coupling with semiconductor devices activated by light through the light guide

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

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G02B6/4295coupling with semiconductor devices activated by light through the light guide

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Patents Grantslast 30 patents

Information Patent Grant
Tapered waveguide semiconductor optical devices with increased face...
- Patent number 12,189,200
- Issue date Jan 7, 2025
- MACOM Technology Solutions Holdings, Inc.
- Wolfgang Parz
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,164,161
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Multicomponent photonically bridged assembly
- Patent number 12,164,162
- Issue date Dec 10, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Stacked-dies optically bridged multicomponent package
- Patent number 12,130,485
- Issue date Oct 29, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multi-die interconnect bridge with optical interface
- Patent number 12,124,095
- Issue date Oct 22, 2024
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Circuit substrate light coupler
- Patent number 12,107,390
- Issue date Oct 1, 2024
- Ultra Communications, Inc.
- Charles B. Kuznia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical fiber cable connector
- Patent number 12,083,353
- Issue date Sep 10, 2024
- IPG Photonics, Inc.
- Gregory Altshuler
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Photonic structure and semiconductor structure and method for manuf...
- Patent number 12,078,856
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tao-Cheng Liu
- G02 - OPTICS
Information Patent Grant
Integrated photonic device utilizing strained 2D material
- Patent number 12,072,542
- Issue date Aug 27, 2024
- The George Washington University
- Rishi Maiti
- G02 - OPTICS
Information Patent Grant
Simultaneous edge blackening and light recycling in optical wavegui...
- Patent number 12,072,543
- Issue date Aug 27, 2024
- Meta Platforms Technologies, LLC
- Pasqual Rivera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically switched IGBT
- Patent number 12,009,812
- Issue date Jun 11, 2024
- Simmonds Precision Products, Inc.
- David H. Crowne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device having a light-emitting structure and a waveguide in...
- Patent number 11,927,819
- Issue date Mar 12, 2024
- Hewlett Packard Enterprise Development LP
- Sudharsanan Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic optical fiber alignment assembly having integrated optical...
- Patent number 11,892,691
- Issue date Feb 6, 2024
- Senko Advanced Components, Inc.
- Shuhe Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure and optical signal transmitter
- Patent number 11,860,428
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,846,802
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical multi-die interconnect bridge (OMIB)
- Patent number 11,835,777
- Issue date Dec 5, 2023
- Celestial AI Inc.
- Philip Winterbottom
- G02 - OPTICS
Information Patent Grant
Optical multiplexer/demultiplexer module and associated methods
- Patent number 11,777,633
- Issue date Oct 3, 2023
- Ayar Labs, Inc.
- Vladimir Stojanovic
- G02 - OPTICS
Information Patent Grant
Multi-chip photonics transceiver
- Patent number 11,726,276
- Issue date Aug 15, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Michael Wood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical semiconductor device
- Patent number 11,722,224
- Issue date Aug 8, 2023
- Mitsubishi Electric Corporation
- Ryosuke Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 11,722,221
- Issue date Aug 8, 2023
- Furukawa Electric Co., Ltd.
- Kazuya Nagashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled grating couplers with inclined side edge portions
- Patent number 11,567,266
- Issue date Jan 31, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Judson Holt
- G02 - OPTICS
Information Patent Grant
Electro-optical interface module and associated methods
- Patent number 11,563,506
- Issue date Jan 24, 2023
- Ayar Labs, Inc.
- Vladimir Stojanovic
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photodetectors and terminators including a tapered thickness
- Patent number 11,520,113
- Issue date Dec 6, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Abdelsalam Aboketaf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photon detection device and a method of manufacturing a photon dete...
- Patent number 11,513,299
- Issue date Nov 29, 2022
- Kabushiki Kaisha Toshiba
- Andrew James Shields
- G01 - MEASURING TESTING
Information Patent Grant
Optically controlled millimeter-wave switch based on substrate inte...
- Patent number 11,469,337
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Mikhail Nikolaevich Makurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method for coherent receiver
- Patent number 11,454,768
- Issue date Sep 27, 2022
- Sumitomo Electric Industries, Ltd.
- Munetaka Kurokawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micro-disc modulator, silicon photonic device and optoelectronic co...
- Patent number 11,444,696
- Issue date Sep 13, 2022
- PHOTONIC INTERNATIONAL PTE. LTD.
- Birendra Dutt
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
TORminator system and associated methods
- Patent number 11,405,125
- Issue date Aug 2, 2022
- Ayar Labs, Inc.
- Vladimir Stojanovic
- G02 - OPTICS
Information Patent Grant
Photoconductive charge trapping apparatus
- Patent number 11,366,401
- Issue date Jun 21, 2022
- Lawrence Livermore National Security, LLC
- Stephen Sampayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,347,001
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIBER OPTIC CABLE COUPLING ASSEMBLY
- Publication number 20240427096
- Publication date Dec 26, 2024
- Plethron, Inc.
- Eric Minami
- G02 - OPTICS
Information Patent Application
PHOTONIC STRUCTURE AND SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUF...
- Publication number 20240361549
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TAO-CHENG LIU
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240345343
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
PROTECTION APPARATUS FOR A PHOTONIC DEVICE
- Publication number 20240329329
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Gamal REFAI-AHMED
- G02 - OPTICS
Information Patent Application
CHIP AND OPTICAL COMMUNICATION DEVICE
- Publication number 20240319559
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Limin CHANG
- G02 - OPTICS
Information Patent Application
TWISTER OVEN FOR PHOTOCONDUCTIVE SWITCHES
- Publication number 20240310580
- Publication date Sep 19, 2024
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Michael Rushford
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH PHOTOELECTRIC...
- Publication number 20240280768
- Publication date Aug 22, 2024
- SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Jie Huang
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
- Publication number 20240272392
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
- Publication number 20240272393
- Publication date Aug 15, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240255714
- Publication date Aug 1, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- G02 - OPTICS
Information Patent Application
OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS
- Publication number 20240219664
- Publication date Jul 4, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
Photonic Semiconductor Device and Method
- Publication number 20240142732
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsin Lu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240085619
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING GRATING COUPLER WITH OPTOFLUIDIC GRATING CHANNELS
- Publication number 20240045156
- Publication date Feb 8, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...
- Publication number 20240027711
- Publication date Jan 25, 2024
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS
- Publication number 20240012215
- Publication date Jan 11, 2024
- AVICENATECH CORP.
- Robert Kalman
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE
- Publication number 20230418010
- Publication date Dec 28, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER
- Publication number 20230400649
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heteroepitaxially Integrated Compound Semiconductor Optical Devices...
- Publication number 20230400652
- Publication date Dec 14, 2023
- Massachusetts Institute of Technology
- Christopher Heidelberger
- G02 - OPTICS
Information Patent Application
OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)
- Publication number 20230296854
- Publication date Sep 21, 2023
- Celestial AI Inc.
- Philip WINTERBOTTOM
- G02 - OPTICS
Information Patent Application
TAPERED WAVEGUIDE SEMICONDUCTOR OPTICAL DEVICES WITH INCREASED FACE...
- Publication number 20230266548
- Publication date Aug 24, 2023
- MACOM Technology Solutions Holdings, Inc.
- Wolfgang Parz
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE HAVING A LIGHT-EMITTING STRUCTURE AND A WAVEGUIDE IN...
- Publication number 20230143150
- Publication date May 11, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Sudharsanan Srinivasan
- G02 - OPTICS
Information Patent Application
OPTICAL FIBER CABLE CONNECTOR
- Publication number 20230077457
- Publication date Mar 16, 2023
- IPG Photonics Corporation
- Gregory Altshuler
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MICROLED PARALLEL OPTICAL INTERCONNECTS
- Publication number 20230054560
- Publication date Feb 23, 2023
- Robert Kalman
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC DETECTOR
- Publication number 20230042376
- Publication date Feb 9, 2023
- WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENTER CO., LTD
- Xiao HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC STRUCTURE AND SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUF...
- Publication number 20230043634
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- TAO-CHENG LIU
- G02 - OPTICS
Information Patent Application
INTEGRATED PHOTONIC DEVICE UTILIZING STRAINED 2D MATERIAL
- Publication number 20220373751
- Publication date Nov 24, 2022
- THE GEORGE WASHINGTON UNIVERSITY
- Rishi MAITI
- G02 - OPTICS
Information Patent Application
PHOTOCONDUCTIVE CHARGE TRAPPING APPARATUS
- Publication number 20220308471
- Publication date Sep 29, 2022
- LAWRENCE LIVERMORE NATIONAL SECURITY, LLC
- Stephen SAMPAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CO-PACKAGING OPTICAL MODULES ON SWITCH PACKAGE SUBSTRATE
- Publication number 20220283360
- Publication date Sep 8, 2022
- INPHI CORPORATION
- Radhakrishnan L. NAGARAJAN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220260776
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

coupling with semiconductor devices activated by light through the light guide

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tapered waveguide semiconductor optical devices with increased face...

Stacked-dies optically bridged multicomponent package

Multicomponent photonically bridged assembly

Stacked-dies optically bridged multicomponent package

Optical multi-die interconnect bridge with optical interface

Circuit substrate light coupler

Optical fiber cable connector

Photonic structure and semiconductor structure and method for manuf...

Integrated photonic device utilizing strained 2D material

Simultaneous edge blackening and light recycling in optical wavegui...

Optically switched IGBT

Optical device having a light-emitting structure and a waveguide in...

Hermetic optical fiber alignment assembly having integrated optical...

Package structure and optical signal transmitter

Semiconductor structure

Optical multi-die interconnect bridge (OMIB)

Optical multiplexer/demultiplexer module and associated methods

Multi-chip photonics transceiver

Optical semiconductor device

Optical module

Angled grating couplers with inclined side edge portions

Electro-optical interface module and associated methods

Photodetectors and terminators including a tapered thickness

Photon detection device and a method of manufacturing a photon dete...

Optically controlled millimeter-wave switch based on substrate inte...

Assembly method for coherent receiver

Micro-disc modulator, silicon photonic device and optoelectronic co...

TORminator system and associated methods

Photoconductive charge trapping apparatus

Semiconductor structure and method of fabricating the same

Patents Applicationslast 30 patents

FIBER OPTIC CABLE COUPLING ASSEMBLY

PHOTONIC STRUCTURE AND SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUF...

ELECTRONIC DEVICE

PROTECTION APPARATUS FOR A PHOTONIC DEVICE

CHIP AND OPTICAL COMMUNICATION DEVICE

TWISTER OVEN FOR PHOTOCONDUCTIVE SWITCHES

400G SILICON PHOTONIC INTEGRATED OPTICAL MODULE WITH PHOTOELECTRIC...

MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY

MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS

Photonic Semiconductor Device and Method

SEMICONDUCTOR STRUCTURE

STRUCTURE INCLUDING GRATING COUPLER WITH OPTOFLUIDIC GRATING CHANNELS

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL I...

COUPLING MICROLEDS TO OPTICAL COMMUNICATION CHANNELS

OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE

PACKAGE STRUCTURE AND OPTICAL SIGNAL TRANSMITTER

Heteroepitaxially Integrated Compound Semiconductor Optical Devices...

OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)

TAPERED WAVEGUIDE SEMICONDUCTOR OPTICAL DEVICES WITH INCREASED FACE...

OPTICAL DEVICE HAVING A LIGHT-EMITTING STRUCTURE AND A WAVEGUIDE IN...

OPTICAL FIBER CABLE CONNECTOR

MICROLED PARALLEL OPTICAL INTERCONNECTS

PHOTOELECTRIC DETECTOR

PHOTONIC STRUCTURE AND SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUF...

INTEGRATED PHOTONIC DEVICE UTILIZING STRAINED 2D MATERIAL

PHOTOCONDUCTIVE CHARGE TRAPPING APPARATUS

METHODS FOR CO-PACKAGING OPTICAL MODULES ON SWITCH PACKAGE SUBSTRATE

SEMICONDUCTOR STRUCTURE