Covering open PTHs

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H05K2203/1394

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1394Covering open PTHs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedding discrete components having variable dimensions in a subst...
- Patent number 10,701,797
- Issue date Jun 30, 2020
- International Business Machines Corporation
- Lei Shan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising a module connected to a PCB and electr...
- Patent number 10,681,816
- Issue date Jun 9, 2020
- SAFRAN ELECTRONICS & DEFENSE
- François Guillot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cortical implant system for brain stimulation and recording
- Patent number 9,949,376
- Issue date Apr 17, 2018
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Mounting substrate, manufacturing method for the same, and componen...
- Patent number 9,814,139
- Issue date Nov 7, 2017
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshihiko Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed circuit board with etching process...
- Patent number 9,788,437
- Issue date Oct 10, 2017
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Shuo Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,532,468
- Issue date Dec 27, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacture method thereof
- Patent number 9,510,446
- Issue date Nov 29, 2016
- Tyco Electronics AMP Korea Ltd.
- Yang Yun Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate, and method of manufacturing the same
- Patent number 9,338,897
- Issue date May 10, 2016
- NGK Spark Plug Co., Ltd.
- Yuma Otsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate having built-in component
- Patent number 9,167,702
- Issue date Oct 20, 2015
- NGK Spark Plug Co., Ltd.
- Kenji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for filling holes in printed wiring boards
- Patent number 8,726,498
- Issue date May 20, 2014
- General Dynamics Advanced Information Systems
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electroconductive pattern formation
- Patent number 8,546,066
- Issue date Oct 1, 2013
- Mitsubishi Paper Mills Limited
- Munetoshi Irisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,181,339
- Issue date May 22, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board and manufacturing app...
- Patent number 8,144,972
- Issue date Mar 27, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Chung Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming resist pattern, method for producing circuit boa...
- Patent number 8,143,533
- Issue date Mar 27, 2012
- Mitsubishi Paper Mills Limited
- Yasuo Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-electric hybrid board and manufacturing method thereof
- Patent number 8,135,248
- Issue date Mar 13, 2012
- Nitto Denko Corporation
- Masayuki Hodono
- B32 - LAYERED PRODUCTS
Information Patent Grant
Waterproof and dustproof structure
- Patent number 7,851,710
- Issue date Dec 14, 2010
- Twinhead International Corp.
- Shu Hsien Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board manufacturing method and printed circuit board
- Patent number 7,834,277
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an organic substrate with integral thermal dis...
- Patent number 7,832,096
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for filling holes in printed wiring boards
- Patent number 7,802,360
- Issue date Sep 28, 2010
- General Dynamics Advanced Information Systems, Inc.
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 7,726,016
- Issue date Jun 1, 2010
- International Business Machines Corporation
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 7,718,078
- Issue date May 18, 2010
- Advanced Semiconductor Engineering, Inc.
- Chi-Chao Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board manufacturing method and circuit board
- Patent number 7,679,004
- Issue date Mar 16, 2010
- Shinko Electric Industries Co., Ltd.
- Katsuya Fukase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method of the same
- Patent number 7,677,905
- Issue date Mar 16, 2010
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring circuit board
- Patent number 7,671,281
- Issue date Mar 2, 2010
- Fujitsu Limited
- Toshihiro Kusagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via hole having fine hole land and method for forming the same
- Patent number 7,629,692
- Issue date Dec 8, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for venting an electronic control module
- Patent number 7,570,492
- Issue date Aug 4, 2009
- Temic Automotive of North America, Inc.
- Thomas P. Gall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,563,112
- Issue date Jul 21, 2009
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, photosensitive element, productio...
- Patent number 7,517,636
- Issue date Apr 14, 2009
- Hitachi Chemical Co., Ltd.
- Takahiro Fukaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having chip package mounted thereon and metho...
- Patent number 7,506,437
- Issue date Mar 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array substrate having window and method of fabricating same
- Patent number 7,462,555
- Issue date Dec 9, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jong Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE COMPRISING A MODULE CONNECTED TO A PCB AND ELECTR...
- Publication number 20200045822
- Publication date Feb 6, 2020
- SAFRAN ELECTRONICS & DEFENSE
- François GUILLOT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170367191
- Publication date Dec 21, 2017
- Avary Holding (Shenzhen) Co., Limited.
- WEI-SHUO SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140166346
- Publication date Jun 19, 2014
- NGK Spark Plug Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT
- Publication number 20130074332
- Publication date Mar 28, 2013
- NGK Spark Plug Co., Ltd.
- Kenji SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120199388
- Publication date Aug 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for filling holes in printed wiring boards
- Publication number 20110067235
- Publication date Mar 24, 2011
- General Dynamics Advanced Information Systems, Inc.
- Deepak Keshav Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION
- Publication number 20100330504
- Publication date Dec 30, 2010
- Munetoshi Irisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20100129036
- Publication date May 27, 2010
- Nitto Denko Corporation
- Masayuki HODONO
- G02 - OPTICS
Information Patent Application
Manufacturing method of printed circuit board and manufacturing app...
- Publication number 20100021045
- Publication date Jan 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Chung Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Resist Pattern, Method for Producing Circuit Boa...
- Publication number 20090236137
- Publication date Sep 24, 2009
- Yasuo Kaneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FILLING VIAS WITH FUSIBLE METAL
- Publication number 20090218124
- Publication date Sep 3, 2009
- MOTOROLA, INC.
- JAROSLAW A. MAGERA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER VOID REDUCTION ON CIRCUIT BOARDS
- Publication number 20090188890
- Publication date Jul 30, 2009
- Research In Motion Limited
- Atiq KHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20090173531
- Publication date Jul 9, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHO...
- Publication number 20090152233
- Publication date Jun 18, 2009
- Samsung Electro-mechanics Co., Ltd.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHO...
- Publication number 20090147488
- Publication date Jun 11, 2009
- Samsung Electro-mechanics Co., Ltd.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20090139086
- Publication date Jun 4, 2009
- FOXCONN ADVANCED TECHNOLOGY INC.
- TSO-HUNG YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090108436
- Publication date Apr 30, 2009
- Toshio Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20080296051
- Publication date Dec 4, 2008
- Nitto Denko Corporation
- Kouichi YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD
- Publication number 20080257597
- Publication date Oct 23, 2008
- International Business Machines Corporation
- Kohichi Ohsumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE...
- Publication number 20080232077
- Publication date Sep 25, 2008
- Advanced Semiconductor Engineering, Inc.
- Che-Yuan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming via hole having fine hole land
- Publication number 20080209722
- Publication date Sep 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device
- Publication number 20080144260
- Publication date Jun 19, 2008
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method of the same
- Publication number 20080146051
- Publication date Jun 19, 2008
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective filling of through holes
- Publication number 20080127484
- Publication date Jun 5, 2008
- Viasystems Group, Inc.
- Joseph A.A.M. Tourne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF AND DUSTPROOF STRUCTURE
- Publication number 20080055867
- Publication date Mar 6, 2008
- Twinhead International Corp.
- SHU HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Air trapped circuit board test pad via
- Publication number 20080036481
- Publication date Feb 14, 2008
- Microsoft Corporation
- Chee Kiong Fong
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE CIRCUIT
- Publication number 20080003404
- Publication date Jan 3, 2008
- 3M Innovative Properties Company
- Rui Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Organic Substrate with Integral Thermal Dissipation Channels, and M...
- Publication number 20080000087
- Publication date Jan 3, 2008
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of circuit board
- Publication number 20070287285
- Publication date Dec 13, 2007
- Advanced Semiconductor Engineerig, Inc.
- Chi-Chao Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of a package substrate
- Publication number 20070281390
- Publication date Dec 6, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Covering open PTHs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedding discrete components having variable dimensions in a subst...

Electronic device comprising a module connected to a PCB and electr...

Cortical implant system for brain stimulation and recording

Mounting substrate, manufacturing method for the same, and componen...

Method for manufacturing printed circuit board with etching process...

Printed wiring board and method for manufacturing printed wiring board

Printed circuit board and manufacture method thereof

Ceramic substrate, and method of manufacturing the same

Method of manufacturing wiring substrate having built-in component

Methods for filling holes in printed wiring boards

Method for electroconductive pattern formation

Method of manufacturing a printed circuit board

Manufacturing method of printed circuit board and manufacturing app...

Method for forming resist pattern, method for producing circuit boa...

Opto-electric hybrid board and manufacturing method thereof

Waterproof and dustproof structure

Printed circuit board manufacturing method and printed circuit board

Method for producing an organic substrate with integral thermal dis...

Methods for filling holes in printed wiring boards

Manufacturing method of printed circuit board

Manufacturing method of circuit board

Circuit board manufacturing method and circuit board

Electronic device and manufacturing method of the same

Multilayer wiring circuit board

Via hole having fine hole land and method for forming the same

Apparatus for venting an electronic control module

Electronic device

Photosensitive resin composition, photosensitive element, productio...

Printed circuit board having chip package mounted thereon and metho...

Ball grid array substrate having window and method of fabricating same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE COMPRISING A MODULE CONNECTED TO A PCB AND ELECTR...

PRINTED CIRCUIT BOARD

CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Methods for filling holes in printed wiring boards

METHOD FOR ELECTROCONDUCTIVE PATTERN FORMATION

OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREOF

Manufacturing method of printed circuit board and manufacturing app...

Method for Forming Resist Pattern, Method for Producing Circuit Boa...

METHOD OF FILLING VIAS WITH FUSIBLE METAL

SOLDER VOID REDUCTION ON CIRCUIT BOARDS

Printed circuit board and manufacturing method thereof

PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHO...

PRINTED CIRCUIT BOARD HAVING CHIP PACKAGE MOUNTED THEREON AND METHO...

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD MANUFACTURING METHOD AND PRINTED CIRCUIT BOARD

CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE...

Method for forming via hole having fine hole land

Electronic device

Electronic device and manufacturing method of the same

Selective filling of through holes

WATERPROOF AND DUSTPROOF STRUCTURE

Air trapped circuit board test pad via

FLEXIBLE CIRCUIT

Organic Substrate with Integral Thermal Dissipation Channels, and M...

Manufacturing method of circuit board

Manufacturing method of a package substrate