Cutting, sawing, milling or shearing

Industry

CPC
H05K2203/0228

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0228Cutting, sawing, milling or shearing

Industries

Patents Grantslast 30 patents

Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 11,849,544
- Issue date Dec 19, 2023
- Gentherm GmbH
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Resistive PCB traces for improved stability
- Patent number 11,723,149
- Issue date Aug 8, 2023
- Kioxia Corporation
- Stephen Pardoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting systems and methods
- Patent number 11,690,172
- Issue date Jun 27, 2023
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing composite circuit board
- Patent number 11,672,083
- Issue date Jun 6, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible film, flexible film package and method for manufacturing f...
- Patent number 11,540,386
- Issue date Dec 27, 2022
- Samsung Display Co., Ltd.
- Boyeon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
All-directions embeded module, method for manufacturing the all-dir...
- Patent number 11,483,931
- Issue date Oct 25, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating Z-axis vertical launch
- Patent number 11,470,725
- Issue date Oct 11, 2022
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 11,452,215
- Issue date Sep 20, 2022
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing radio frequency interconnections
- Patent number 11,375,609
- Issue date Jun 28, 2022
- Raytheon Company
- Thomas V. Sikina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for producing a printed circuit board
- Patent number 11,363,723
- Issue date Jun 14, 2022
- VITESCO TECHNOLOGIES GERMANY GMBH
- Johannes Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 11,304,308
- Issue date Apr 12, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting systems and method
- Patent number 11,266,014
- Issue date Mar 1, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame assembly and method for manufacturing same
- Patent number 11,217,850
- Issue date Jan 4, 2022
- Yura Corporation Co., Ltd.
- Cheon Hyo Lee
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing composite circuit board and composite circu...
- Patent number 11,191,168
- Issue date Nov 30, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting electronic component, method of removing componen...
- Patent number 11,166,377
- Issue date Nov 2, 2021
- Kioxia Corporation
- Kazuya Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with high-capacity copper circuit
- Patent number 11,160,166
- Issue date Oct 26, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Fang-Bo Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the printed circuit...
- Patent number 11,134,565
- Issue date Sep 28, 2021
- ENDRESS+HAUSER SE+CO.KG
- Harald Schäuble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,134,575
- Issue date Sep 28, 2021
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Apparatus for fabricating Z-axis vertical launch within a printed c...
- Patent number 11,109,489
- Issue date Aug 31, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Display device and method for manufacturing same
- Patent number 11,075,224
- Issue date Jul 27, 2021
- AU OPTRONICS CORPORATION
- Hao-An Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
All-directions embeded module, method for manufacturing the all-dir...
- Patent number 11,044,813
- Issue date Jun 22, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing ceramic substrates and module components
- Patent number 11,019,727
- Issue date May 25, 2021
- Murata Manufacturing Co., Ltd.
- Masashi Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control unit
- Patent number 11,013,106
- Issue date May 18, 2021
- Aptiv Technologies Limited
- Moritz Schrey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...
- Publication number 20240206075
- Publication date Jun 20, 2024
- DP Patterning AB
- Staffan Nordlinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240172373
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Byung Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240040699
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240040708
- Publication date Feb 1, 2024
- FUJIKURA PRINTED CIRCUITS LTD.
- Daisuke Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230389179
- Publication date Nov 30, 2023
- Nitto Denko Corporation
- Kazutoshi KINOSHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380072
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Yi-Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...
- Publication number 20230309239
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- Minoru Kambegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20230171896
- Publication date Jun 1, 2023
- Innolux Corporation
- Pei-Chi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR TEMPERATURE MEASUREMENT
- Publication number 20230021547
- Publication date Jan 26, 2023
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Application
LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...
- Publication number 20220223506
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Xuanwei FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES
- Publication number 20220192028
- Publication date Jun 16, 2022
- GENTHERM GMBH
- Jan HORZELLA
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Application
METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD
- Publication number 20220030723
- Publication date Jan 27, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210368629
- Publication date Nov 25, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
METHOD OF CUTTING ELECTRONIC COMPONENT, METHOD OF REMOVING COMPONEN...
- Publication number 20210282267
- Publication date Sep 9, 2021
- KIOXIA Corporation
- Kazuya NAGASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD AND COMPOSITE CIRCU...
- Publication number 20210282273
- Publication date Sep 9, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- YANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...
- Publication number 20210267064
- Publication date Aug 26, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...
- Publication number 20210185832
- Publication date Jun 17, 2021
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTIVE PCB TRACES FOR IMPROVED STABILITY
- Publication number 20210153353
- Publication date May 20, 2021
- KIOXIA Corporation
- Stephen Pardoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL CONDUCTOR LAMINATED SUBSTRATE
- Publication number 20210136930
- Publication date May 6, 2021
- Gentherm Inc.
- Timothy HUGHES
- B60 - VEHICLES IN GENERAL
Information Patent Application
ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...
- Publication number 20210120674
- Publication date Apr 22, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Conductor Laminated Substrate
- Publication number 20210100109
- Publication date Apr 1, 2021
- Gentherm Inc.
- Timothy HUGHES
- B60 - VEHICLES IN GENERAL
Information Patent Application
CATHETER COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURIN...
- Publication number 20210069469
- Publication date Mar 11, 2021
- Carl Freudenberg KG
- Benno Schmied
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Cutting, sawing, milling or shearing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED circuit board structure and LED testing and packaging method

Lead frame, packaged integrated circuit board, power chip, and circ...

Milling of flex foil with two conductive layers from both sides

Dual conductor laminated substrate

Resistive PCB traces for improved stability

Unit unloading system

LED lighting systems and methods

Method of manufacturing composite circuit board

Electronics assemblies for downhole use

Component embedded in component carrier and having an exposed side...

Flexible film, flexible film package and method for manufacturing f...

Method for manufacturing flexible circuit board

All-directions embeded module, method for manufacturing the all-dir...

Method for fabricating Z-axis vertical launch

Wiring circuit board, producing method thereof, and wiring circuit...

Method of manufacturing radio frequency interconnections

Printed circuit board and method for producing a printed circuit board

Flexible circuit board interconnection and methods

LED lighting systems and method

Frame assembly and method for manufacturing same

Method of manufacturing composite circuit board and composite circu...

Method of cutting electronic component, method of removing componen...

Printed circuit board with high-capacity copper circuit

Printed circuit board and method for producing the printed circuit...

Dual conductor laminated substrate

Apparatus for fabricating Z-axis vertical launch within a printed c...

Display device and method for manufacturing same

All-directions embeded module, method for manufacturing the all-dir...

Methods for producing ceramic substrates and module components

Electronic control unit

Patents Applicationslast 30 patents

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

TAPE AND MANUFACTURING METHOD THEREOF

MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

DEVICE FOR TEMPERATURE MEASUREMENT

LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...

MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES

METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

METHOD OF CUTTING ELECTRONIC COMPONENT, METHOD OF REMOVING COMPONEN...

METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD AND COMPOSITE CIRCU...

ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...

WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...

RESISTIVE PCB TRACES FOR IMPROVED STABILITY

DUAL CONDUCTOR LAMINATED SUBSTRATE

ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...

Dual Conductor Laminated Substrate

CATHETER COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURIN...