Coupling agent for particles

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CPC
H05K2201/0239

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0239Coupling agent for particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 11,292,943
- Issue date Apr 5, 2022
- The Boeing Company
- Peter Babilo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Through hole filling paste
- Patent number 11,259,412
- Issue date Feb 22, 2022
- Ajinomoto Co., Inc.
- Hideki Ooyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition for LDS, resin molded article, and...
- Patent number 11,174,402
- Issue date Nov 16, 2021
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 10,336,916
- Issue date Jul 2, 2019
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin composition, prepreg, laminate, metal foil-clad laminate, and...
- Patent number 10,138,393
- Issue date Nov 27, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya Tomizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 10,005,927
- Issue date Jun 26, 2018
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,526,169
- Issue date Dec 20, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Gi Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 9,464,214
- Issue date Oct 11, 2016
- The Boeing Company
- Peter Babilo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Insulated ultrafine powder, method for producing same, and high die...
- Patent number 9,394,447
- Issue date Jul 19, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Takahiro Matsumoto
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic component embedded printed circuit board
- Patent number 9,386,701
- Issue date Jul 5, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeon Seop Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating resin material and multilayer substrate
- Patent number 9,382,445
- Issue date Jul 5, 2016
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive paste and method for manufacturing the same, wiring usin...
- Patent number 9,330,807
- Issue date May 3, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Kazufumi Ogawa
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated ultrafine powder, method for producing same, and high die...
- Patent number 9,315,673
- Issue date Apr 19, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Takahiro Matsumoto
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Anisotropic conductive material and method for manufacturing same
- Patent number 9,253,911
- Issue date Feb 2, 2016
- Dexerials Corporation
- Reiji Tsukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 9,175,151
- Issue date Nov 3, 2015
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy resin varnishes, laminates and printed circuit boards
- Patent number 9,169,346
- Issue date Oct 27, 2015
- Ventec Electronics (Suzhou) Company
- Chien-Jen Chung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Glass wiring board
- Patent number 9,148,953
- Issue date Sep 29, 2015
- Tyco Electronics Japan G.K.
- Katsunori Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate, and printed wiring board
- Patent number 9,102,850
- Issue date Aug 11, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroharu Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition and method for producing circuit board
- Patent number 8,877,843
- Issue date Nov 4, 2014
- Panasonic Corporation
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing transfer structure and matrix for use therein
- Patent number 8,865,049
- Issue date Oct 21, 2014
- Tokyo University of Science Educational Foundation Administrative Org.
- Jun Taniguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Epoxy resin composition, prepreg, and metal-clad laminate and multi...
- Patent number 8,846,799
- Issue date Sep 30, 2014
- Panasonic Corporation
- Hiroyuki Fujisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive paste and method for manufacturing the same, wiring usin...
- Patent number 8,623,500
- Issue date Jan 7, 2014
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Kazufumi Ogawa
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Substrate with metal film and method for manufacturing the same
- Patent number 8,563,873
- Issue date Oct 22, 2013
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive inks made with metallic nanoparticles
- Patent number 8,558,117
- Issue date Oct 15, 2013
- Aculon, Inc.
- Eric L. Hanson
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aligned nanotube bearing composite material
- Patent number 8,530,890
- Issue date Sep 10, 2013
- Intel Corporation
- Nachiket Raravikar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Functionalized metal nanoparticle and method for formation of condu...
- Patent number 8,481,161
- Issue date Jul 9, 2013
- Samsung Electronics Co., Ltd.
- Jong Jin Park
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for making holes using a fluid jet
- Patent number 8,450,217
- Issue date May 28, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Mohamed Benwadih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with dielectric layer having dielectric compo...
- Patent number 8,445,094
- Issue date May 21, 2013
- Endicott Interconnect Technologies, Inc.
- Robert Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, laminate sheet and printed wiring board...
- Patent number 8,420,210
- Issue date Apr 16, 2013
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240182657
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Akira IRIFUNE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20230047699
- Publication date Feb 16, 2023
- Hayato SAWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH HOLE FILLING PASTE
- Publication number 20200413542
- Publication date Dec 31, 2020
- AJINOMOTO CO., INC.
- Hideki OOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...
- Publication number 20190292386
- Publication date Sep 26, 2019
- SUMITOMO BAKELITE CO., LTD.
- Toru MEURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20190264073
- Publication date Aug 29, 2019
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20180265751
- Publication date Sep 20, 2018
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...
- Publication number 20160029483
- Publication date Jan 28, 2016
- Ishihara Chemical Co., Ltd.
- Yuichi KAWATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND...
- Publication number 20150344733
- Publication date Dec 3, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya TOMIZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE
- Publication number 20150210884
- Publication date Jul 30, 2015
- Sekisui Chemical Co., Ltd
- Tatsushi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION FOR INSULATING FILM, INSULATING FILM, AND P...
- Publication number 20140182908
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hye Shim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INSULATED ULTRAFINE POWDER, METHOD FOR PRODUCING SAME, AND HIGH DIE...
- Publication number 20140170305
- Publication date Jun 19, 2014
- Mitsubishi Gas Chemical Company, Inc.
- Takahiro MATSUMOTO
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20140151100
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yeon Seop YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPR...
- Publication number 20140154479
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Geum Hee Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass Wiring Board
- Publication number 20140097005
- Publication date Apr 10, 2014
- TYCO ELECTRONICS JAPAN G.K.
- Katsunori Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING THE SAME, WIRING USIN...
- Publication number 20140077137
- Publication date Mar 20, 2014
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Kazufumi OGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USIN...
- Publication number 20140039094
- Publication date Feb 6, 2014
- Taiwan Union Technology Corporation
- Hsien Te CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20130337188
- Publication date Dec 19, 2013
- PANASONIC CORPORATION
- Yuko Konno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...
- Publication number 20130288041
- Publication date Oct 31, 2013
- Nobuhiro GOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130135838
- Publication date May 30, 2013
- DEXERIALS CORPORATION
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING HOLES USING A FLUID JET
- Publication number 20120289045
- Publication date Nov 15, 2012
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mohamed Benwadih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNED NANOTUBE BEARING COMPOSIT MATERIAL
- Publication number 20120270008
- Publication date Oct 25, 2012
- Intel Corporation
- Nachiket Raravikar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil for Printed Circuit Board and Copper Clad Laminate for...
- Publication number 20120148862
- Publication date Jun 14, 2012
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSULATED ULTRAFINE POWDER, METHOD FOR PRODUCING SAME, AND HIGH DIE...
- Publication number 20120142836
- Publication date Jun 7, 2012
- Mitsubishi Gas Chemical Company, Inc.
- Takahiro Matsumoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USIN...
- Publication number 20110284276
- Publication date Nov 24, 2011
- Hsien Te CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED BODY AND MULTILAYER BODY
- Publication number 20110244183
- Publication date Oct 6, 2011
- Sekisui Chemical Co., Ltd
- Nobuhiro Goto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATED BODY AND METHOD FOR PRODUCING LAMINATED BODY
- Publication number 20110217512
- Publication date Sep 8, 2011
- Sekisui Chemical Co., Ltd
- Masaru Heishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Halogen-Free Dielectric Composition For use As Dielectric Layer In...
- Publication number 20110207866
- Publication date Aug 25, 2011
- Robert M. Japp
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electroconductive inks made with metallic nanoparticles
- Publication number 20110198113
- Publication date Aug 18, 2011
- Aculon, Inc.
- Eric L. Hanson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...
- Publication number 20110189432
- Publication date Aug 4, 2011
- Sekisui Chemical Co., Ltd
- Nobuhiro Goto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
VARNISH, PREPREG, AND SUBSTRATE THEREOF
- Publication number 20110183144
- Publication date Jul 28, 2011
- ITEQ CORPORATION
- LAI TU LIU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Coupling agent for particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermally conductive flexible adhesive for aerospace applications

Through hole filling paste

Thermosetting resin composition for LDS, resin molded article, and...

Thermally conductive flexible adhesive for aerospace applications

Resin composition, prepreg, laminate, metal foil-clad laminate, and...

Thermally conductive flexible adhesive for aerospace applications

Printed circuit board and method for manufacturing the same

Thermally conductive flexible adhesive for aerospace applications

Insulated ultrafine powder, method for producing same, and high die...

Electronic component embedded printed circuit board

Insulating resin material and multilayer substrate

Conductive paste and method for manufacturing the same, wiring usin...

Circuit board

Insulated ultrafine powder, method for producing same, and high die...

Anisotropic conductive material and method for manufacturing same

Resin composition and method for producing circuit board

Epoxy resin varnishes, laminates and printed circuit boards

Glass wiring board

Prepreg, metal-clad laminate, and printed wiring board

Resin composition and method for producing circuit board

Method for producing transfer structure and matrix for use therein

Epoxy resin composition, prepreg, and metal-clad laminate and multi...

Conductive paste and method for manufacturing the same, wiring usin...

Substrate with metal film and method for manufacturing the same

Electroconductive inks made with metallic nanoparticles

Aligned nanotube bearing composite material

Functionalized metal nanoparticle and method for formation of condu...

Method for making holes using a fluid jet

Circuitized substrate with dielectric layer having dielectric compo...

Resin composition, prepreg, laminate sheet and printed wiring board...

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

THROUGH HOLE FILLING PASTE

THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...

RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND...

INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE

EPOXY RESIN COMPOSITION FOR INSULATING FILM, INSULATING FILM, AND P...

INSULATED ULTRAFINE POWDER, METHOD FOR PRODUCING SAME, AND HIGH DIE...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPR...

Glass Wiring Board

CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING THE SAME, WIRING USIN...

EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USIN...

RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD

EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...

ANISOTROPIC CONDUCTIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MAKING HOLES USING A FLUID JET

ALIGNED NANOTUBE BEARING COMPOSIT MATERIAL

Copper Foil for Printed Circuit Board and Copper Clad Laminate for...

INSULATED ULTRAFINE POWDER, METHOD FOR PRODUCING SAME, AND HIGH DIE...

EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USIN...

RESIN COMPOSITION, CURED BODY AND MULTILAYER BODY

LAMINATED BODY AND METHOD FOR PRODUCING LAMINATED BODY

Halogen-Free Dielectric Composition For use As Dielectric Layer In...

Electroconductive inks made with metallic nanoparticles

EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...

VARNISH, PREPREG, AND SUBSTRATE THEREOF