Deburring, rounding, bevelling or smoothing conductor edges

Industry

CPC
H05K2203/0346

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0346Deburring, rounding, bevelling or smoothing conductor edges

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for wiring board
- Patent number 10,874,021
- Issue date Dec 22, 2020
- Disco Corporation
- Ye Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Trench cutting with laser machining
- Patent number 10,149,391
- Issue date Dec 4, 2018
- uBeam Inc.
- Nicholas Lavada Nemeth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 9,538,664
- Issue date Jan 3, 2017
- Shinko Electric Industries Co., Ltd.
- Hiroharu Yanagisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic wiring board, multi-piece ceramic wiring board, and method...
- Patent number 9,232,643
- Issue date Jan 5, 2016
- NGK Spark Plug Co., Ltd.
- Masami Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
X-ray processing device and X-ray processing method
- Patent number 9,138,835
- Issue date Sep 22, 2015
- Seiko Precision Inc.
- Ikuo Shiozawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and method of manufacturing the same
- Patent number 9,137,904
- Issue date Sep 15, 2015
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Achieving greater planarity between upper surfaces of a layer and a...
- Patent number 9,093,401
- Issue date Jul 28, 2015
- GLOBALFOUNDRIES, INC.
- Xunyuan Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 9,066,417
- Issue date Jun 23, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring over substrate, semiconductor device, and methods for manufa...
- Patent number 8,669,663
- Issue date Mar 11, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Shinya Sasagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered wiring substrate
- Patent number 8,581,388
- Issue date Nov 12, 2013
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated wiring board and method for manufacturing the same
- Patent number 8,502,086
- Issue date Aug 6, 2013
- Fujikura Ltd.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded substrate having circuit layer element with oblique side s...
- Patent number 8,461,461
- Issue date Jun 11, 2013
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and electrolytic etch...
- Patent number 8,366,903
- Issue date Feb 5, 2013
- Hitachi Via Mechanics
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a wiring over a substrate
- Patent number 7,989,351
- Issue date Aug 2, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shinya Sasagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 7,954,234
- Issue date Jun 7, 2011
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing capacitor embedded in PCB
- Patent number 7,736,397
- Issue date Jun 15, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Manufacturing method of printed wiring board as well as copper-clad...
- Patent number 7,666,320
- Issue date Feb 23, 2010
- Hitachi Via Mechanics, Ltd.
- Toshinori Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a wiring over a substrate
- Patent number 7,538,039
- Issue date May 26, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Shinya Sasagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting multi-layer printed circuit board
- Patent number 7,320,173
- Issue date Jan 22, 2008
- LG Electronics Inc.
- Sung-Gue Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 7,291,037
- Issue date Nov 6, 2007
- Chicony Electronics Co. Ltd
- Ching-Cheng Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-laminate panels for capacitive printed-circuit boards and meth...
- Patent number 7,018,703
- Issue date Mar 28, 2006
- Matsushita Electric Works, Ltd.
- Arthur J. Fillion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing punched fragments and a method for producing an...
- Patent number 6,813,829
- Issue date Nov 9, 2004
- NGK Insulators, Ltd.
- Yukihisa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Finishing method for producing thin-laminate panels
- Patent number 6,789,298
- Issue date Sep 14, 2004
- Matsushita Electronic Materials, Inc.
- Arthur J. Fillion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-laminate panels for capacitive printed-circuit boards and meth...
- Patent number 6,783,620
- Issue date Aug 31, 2004
- Matsushita Electronic Materials, Inc.
- Terrence A. Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad board suitable for making hole with carbon dioxide lase...
- Patent number 6,736,988
- Issue date May 18, 2004
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing high-density copper clad multi-layered printed...
- Patent number 6,708,404
- Issue date Mar 23, 2004
- Mitsubishi Gas Chemical Company, Inc.
- Morio Gaku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing fine-line circuit boards using chemical polishing
- Patent number 6,547,974
- Issue date Apr 15, 2003
- International Business Machines Corporation
- Stanley Michael Albrechta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for substantial planarization of solder bumps
- Patent number 6,543,267
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- David R. Hembree
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for substantial planarization of solder bumps
- Patent number 6,503,127
- Issue date Jan 7, 2003
- Micron Technology, Inc.
- David R. Hembree
- B24 - GRINDING POLISHING
Information Patent Grant
Insulating circuit board and power semiconductor apparatus employin...
- Patent number 6,504,110
- Issue date Jan 7, 2003
- Hitachi, Ltd.
- Junpei Kusukawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ACHIEVING GREATER PLANARITY BETWEEN UPPER SURFACES OF A LAYER AND A...
- Publication number 20140370705
- Publication date Dec 18, 2014
- GLOBALFOUNDRIES, Inc.
- Xunyuan ZHANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD
- Publication number 20140268610
- Publication date Sep 18, 2014
- Gregory HALVORSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262442
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACHIEVING GREATER PLANARITY BETWEEN UPPER SURFACES OF A LAYER AND A...
- Publication number 20140209563
- Publication date Jul 31, 2014
- GLOBALFOUNDRIES, Inc.
- Xunyuan ZHANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140182920
- Publication date Jul 3, 2014
- Hiroharu YANAGISAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20140097009
- Publication date Apr 10, 2014
- Kentaro KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140053397
- Publication date Feb 27, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD...
- Publication number 20140034372
- Publication date Feb 6, 2014
- NGK Spark Plug Co., Ltd.
- Masami Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-RAY PROCESSING DEVICE AND X-RAY PROCESSING METHOD
- Publication number 20130167346
- Publication date Jul 4, 2013
- Seiko Precision Inc.
- Ikuo SHIOZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING OVER SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFA...
- Publication number 20110272816
- Publication date Nov 10, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shinya Sasagawa
- G02 - OPTICS
Information Patent Application
Multilayered Wiring Substrate
- Publication number 20110156272
- Publication date Jun 30, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedded Substrate Having Circuit Layer Element With Oblique Side S...
- Publication number 20100288542
- Publication date Nov 18, 2010
- Chih-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100147576
- Publication date Jun 17, 2010
- FUJIKURA LTD.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20100044237
- Publication date Feb 25, 2010
- FOXCONN ADVANCED TECHNOLOGY INC.
- CHUNG-JEN TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ELIMINATING ENGRAVING DEFECTS FROM A METAL FILM DEPOSITE...
- Publication number 20090314145
- Publication date Dec 24, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jacqueline Bablet
- B08 - CLEANING
Information Patent Application
WIRING OVER SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFA...
- Publication number 20090206494
- Publication date Aug 20, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Shinya Sasagawa
- G02 - OPTICS
Information Patent Application
PATTERNED ELECTRODES WITH REDUCED RESIDUE
- Publication number 20090120901
- Publication date May 14, 2009
- PixelOptics Inc.
- Lawrence Keith White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board and electrolytic etch...
- Publication number 20090084684
- Publication date Apr 2, 2009
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080245549
- Publication date Oct 9, 2008
- Shinko Electric Industries Co., Ltd.
- Kotaro Kodani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Method for Processing Printed Circuit Board
- Publication number 20080230512
- Publication date Sep 25, 2008
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing capacitor embedded in PCB
- Publication number 20070234539
- Publication date Oct 11, 2007
- Samsung Electro-Mechanics CO., LTD.
- Seung Eun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Printed wiring board, method for manufacturing same, and circuit de...
- Publication number 20070145584
- Publication date Jun 28, 2007
- Mitsui Mining and Smelting Co., Ltd.
- Tatsuo Kataoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Flexible circuit board
- Publication number 20070099483
- Publication date May 3, 2007
- CHICONY ELECTRONICS CO. LTD
- Ching-Cheng Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of printed wiring board as well as copper-clad...
- Publication number 20060270232
- Publication date Nov 30, 2006
- Toshinori Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method for processing printed circuit board
- Publication number 20050244621
- Publication date Nov 3, 2005
- Hitachi Via Mechanics Ltd.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring over substrate, semiconductor device, and methods for manufa...
- Publication number 20050245087
- Publication date Nov 3, 2005
- Semiconductor Energy Laboratory Co., Ltd.
- Shinya Sasagawa
- G02 - OPTICS
Information Patent Application
Thin-laminate panels for capacitive printed-circuit boards and meth...
- Publication number 20040264106
- Publication date Dec 30, 2004
- Matsushita Electronic Materials, Inc.
- Arthur J. Fillion
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for interconnecting multi-layer printed circuit board
- Publication number 20040154162
- Publication date Aug 12, 2004
- LG Electronics Inc.
- Sung-Gue Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process of producing printed circuit boards and the circuit boards...
- Publication number 20040084399
- Publication date May 6, 2004
- Shipley Company, L.L.C.
- Lee M. Cook
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for removing punched fragments and a method for producing an...
- Publication number 20020166425
- Publication date Nov 14, 2002
- NGK Insulators, Ltd.
- Yukihisa Takeuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Deburring, rounding, bevelling or smoothing conductor edges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for wiring board

Trench cutting with laser machining

Wiring substrate

Ceramic wiring board, multi-piece ceramic wiring board, and method...

X-ray processing device and X-ray processing method

Module and method of manufacturing the same

Achieving greater planarity between upper surfaces of a layer and a...

Method for manufacturing printed circuit board

Wiring over substrate, semiconductor device, and methods for manufa...

Multilayered wiring substrate

Laminated wiring board and method for manufacturing the same

Embedded substrate having circuit layer element with oblique side s...

Method for manufacturing printed wiring board and electrolytic etch...

Method for manufacturing a wiring over a substrate

Method of manufacturing a wiring board

Method for manufacturing capacitor embedded in PCB

Manufacturing method of printed wiring board as well as copper-clad...

Method for manufacturing a wiring over a substrate

Method for interconnecting multi-layer printed circuit board

Flexible circuit board

Thin-laminate panels for capacitive printed-circuit boards and meth...

Method for removing punched fragments and a method for producing an...

Finishing method for producing thin-laminate panels

Thin-laminate panels for capacitive printed-circuit boards and meth...

Copper-clad board suitable for making hole with carbon dioxide lase...

Method of producing high-density copper clad multi-layered printed...

Method of producing fine-line circuit boards using chemical polishing

Apparatus and methods for substantial planarization of solder bumps

Apparatus and methods for substantial planarization of solder bumps

Insulating circuit board and power semiconductor apparatus employin...

Patents Applicationslast 30 patents

ACHIEVING GREATER PLANARITY BETWEEN UPPER SURFACES OF A LAYER AND A...

METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD

MODULE AND METHOD OF MANUFACTURING THE SAME

ACHIEVING GREATER PLANARITY BETWEEN UPPER SURFACES OF A LAYER AND A...

WIRING SUBSTRATE

WIRING SUBSTRATE

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD...

X-RAY PROCESSING DEVICE AND X-RAY PROCESSING METHOD

WIRING OVER SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFA...

Multilayered Wiring Substrate

Embedded Substrate Having Circuit Layer Element With Oblique Side S...

LAMINATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

METHOD FOR ELIMINATING ENGRAVING DEFECTS FROM A METAL FILM DEPOSITE...

WIRING OVER SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFA...

PATTERNED ELECTRODES WITH REDUCED RESIDUE

Method for manufacturing printed wiring board and electrolytic etch...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Printed Circuit Board and Method for Processing Printed Circuit Board

Method for manufacturing capacitor embedded in PCB

Printed wiring board, method for manufacturing same, and circuit de...

Flexible circuit board

Manufacturing method of printed wiring board as well as copper-clad...

Printed circuit board and method for processing printed circuit board

Wiring over substrate, semiconductor device, and methods for manufa...

Thin-laminate panels for capacitive printed-circuit boards and meth...

Method for interconnecting multi-layer printed circuit board

Process of producing printed circuit boards and the circuit boards...

Method for removing punched fragments and a method for producing an...