Cutting

Industry

CPC
H01J2237/3109

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/3109Cutting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing lift out specimens for teaching, practice, and...
- Patent number 10,522,324
- Issue date Dec 31, 2019
- EXpressLO LLC
- Lucille A. Giannuzzi
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for sample extraction and handling
- Patent number 9,349,570
- Issue date May 24, 2016
- FEI Company
- Enrique Agorio
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for sample extraction and handling
- Patent number 8,993,962
- Issue date Mar 31, 2015
- FEI Company
- Enrique Agorio
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing sample for atom probe analysis by FIB and f...
- Patent number 8,728,286
- Issue date May 20, 2014
- Sii Nano Technology Inc.
- Takashi Kaito
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for sample extraction and handling
- Patent number 8,357,913
- Issue date Jan 22, 2013
- FEI Company
- Enrique Agorio
- G01 - MEASURING TESTING
Information Patent Grant
Analysis method for semiconductor device
- Patent number 8,093,074
- Issue date Jan 10, 2012
- United Microelectronics Corp.
- Chih-Chung Chang
- G01 - MEASURING TESTING
Information Patent Grant
Hydrogen ion implanter using a broad beam source
- Patent number 7,897,945
- Issue date Mar 1, 2011
- Twin Creeks Technologies, Inc.
- Thomas Parrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atom probe apparatus and method for working sample preliminary for...
- Patent number 7,550,723
- Issue date Jun 23, 2009
- SII NanoTechnology Inc.
- Takashi Kaito
- G01 - MEASURING TESTING
Information Patent Grant
Focused ion beam apparatus and liquid metal ion source
- Patent number 7,435,972
- Issue date Oct 14, 2008
- Hitachi High-Technologies Corporation
- Yuichi Madokoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Focused ion beam apparatus and aperture
- Patent number 7,189,982
- Issue date Mar 13, 2007
- Hitachi High-Technologies Corporation
- Yuichi Madokoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sample separation and lift-out with one cut
- Patent number 6,420,722
- Issue date Jul 16, 2002
- Omniprobe, Inc.
- Thomas M. Moore
- G01 - MEASURING TESTING
Information Patent Grant
Scanning electron microscope for observation of cross section and m...
- Patent number 5,093,572
- Issue date Mar 3, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Kunihiro Hosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3417222
- Patent number 3,417,222
- Issue date Dec 17, 1968
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3222496
- Patent number 3,222,496
- Issue date Dec 7, 1965
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD OF CLEAVING THIN LAYER FROM BULK MATERIAL
- Publication number 20160319462
- Publication date Nov 3, 2016
- Silicon Genesis Corporation
- Francois J. HENLEY
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD AND APPARATUS FOR SAMPLE EXTRACTION AND HANDLING
- Publication number 20130153785
- Publication date Jun 20, 2013
- FEI Company
- Enrique Agorio
- G01 - MEASURING TESTING
Information Patent Application
Analysis method for semiconductor device
- Publication number 20110151597
- Publication date Jun 23, 2011
- United Microelectronics Corp.
- Chih-Chung Chang
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR SAMPLE EXTRACTION AND HANDLING
- Publication number 20100305747
- Publication date Dec 2, 2010
- FEI Company
- Enrique Agorio
- G01 - MEASURING TESTING
Information Patent Application
HYDROGEN ION IMPLANTER USING A BROAD BEAM SOURCE
- Publication number 20100072401
- Publication date Mar 25, 2010
- TWIN CREEKS TECHNOLOGIES, INC.
- Thomas Parrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Sample for Atom Probe Analysis by FIB and F...
- Publication number 20080289954
- Publication date Nov 27, 2008
- Takashi Kaito
- G01 - MEASURING TESTING
Information Patent Application
Atomically sharp edged cutting blades and methods for making same
- Publication number 20070283578
- Publication date Dec 13, 2007
- Martin H. Newman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Atom probe apparatus and method for working sample preliminarily fo...
- Publication number 20070176099
- Publication date Aug 2, 2007
- Takashi Kaito
- G01 - MEASURING TESTING
Information Patent Application
Focused ion beam apparatus and aperture
- Publication number 20070152174
- Publication date Jul 5, 2007
- Hitachi High-Technologies Corporation
- Yuichi Madokoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Focused ion beam apparatus and aperture
- Publication number 20060054840
- Publication date Mar 16, 2006
- Hitachi High-Technologies Corporation
- Yuichi Madokoro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomically sharp edged cutting blades and methods for making same
- Publication number 20050210684
- Publication date Sep 29, 2005
- Martin H. Newman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Preparation of sample chip, method of observing wall surface thereo...
- Publication number 20040185586
- Publication date Sep 23, 2004
- Masatoshi Yasutake
- G01 - MEASURING TESTING
Information Patent Application
Method for sample separation and lift-out
- Publication number 20010045511
- Publication date Nov 29, 2001
- Thomas M. Moore
- G01 - MEASURING TESTING

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of producing lift out specimens for teaching, practice, and...

Method and apparatus for sample extraction and handling

Method and apparatus for sample extraction and handling

Method of manufacturing sample for atom probe analysis by FIB and f...

Method and apparatus for sample extraction and handling

Analysis method for semiconductor device

Hydrogen ion implanter using a broad beam source

Atom probe apparatus and method for working sample preliminary for...

Focused ion beam apparatus and liquid metal ion source

Focused ion beam apparatus and aperture

Method for sample separation and lift-out with one cut

Scanning electron microscope for observation of cross section and m...

3417222

3222496

Patents Applicationslast 30 patents

APPARATUS AND METHOD OF CLEAVING THIN LAYER FROM BULK MATERIAL

METHOD AND APPARATUS FOR SAMPLE EXTRACTION AND HANDLING

Analysis method for semiconductor device

METHOD AND APPARATUS FOR SAMPLE EXTRACTION AND HANDLING

HYDROGEN ION IMPLANTER USING A BROAD BEAM SOURCE

Method of Manufacturing Sample for Atom Probe Analysis by FIB and F...

Atomically sharp edged cutting blades and methods for making same

Atom probe apparatus and method for working sample preliminarily fo...

Focused ion beam apparatus and aperture

Focused ion beam apparatus and aperture

Atomically sharp edged cutting blades and methods for making same

Preparation of sample chip, method of observing wall surface thereo...

Method for sample separation and lift-out