Discharge tubes exposing object to beam

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS

H01J2237/00Discharge tubes exposing object to beam

H01J2237/002Cooling arrangements H01J2237/004Charge control of objects or beams H01J2237/0041Neutralising arrangements H01J2237/0042Deflection of neutralising particles H01J2237/0044of objects being observed or treated H01J2237/0045using secondary electrons H01J2237/0047using electromagnetic radiations H01J2237/0048Charging arrangements H01J2237/006Details of gas supplies - H01J2237/02Details H01J2237/0203Protection arrangements H01J2237/0206Extinguishing, preventing or controlling unwanted discharges H01J2237/0209Avoiding or diminishing effects of eddy currents H01J2237/0213Avoiding deleterious effects due to interactions between particles and tube elements H01J2237/0216Means for avoiding or correcting vibration effects H01J2237/022Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube H01J2237/0225Detecting or monitoring foreign particles H01J2237/024Moving components not otherwise provided for H01J2237/0245Moving whole optical system relatively to object H01J2237/026Shields H01J2237/0262electrostatic H01J2237/0264magnetic H01J2237/0266electromagnetic H01J2237/0268Liner tubes H01J2237/028Particle traps H01J2237/03Mounting, supporting, spacing or insulating electrodes H01J2237/032Mounting or supporting H01J2237/036Spacing H01J2237/038Insulating H01J2237/04Means for controlling the discharge H01J2237/041Beam polarising means H01J2237/043Beam blanking H01J2237/0432High speed and short duration H01J2237/0435Multi-aperture H01J2237/0437Semiconductor substrate H01J2237/045Diaphragms H01J2237/0451with fixed aperture H01J2237/0453multiple apertures H01J2237/0455with variable aperture H01J2237/0456Supports H01J2237/0458movable H01J2237/047Changing particle velocity H01J2237/0473accelerating H01J2237/04732with magnetic means H01J2237/04735with electrostatic means H01J2237/04737radio-frequency quadrupole [RFQ] H01J2237/0475decelerating H01J2237/04753with magnetic means H01J2237/04756with electrostatic means H01J2237/049Focusing means H01J2237/0492Lens systems H01J2237/04922electromagnetic H01J2237/04924electrostatic H01J2237/04926combined H01J2237/04928Telecentric systems H01J2237/05Arrangements for energy or mass analysis H01J2237/053electrostatic H01J2237/0535Mirror analyser H01J2237/055magnetic H01J2237/057Energy or mass filtering H01J2237/06Sources H01J2237/061Construction H01J2237/062Reducing size of gun H01J2237/063Electron sources H01J2237/06308Thermionic sources H01J2237/06316Schottky emission H01J2237/06325Cold-cathode sources H01J2237/06333Photo emission H01J2237/06341Field emission H01J2237/0635Multiple source H01J2237/06358Secondary emission H01J2237/06366Gas discharge electron sources H01J2237/06375Arrangement of electrodes H01J2237/06383Spin polarised electron sources H01J2237/06391Positron sources H01J2237/065Source emittance characteristics H01J2237/0653Intensity H01J2237/0656Density H01J2237/08Ion sources H01J2237/0802Field ionization sources H01J2237/0805Liquid metal sources H01J2237/0807Gas field ion sources [GFIS] H01J2237/081Sputtering sources H01J2237/0812Ionized cluster beam [ICB] sources H01J2237/0815Methods of ionisation H01J2237/0817Microwaves H01J2237/082Electron beam H01J2237/0822Multiple sources H01J2237/0825for producing different ions simultaneously H01J2237/0827for producing different ions sequentially H01J2237/083Beam forming H01J2237/0835Variable cross-section or shape H01J2237/10Lenses H01J2237/103characterised by lens type H01J2237/1035Immersion lens H01J2237/12electrostatic H01J2237/1202Associated circuits H01J2237/1205Microlenses H01J2237/1207Einzel lenses H01J2237/121characterised by shape H01J2237/1215Annular electrodes H01J2237/14magnetic H01J2237/1405Constructional details H01J2237/141Coils H01J2237/1415Bores or yokes H01J2237/142with superconducting coils H01J2237/15Means for deflecting or directing discharge H01J2237/1501Beam alignment means or procedures H01J2237/1502Mechanical adjustments H01J2237/1503Mechanical scanning H01J2237/1504Associated circuits H01J2237/1505Rotating beam around optical axis H01J2237/1506Tilting or rocking beam around an axis substantially at an angle to optical axis H01J2237/1507dynamically H01J2237/1508Combined electrostatic-electromagnetic means H01J2237/151Electrostatic means H01J2237/1512Travelling wave deflectors H01J2237/1514Prisms H01J2237/1516Multipoles H01J2237/1518for X-Y scanning H01J2237/152Magnetic means H01J2237/1523Prisms H01J2237/1526For X-Y scanning H01J2237/153Correcting image defects H01J2237/1532Astigmatism H01J2237/1534Aberrations H01J2237/1536Image distortions due to scanning H01J2237/1538Space charge (Boersch) effect compensation H01J2237/16Vessels H01J2237/162Open vessel H01J2237/164Particle-permeable windows H01J2237/166Sealing means H01J2237/18Vacuum control means H01J2237/182Obtaining or maintaining desired pressure H01J2237/1825Evacuating means H01J2237/184Vacuum locks H01J2237/186Valves H01J2237/188Differential pressure H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated H01J2237/2001Maintaining constant desired temperature H01J2237/2002Controlling environment of sample H01J2237/2003Environmental cells H01J2237/2004Biological samples H01J2237/2005Seal mechanisms H01J2237/2006Vacuum seals H01J2237/2007Holding mechanisms H01J2237/2008specially adapted for studying electrical or magnetical properties of objects H01J2237/201for mounting multiple objects H01J2237/202Movement H01J2237/20207Tilt H01J2237/20214Rotation H01J2237/20221Translation H01J2237/20228Mechanical X-Y scanning H01J2237/20235Z movement or adjustment H01J2237/20242Eucentric movement H01J2237/2025Sensing velocity of translation or rotation H01J2237/20257Magnetic coupling H01J2237/20264Piezoelectric devices H01J2237/20271Temperature responsive devices H01J2237/20278Motorised movement H01J2237/20285computer-controlled H01J2237/20292Means for position and/or orientation registration H01J2237/204Means for introducing and/or outputting objects H01J2237/206Modifying objects while observing H01J2237/2062Mechanical constraints H01J2237/2065Temperature variations H01J2237/2067Surface alteration H01J2237/208Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof H01J2237/21Focus adjustment H01J2237/213during electron or ion beam welding or cutting H01J2237/216Automatic focusing methods H01J2237/22Treatment of data H01J2237/221Image processing H01J2237/223Fourier techniques H01J2237/225Displaying image using synthesised colours H01J2237/226Image reconstruction H01J2237/228Charged particle holography H01J2237/244Detection characterized by the detecting means H01J2237/24405Faraday cages H01J2237/2441Semiconductor detectors H01J2237/24415X-ray H01J2237/2442Energy-dispersive (Si-Li type) spectrometer H01J2237/24425Wavelength-dispersive spectrometer H01J2237/2443Scintillation detectors H01J2237/24435Microchannel plates H01J2237/2444Electron Multiplier H01J2237/24445using avalanche in a gas H01J2237/2445Photon detectors for X-rays, light H01J2237/24455Transmitted particle detectors H01J2237/2446Position sensitive detectors H01J2237/24465Sectored detectors H01J2237/2447Imaging plates H01J2237/24475Scattered electron detectors H01J2237/2448Secondary particle detectors H01J2237/24485Energy spectrometers H01J2237/2449Detector devices with moving charges in electric or magnetic fields H01J2237/24495Signal processing H01J2237/245Detection characterised by the variable being measured H01J2237/24507Intensity, dose or other characteristics of particle beams or electromagnetic radiation H01J2237/24514Beam diagnostics including control of the parameter or property diagnosed H01J2237/24521Beam diameter H01J2237/24528Direction of beam or parts thereof in view of the optical axis H01J2237/24535Beam current H01J2237/24542Beam profile H01J2237/2455Polarisation (electromagnetic beams) H01J2237/24557Spin polarisation (particles) H01J2237/24564Measurements of electric or magnetic variables H01J2237/24571Measurements of non-electric or non-magnetic variables H01J2237/24578Spatial variables H01J2237/24585Other variables H01J2237/24592Inspection and quality control of devices H01J2237/248Components associated with the control of the tube H01J2237/2482Optical means H01J2237/2485Electric or electronic means H01J2237/2487using digital signal processors H01J2237/25Tubes for localised analysis using electron or ion beams H01J2237/2505characterised by their application H01J2237/2511Auger spectrometers H01J2237/2516Secondary particles mass or energy spectrometry H01J2237/2522of electrons (ESCA, XPS) H01J2237/2527Ions [SIMS] H01J2237/2533Neutrals [SNMS] H01J2237/2538Low energy electron microscopy [LEEM] H01J2237/2544Diffraction [LEED] H01J2237/255Reflection diffraction [RHEED] H01J2237/2555Microprobes H01J2237/2561electron H01J2237/2566ion H01J2237/2572proton H01J2237/2577atomic H01J2237/2583using tunnel effects H01J2237/2588Lorenz microscopy (magnetic field measurement) H01J2237/2594Measuring electric fields or potentials H01J2237/26Electron or ion microscopes H01J2237/2602Details H01J2237/2605operating at elevated pressures H01J2237/2608with environmental specimen chamber H01J2237/2611Stereoscopic measurements and/or imaging H01J2237/2614Holography or phase contrast, phase related imaging in general H01J2237/2617Comparison or superposition of transmission images Moirè H01J2237/262Non-scanning techniques H01J2237/2623Field-emission microscopes H01J2237/2626Pulsed source H01J2237/28Scanning microscopes H01J2237/2801Details H01J2237/2802Transmission microscopes H01J2237/2803characterised by the imaging method H01J2237/2804Scattered primary beam H01J2237/2805Elastic scattering H01J2237/2806Secondary charged particle H01J2237/2807X-rays H01J2237/2808Cathodoluminescence H01J2237/2809characterised by the imaging problems involved H01J2237/281Bottom of trenches or holes H01J2237/2811Large objects H01J2237/2812Emission microscopes H01J2237/2813characterised by the application H01J2237/2814Measurement of surface topography H01J2237/2815Depth profile H01J2237/2816Length H01J2237/2817Pattern inspection H01J2237/2818Scanning tunnelling microscopes H01J2237/282Determination of microscope properties H01J2237/2823Resolution H01J2237/2826Calibration H01J2237/285Emission microscopes H01J2237/2852Auto-emission ( H01J2237/2855Photo-emission H01J2237/2857Particle bombardment induced emission H01J2237/30Electron or ion beam tubes for processing objects H01J2237/303Electron or ion optical systems H01J2237/304Controlling tubes H01J2237/30405Details H01J2237/30411using digital signal processors [DSP] H01J2237/30416Handling of data H01J2237/30422Data compression H01J2237/30427using neural networks or fuzzy logic H01J2237/30433System calibration H01J2237/30438Registration H01J2237/30444Calibration grids H01J2237/3045Deflection calibration H01J2237/30455Correction during exposure H01J2237/30461pre-calculated H01J2237/30466Detecting endpoint of process H01J2237/30472Controlling the beam H01J2237/30477Beam diameter H01J2237/30483Scanning H01J2237/30488Raster scan H01J2237/30494Vector scan H01J2237/31Processing objects on a macro-scale H01J2237/3104Welding H01J2237/3109Cutting H01J2237/3114Machining H01J2237/3118Drilling H01J2237/3123Casting H01J2237/3128Melting H01J2237/3132Evaporating H01J2237/3137Plasma-assisted co-operation H01J2237/3142Ion plating H01J2237/3146Ion beam bombardment sputtering H01J2237/3151Etching H01J2237/3156Curing H01J2237/316Changing physical properties H01J2237/3165Changing chemical properties H01J2237/317Processing objects on a micro-scale H01J2237/31701Ion implantation H01J2237/31703Dosimetry H01J2237/31705Impurity or contaminant control H01J2237/31706characterised by the area treated H01J2237/31708unpatterned H01J2237/3171patterned H01J2237/31711using mask H01J2237/31713Focused ion beam H01J2237/31715Particle-beam lithography H01J2237/31716Production of exposure radiation H01J2237/31718Illumination systems for mask or workpiece H01J2237/3172Systems for imaging mask onto workpiece H01J2237/31722Imaging systems for maskless apparatus H01J2237/31723Imaging strategies H01J2237/31725Testing and control H01J2237/31727Handling mask or workpiece H01J2237/31728Alignment of the mask or the workpiece H01J2237/3173Constructional details of particle beam apparatus not otherwise provided for H01J2237/31732Depositing thin layers on selected microareas H01J2237/31733using STM H01J2237/31735Direct-write microstructures H01J2237/31737using ions H01J2237/31738using STM H01J2237/3174Etching microareas H01J2237/31742for repairing masks H01J2237/31744introducing gas in vicinity of workpiece H01J2237/31745for preparing specimen to be viewed in microscopes or analyzed in microanalysers H01J2237/31747using STM H01J2237/31749Focused ion beam H01J2237/3175Lithography H01J2237/31752using particular beams or near-field effects H01J2237/31754using electron beams H01J2237/31755using ion beams H01J2237/31757hybrid H01J2237/31759using near-field effects H01J2237/31761Patterning strategy H01J2237/31762Computer and memory organisation H01J2237/31764Dividing into sub-patterns H01J2237/31766Continuous moving of wafer H01J2237/31767Step and repeat H01J2237/31769Proximity effect correction H01J2237/31771using multiple exposure H01J2237/31772Flood beam H01J2237/31774Multi-beam H01J2237/31776Shaped beam H01J2237/31777by projection H01J2237/31779from patterned photocathode H01J2237/31781from patterned cold cathode H01J2237/31783M-I-M cathode H01J2237/31784Semiconductor cathode H01J2237/31786Field-emitting cathode H01J2237/31788through mask H01J2237/31789Reflection mask H01J2237/31791Scattering mask H01J2237/31793Problems associated with lithography H01J2237/31794affecting masks H01J2237/31796affecting resists H01J2237/31798detecting pattern defects H01J2237/32Processing objects by plasma generation H01J2237/327Arrangements for generating the plasma H01J2237/33characterised by the type of processing H01J2237/332Coating H01J2237/3321CVD [Chemical Vapor Deposition] H01J2237/3322Problems associated with coating H01J2237/3323uniformity H01J2237/3325large area H01J2237/3326high speed H01J2237/3327Coating high aspect ratio workpieces H01J2237/3328adhesion, stress, lift-off of deposited films H01J2237/334Etching H01J2237/3341Reactive etching H01J2237/3342Resist stripping H01J2237/3343Problems associated with etching H01J2237/3344isotropy H01J2237/3345anisotropy H01J2237/3346Selectivity H01J2237/3347bottom of holes or trenches H01J2237/3348control of ion bombardment energy H01J2237/335Cleaning H01J2237/3355Holes or apertures H01J2237/336Changing physical properties of treated surfaces H01J2237/3365Plasma source implantation H01J2237/338Changing chemical properties of treated surfaces H01J2237/3382Polymerising H01J2237/3385Carburising H01J2237/3387Nitriding H01J2237/339Synthesising components