Cutting around hole

Industry

CPC
H05K2203/0242

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0242Cutting around hole

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming high aspect ratio plated through holes and high...
- Patent number 11,399,439
- Issue date Jul 26, 2022
- Sanmina Corporation
- Douglas Ward Thomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,813,214
- Issue date Oct 20, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin array including segmented pins for forming selectively plated t...
- Patent number 10,561,020
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming high aspect ratio plated through holes and high...
- Patent number 10,188,001
- Issue date Jan 22, 2019
- Sanmina Corporation
- Douglas Ward Thomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 10,015,881
- Issue date Jul 3, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a circuit board
- Patent number 9,560,774
- Issue date Jan 31, 2017
- Force10 Networks, Inc.
- Joel R. Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector footprints in printed circuit board (PCB)
- Patent number 9,545,003
- Issue date Jan 10, 2017
- FCI Americas Technology LLC
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB back drill detection method and PCB plating
- Patent number 9,258,885
- Issue date Feb 9, 2016
- ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO LTD.
- Shiqing Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal core board for vehicle-mountable junction box
- Patent number 9,232,629
- Issue date Jan 5, 2016
- Furukawa Electric Co., Ltd.
- Shinichi Jingama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Relief plug-in connector and multilayer circuit board
- Patent number 9,131,632
- Issue date Sep 8, 2015
- ERNI Production GmbH & Co. KG
- Roland Moedinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards with vias exhibiting reduced via capacitance
- Patent number 9,035,197
- Issue date May 19, 2015
- International Business Machines Corporation
- Eric R. Ao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making stubless printed circuit boards
- Patent number 8,963,020
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Stephen L. Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavities containing multi-wiring structures and devices
- Patent number 8,916,781
- Issue date Dec 23, 2014
- Invensas Corporation
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple layer printed circuit board with unplated vias
- Patent number 8,889,999
- Issue date Nov 18, 2014
- Cisco Technology, Inc.
- Aritharan Thurairajaratnam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having plated thru-holes and ground columns
- Patent number 8,715,006
- Issue date May 6, 2014
- Tyco Electronics Corporation
- Myoungsoo Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having via and method forming a via in a wiring board
- Patent number 8,604,357
- Issue date Dec 10, 2013
- NEC Corporation
- Tsutomu Takeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjacent plated through holes with staggered couplings for crosstal...
- Patent number 8,481,866
- Issue date Jul 9, 2013
- Amphenol Corporation
- Jason Edward Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assuring counterbore depth of vias on printed circuit bo...
- Patent number 8,431,834
- Issue date Apr 30, 2013
- Ciena Corporation
- Craig Twardy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making stubless printed circuit boards
- Patent number 8,404,981
- Issue date Mar 26, 2013
- International Business Machines Corporation
- Stephen L. Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spark gap apparatus
- Patent number 8,395,875
- Issue date Mar 12, 2013
- Andrew F. Tresness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate having a through hole and method of fabricating t...
- Patent number 8,373,265
- Issue date Feb 12, 2013
- Unimicron Technology Corporation
- Chih-Kuei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate and manufacturing method thereof
- Patent number 8,222,529
- Issue date Jul 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Je Hong Sung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reworkable passive element embedded printed circuit board
- Patent number 8,218,330
- Issue date Jul 10, 2012
- Samsung Electronics Co., Ltd.
- Hyo-jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed router with backplane using muli-diameter drilled thru-h...
- Patent number 8,158,892
- Issue date Apr 17, 2012
- Force10 Networks, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,151,455
- Issue date Apr 10, 2012
- Hitachi Via Mechanics, Ltd.
- Kazunori Hamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, fabrication method and apparatus
- Patent number 8,035,978
- Issue date Oct 11, 2011
- Fujitsu Limited
- Shigeru Sugino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjacent plated through holes with staggered couplings for crosstal...
- Patent number 7,999,192
- Issue date Aug 16, 2011
- Amphenol Corporation
- Jason Edward Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and manufacturing method of the same
- Patent number 7,842,611
- Issue date Nov 30, 2010
- Panasonic Corporation
- Yoshiaki Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector system
- Patent number 7,833,026
- Issue date Nov 16, 2010
- Tyco Electronics Corporation
- Chad William Morgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for repair of a contact pad of a printed circuit board
- Patent number 7,790,985
- Issue date Sep 7, 2010
- International Business Machines Corporation
- Joseph P. Palmeri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...
- Publication number 20190159346
- Publication date May 23, 2019
- Sanmina Corporation
- Douglas Ward THOMAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN ARRAY INCLUDING SEGMENTED PINS FOR FORMING SELECTIVELY PLATED T...
- Publication number 20190045629
- Publication date Feb 7, 2019
- International Business Machines Corporation
- MATTHEW S. DOYLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cavities Containing Multi-wiring Structures And Devices
- Publication number 20180295718
- Publication date Oct 11, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB BACK DRILL DETECTION METHOD AND PCB PLATING
- Publication number 20150264804
- Publication date Sep 17, 2015
- ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO LTD.
- Shiqing Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE PRINTED CIRCUIT BOARD
- Publication number 20140326495
- Publication date Nov 6, 2014
- Amphenol Corporation
- Jose Ricardo Paniagua
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS
- Publication number 20140182891
- Publication date Jul 3, 2014
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20140151104
- Publication date Jun 5, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yul Kyo CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING PLATED THRU-HOLES AND GROUND COLUMNS
- Publication number 20130330941
- Publication date Dec 12, 2013
- Tyco Electronics Corporation
- Myoungsoo Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING STUBLESS PRINTED CIRCUIT BOARDS
- Publication number 20130223030
- Publication date Aug 29, 2013
- International Business Machines Corporation
- Stephen L. Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES
- Publication number 20130122747
- Publication date May 16, 2013
- Invensas Corporation
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARDS WITH VIAS EXHIBITING REDUCED VIA CAPACITANCE
- Publication number 20130112470
- Publication date May 9, 2013
- International Business Machines Corporation
- Eric R. Ao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE LAYER PRINTED CIRCUIT BOARD
- Publication number 20130098671
- Publication date Apr 25, 2013
- ARITHARAN THURAIRAJARATNAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CORE BOARD FOR VEHICLE-MOUNTABLE JUNCTION BOX
- Publication number 20120292094
- Publication date Nov 22, 2012
- FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Shinichi Jinagama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20120279774
- Publication date Nov 8, 2012
- BAE Systems plc
- Murray Jerel Niman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIEF PLUG-IN CONNECTOR AND MULTILAYER CIRCUIT BOARD
- Publication number 20120244753
- Publication date Sep 27, 2012
- ERNI Electronics GmbH
- Roland Moedinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING A THROUGH HOLE AND METHOD OF FABRICATING T...
- Publication number 20120168959
- Publication date Jul 5, 2012
- Unimicron Technology Corporation
- Chih-Kuei Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-...
- Publication number 20120167386
- Publication date Jul 5, 2012
- DELL PRODUCTS L.P.
- Joel R. Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Spark Gap Apparatus
- Publication number 20120039010
- Publication date Feb 16, 2012
- Andrew F. Tresness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADJACENT PLATED THROUGH HOLES WITH STAGGERED COUPLINGS FOR CROSSTAL...
- Publication number 20120000701
- Publication date Jan 5, 2012
- Amphenol Corporation
- Jason Edward CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-tiered Circuit Board and Method of Manufacture
- Publication number 20110147069
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Richard A. Quackenbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20110094787
- Publication date Apr 28, 2011
- HON HAI Precision Industry CO., LTD.
- YING-TSO LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic substrate and manufacturing method thereof
- Publication number 20110042131
- Publication date Feb 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Je Hong Sung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ASSURING COUNTERBORE DEPTH OF VIAS ON PRINTED CIRCUIT BO...
- Publication number 20100314163
- Publication date Dec 16, 2010
- Nortel Networks Limited
- Craig Twardy
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD HAVING VIA AND METHOD FORMING A VIA IN A WIRING BOARD
- Publication number 20100012366
- Publication date Jan 21, 2010
- TSUTOMU TAKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES
- Publication number 20090188710
- Publication date Jul 30, 2009
- Cisco Technology, Inc.
- David D. Senk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20090179305
- Publication date Jul 16, 2009
- Panasonic Corporation
- Yoshiaki Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECOGNITION MARK AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20090178839
- Publication date Jul 16, 2009
- Toshiaki Takenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD AND APPARATUS
- Publication number 20090080168
- Publication date Mar 26, 2009
- FUJITSU LIMITED
- Shigeru SUGINO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
High-speed router with backplane using muli-diameter drilled thru-h...
- Publication number 20090045889
- Publication date Feb 19, 2009
- Force 10 Networks, Inc.
- Joel R. Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Configurable printed circuit board
- Publication number 20090017647
- Publication date Jan 15, 2009
- Jason R. Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Cutting around hole

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming high aspect ratio plated through holes and high...

Cavities containing multi-wiring structures and devices

Pin array including segmented pins for forming selectively plated t...

Methods of forming high aspect ratio plated through holes and high...

Cavities containing multi-wiring structures and devices

Method of fabricating a circuit board

Connector footprints in printed circuit board (PCB)

PCB back drill detection method and PCB plating

Metal core board for vehicle-mountable junction box

Relief plug-in connector and multilayer circuit board

Circuit boards with vias exhibiting reduced via capacitance

Process for making stubless printed circuit boards

Cavities containing multi-wiring structures and devices

Multiple layer printed circuit board with unplated vias

Circuit board having plated thru-holes and ground columns

Wiring board having via and method forming a via in a wiring board

Adjacent plated through holes with staggered couplings for crosstal...

Method for assuring counterbore depth of vias on printed circuit bo...

Process for making stubless printed circuit boards

Spark gap apparatus

Package substrate having a through hole and method of fabricating t...

Ceramic substrate and manufacturing method thereof

Reworkable passive element embedded printed circuit board

High-speed router with backplane using muli-diameter drilled thru-h...

Printed circuit board and method of manufacturing the same

Printed circuit board, fabrication method and apparatus

Adjacent plated through holes with staggered couplings for crosstal...

Substrate and manufacturing method of the same

Electrical connector system

Device for repair of a contact pad of a printed circuit board

Patents Applicationslast 30 patents

METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...

PIN ARRAY INCLUDING SEGMENTED PINS FOR FORMING SELECTIVELY PLATED T...

Cavities Containing Multi-wiring Structures And Devices

PCB BACK DRILL DETECTION METHOD AND PCB PLATING

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD TH...

CIRCUIT BOARD HAVING PLATED THRU-HOLES AND GROUND COLUMNS

PROCESS FOR MAKING STUBLESS PRINTED CIRCUIT BOARDS

CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES

CIRCUIT BOARDS WITH VIAS EXHIBITING REDUCED VIA CAPACITANCE

MULTIPLE LAYER PRINTED CIRCUIT BOARD

METAL CORE BOARD FOR VEHICLE-MOUNTABLE JUNCTION BOX

CIRCUIT BOARD

RELIEF PLUG-IN CONNECTOR AND MULTILAYER CIRCUIT BOARD

PACKAGE SUBSTRATE HAVING A THROUGH HOLE AND METHOD OF FABRICATING T...

HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-...

Spark Gap Apparatus

ADJACENT PLATED THROUGH HOLES WITH STAGGERED COUPLINGS FOR CROSSTAL...

Multi-tiered Circuit Board and Method of Manufacture

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Ceramic substrate and manufacturing method thereof

METHOD FOR ASSURING COUNTERBORE DEPTH OF VIAS ON PRINTED CIRCUIT BO...

WIRING BOARD HAVING VIA AND METHOD FORMING A VIA IN A WIRING BOARD

SYSTEM AND METHOD FOR FORMING FILLED VIAS AND PLATED THROUGH HOLES

SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

RECOGNITION MARK AND METHOD FOR MANUFACTURING CIRCUIT BOARD

PRINTED CIRCUIT BOARD, FABRICATION METHOD AND APPARATUS

High-speed router with backplane using muli-diameter drilled thru-h...

Configurable printed circuit board