
- Publication number 20210195756
- Publication date Jun 24, 2021
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPAIRING A FINE LINE
- Publication number 20210176865
- Publication date Jun 10, 2021
- Guangdong University of Technology
- Chengqiang CUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN, AND DISC...
- Publication number 20210168942
- Publication date Jun 3, 2021
- Sakai Display Products Corporation
- KIBO WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...
- Publication number 20210074595
- Publication date Mar 11, 2021
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey A. Zimmerman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BURIED LINES AND RELATED FABRICATION TECHNIQUES
- Publication number 20200323083
- Publication date Oct 8, 2020
- Micron Technology, Inc.
- Hernan Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIRING DEFECTIVE THROUGH-HOLES
- Publication number 20200245469
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURRENT REDISTRIBUTION IN A PRINTED CIRCUIT BOARD
- Publication number 20200107452
- Publication date Apr 2, 2020
- Cisco Technology, Inc.
- Goutham Sabavat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD PRODUCING A CONDUCTIVE PATH ON A SUBSTRATE
- Publication number 20200093001
- Publication date Mar 19, 2020
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEARANCE SIZE REDUCTION FOR BACKDRILLED DIFFERENTIAL VIAS
- Publication number 20200053880
- Publication date Feb 13, 2020
- Juniper Networks, Inc.
- Matthew TWAROG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED LINES AND RELATED FABRICATION TECHNIQUES
- Publication number 20190327835
- Publication date Oct 24, 2019
- Micron Technology, Inc.
- Hernan A. Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REAL-TIME DETECTION AND CORRECTION OF PRINTED CIRCUITRY
- Publication number 20190306989
- Publication date Oct 3, 2019
- KONICA MINOLTA LABORATORY U.S.A., INC.
- John Randall Christ
- G01 - MEASURING TESTING
Information Patent Application
PIN REFORMING TOOL
- Publication number 20190283098
- Publication date Sep 19, 2019
- Westinghouse Electric Company LLC
- James A. Kisic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY INSPECTION METHOD
- Publication number 20190254173
- Publication date Aug 15, 2019
- UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD.
- Yi-Ming CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
- Publication number 20190053370
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Sayuri Hada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Correcting or repairing of printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Buried lines and related fabrication techniques

Short or near short etch rework

Substrate, maintenance method and display device

Automatic trimming of a PCB-based LC circuit

Compliant pin surface mount technology pad for rework

System producing a conductive path on a substrate

Method for repairing conductor tracks

Current redistribution in a printed circuit board

Tool for shaping contact tab interconnects at a circuit card edge

Method for repairing a fine line

Pin reforming tool

Post-production substrate modification with FIB deposition

Repairing defective through-holes

Mounting body manufacturing method and anisotropic conductive film

Recondition process for BGA using flux

Clearance size reduction for backdrilled differential vias

Circuit boards and circuit board assemblies

Circuit board assembly inspection method

Buried lines and related fabrication techniques

Lift printing of multi-composition material structures

Method of reducing warpage of an organic substrate

Solder paste misprint cleaning

FPC flattening jig and FPC flattening method

Current redistribution in a printed circuit board

Ball grid array rework

Fixing apparatus for holding circuit board in place

Self-repairing wiring

Dry film solder mask composite laminate materials

Solder paste misprint cleaning

Solder paste misprint cleaning

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

SYSTEMS AND METHODS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

METHOD OF FORMING A PACKAGE SUBSTRATE

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

REWORK PATCH FOR AN ELECTRONIC CIRCUIT

CONDUCTIVE TRACE INTERCONNECTION TAPE

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE

SHORT OR NEAR SHORT ETCH REWORK

COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

PROCESS FOR LOCALIZED REPAIR OF GRAPHENE-COATED LAMINATION STACKS A...

SUBSTRATE, MAINTENANCE METHOD AND DISPLAY DEVICE

METHOD FOR REPAIRING CONDUCTOR TRACKS

System Producing a Conductive Path on a Substrate

METHOD FOR REPAIRING A FINE LINE

CONDUCTIVE PATTERN, METHOD FOR FORMING CONDUCTIVE PATTERN, AND DISC...

POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...

BURIED LINES AND RELATED FABRICATION TECHNIQUES

REPAIRING DEFECTIVE THROUGH-HOLES

CURRENT REDISTRIBUTION IN A PRINTED CIRCUIT BOARD

METHOD PRODUCING A CONDUCTIVE PATH ON A SUBSTRATE

CLEARANCE SIZE REDUCTION FOR BACKDRILLED DIFFERENTIAL VIAS

BURIED LINES AND RELATED FABRICATION TECHNIQUES

REAL-TIME DETECTION AND CORRECTION OF PRINTED CIRCUITRY

PIN REFORMING TOOL

CIRCUIT BOARD ASSEMBLY INSPECTION METHOD

METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE