Deformable particles

Industry

CPC
H05K2201/0233

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0233Deformable particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Biphasic material and stretchable circuit board
- Patent number 11,937,372
- Issue date Mar 19, 2024
- Yale University
- Rebecca Kramer-Bottiglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid ejection apparatus
- Patent number 11,031,538
- Issue date Jun 8, 2021
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid ejection apparatus
- Patent number 10,727,392
- Issue date Jul 28, 2020
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 9,332,642
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus and circuit board module thereof
- Patent number 9,307,655
- Issue date Apr 5, 2016
- AU OPTRONICS CORPORATION
- Chih-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particles and method of preparing the same
- Patent number 9,093,196
- Issue date Jul 28, 2015
- Nisshinbo Holdings, Inc.
- Toshifumi Hashiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particles comprising complex metal layer with density gr...
- Patent number 8,828,543
- Issue date Sep 9, 2014
- Cheil Industries Inc.
- Tae Sub Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing conductive particle, anisotropic conductive...
- Patent number 8,821,764
- Issue date Sep 2, 2014
- Samsung Display Co., Ltd.
- Min-Sok Jang
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic textile
- Patent number 8,569,189
- Issue date Oct 29, 2013
- Koninklijke Philips N.V.
- Rabin Bhattacharya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED-based light source utilizing asymmetric conductors
- Patent number 8,455,895
- Issue date Jun 4, 2013
- Bridgelux, Inc.
- Yan Chai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic part and joined structure
- Patent number 8,273,207
- Issue date Sep 25, 2012
- Sony Chemical & Information Device Corporation
- Tomoyuki Ishimatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing conductive particle, anisotropic conductive...
- Patent number 8,153,030
- Issue date Apr 10, 2012
- Samsung Electronics Co., Ltd.
- Min-Sok Jang
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Polymer particles, conductive particles, and an anisotropic conduct...
- Patent number 8,129,023
- Issue date Mar 6, 2012
- Cheil Industries Inc.
- Jung Bae Jun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particles for anisotropic conductive interconnection
- Patent number 8,089,151
- Issue date Jan 3, 2012
- Cheil Industries, Inc.
- Jung Bae Jun
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive bump with a plurality of contact elements
- Patent number 7,550,846
- Issue date Jun 23, 2009
- Palo Alto Research Center
- John C. Knights
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin particle, conductive particle, and anisotropic conductive adh...
- Patent number 7,524,559
- Issue date Apr 28, 2009
- Sony Chemical & Information Device Corporation
- Kazunobu Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Breakable interconnects and structures formed thereby
- Patent number 7,507,604
- Issue date Mar 24, 2009
- Intel Corporation
- Daoqiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particle and adhesive agent
- Patent number 7,413,686
- Issue date Aug 19, 2008
- Sony Chemicals Corporation
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnector, method for manufacturing a plasma display device us...
- Patent number 7,413,452
- Issue date Aug 19, 2008
- Samsung SDI Co., Ltd.
- Young-Chul Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin particle, conductive particle and anisotropic conductive adhe...
- Patent number 7,338,710
- Issue date Mar 4, 2008
- Sony Chemicals & Information Device Corporation
- Kazunobu Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Coated conductive particle coated conductive particle manufacturing...
- Patent number 7,291,393
- Issue date Nov 6, 2007
- Sekisui Chemical Co., Ltd.
- Takeshi Wakiya
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Liquid crystal device and manufacturing method therefor
- Patent number 6,956,635
- Issue date Oct 18, 2005
- Semiconductor Energy Laboratory Co., Ltd.
- Akira Mase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV curable and electrically conductive adhesive for bonding magneti...
- Patent number 6,947,258
- Issue date Sep 20, 2005
- Western Digital (Fremont), Inc.
- Weijin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
UV curable and electrically conductive adhesive for bonding magneti...
- Patent number 6,942,824
- Issue date Sep 13, 2005
- Western Digital (Fremont), Inc.
- Weijin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropically electroconductive connecting material
- Patent number 6,495,758
- Issue date Dec 17, 2002
- Sony Chemicals Corp.
- Masao Saitoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting material for anisotropically electroconductive connection
- Patent number 6,451,875
- Issue date Sep 17, 2002
- Sony Chemicals Corporation
- Yasuhiro Suga
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically conductive, thermoplastic, heat-activatable adhesive s...
- Patent number 6,447,898
- Issue date Sep 10, 2002
- tesa AG
- Ronald Pfaff
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming a coating onto a non-random monolayer of particle...
- Patent number 6,423,172
- Issue date Jul 23, 2002
- Loctite (R&D) Limited
- Ciaran McArdle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
BIPHASIC MATERIAL AND STRETCHABLE CIRCUIT BOARD
- Publication number 20210410283
- Publication date Dec 30, 2021
- Yale University
- Rebecca Bottiglio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20200321510
- Publication date Oct 8, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20190157541
- Publication date May 23, 2019
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...
- Publication number 20160327826
- Publication date Nov 10, 2016
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE...
- Publication number 20120152455
- Publication date Jun 21, 2012
- Samsung Electronics Co., Ltd.
- Min-Sok JANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
LED-Based Light Source Utilizing Asymmetric Conductors
- Publication number 20120112215
- Publication date May 10, 2012
- Yan Chai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC TEXTILE
- Publication number 20110100683
- Publication date May 5, 2011
- KONINKLIJKE PHILIPS ELECTRONICS N V
- Rabin Bhattacharya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING ELECTRONIC PART AND JOINED STRUCTURE
- Publication number 20100080995
- Publication date Apr 1, 2010
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE...
- Publication number 20090068916
- Publication date Mar 12, 2009
- Samsung Electronics Co., Ltd.
- Min-Sok JANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BREAKABLE INTERCONNECTS AND STRUCTURES FORMED THEREBY
- Publication number 20080153207
- Publication date Jun 26, 2008
- Intel Corporation
- Daoqiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Particles Comprising Complex Metal Layer With Density Gr...
- Publication number 20080102277
- Publication date May 1, 2008
- CHEIL INDUSTRIES INC.
- Tae Sub BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PARTICLES AND METHOD OF PREPARING THE SAME
- Publication number 20080078977
- Publication date Apr 3, 2008
- Nisshinbo Industries, Inc.
- Toshifumi HASHIBA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin particle, conductive particle, and anisotropic conductive adh...
- Publication number 20070299159
- Publication date Dec 27, 2007
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazunobu Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polymer Particles, Conductive Particles, and an Anisotropic Conduct...
- Publication number 20070252112
- Publication date Nov 1, 2007
- CHEIL INDUSTRIES INC.
- Jung Bae JUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive particles for anisotropic conductive interconnection
- Publication number 20070145585
- Publication date Jun 28, 2007
- Jung Bae Jun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Contact structure formed by jet printing
- Publication number 20070138649
- Publication date Jun 21, 2007
- Palo Alto Research Center Incorporated
- John C. Knights
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Breakable interconnects and structures formed thereby
- Publication number 20060286721
- Publication date Dec 21, 2006
- Daoqiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulated conductive particles and an anisotropic conductive film c...
- Publication number 20060263581
- Publication date Nov 23, 2006
- Jin Gyu Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coated conductive particle coated conductive particle manufacturing...
- Publication number 20060154070
- Publication date Jul 13, 2006
- Takeshi Wakiya
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Conductive particle and adhesive agent
- Publication number 20060054867
- Publication date Mar 16, 2006
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid crystal device and manufacturing method therefor
- Publication number 20060033873
- Publication date Feb 16, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Akira Mase
- G02 - OPTICS
Information Patent Application
Resin particle, conductive particle and anisotropic conductive adhe...
- Publication number 20050228144
- Publication date Oct 13, 2005
- Kazunobu Kamiya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Interconnector, method for manufacturing a plasma display device us...
- Publication number 20050110406
- Publication date May 26, 2005
- Young-Chul Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid crystal device and manufacturing method therefor
- Publication number 20020067457
- Publication date Jun 6, 2002
- Akira Mase
- G02 - OPTICS
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE FILM
- Publication number 20020014615
- Publication date Feb 7, 2002
- YUKIO YAMADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A CONDUCTIVE PARTICLE TO CONDUCTIVELY BOND CONDUCTIVE MEMBERS TO EA...
- Publication number 20010046021
- Publication date Nov 29, 2001
- TAKESHI KOZUKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Anisotropically electroconductive connecting material
- Publication number 20010030019
- Publication date Oct 18, 2001
- Sony Chemicals Corp.
- Masao Saitoh
- B32 - LAYERED PRODUCTS
Information Patent Application
Rolling ball connector
- Publication number 20010002330
- Publication date May 31, 2001
- Joseph A. Benenati
- G01 - MEASURING TESTING

Deformable particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Biphasic material and stretchable circuit board

Liquid ejection apparatus

Liquid ejection apparatus

Connection body, method for manufacturing a connection body, connec...

Component-mounted structure

Circuit board

Display apparatus and circuit board module thereof

Conductive particles and method of preparing the same

Conductive particles comprising complex metal layer with density gr...

Method of manufacturing conductive particle, anisotropic conductive...

Electronic textile

LED-based light source utilizing asymmetric conductors

Method for connecting electronic part and joined structure

Method of manufacturing conductive particle, anisotropic conductive...

Polymer particles, conductive particles, and an anisotropic conduct...

Conductive particles for anisotropic conductive interconnection

Conductive bump with a plurality of contact elements

Resin particle, conductive particle, and anisotropic conductive adh...

Breakable interconnects and structures formed thereby

Conductive particle and adhesive agent

Interconnector, method for manufacturing a plasma display device us...

Resin particle, conductive particle and anisotropic conductive adhe...

Coated conductive particle coated conductive particle manufacturing...

Liquid crystal device and manufacturing method therefor

UV curable and electrically conductive adhesive for bonding magneti...

UV curable and electrically conductive adhesive for bonding magneti...

Anisotropically electroconductive connecting material

Connecting material for anisotropically electroconductive connection

Electrically conductive, thermoplastic, heat-activatable adhesive s...

Method of forming a coating onto a non-random monolayer of particle...

Patents Applicationslast 30 patents

BIPHASIC MATERIAL AND STRETCHABLE CIRCUIT BOARD

LIQUID EJECTION APPARATUS

LIQUID EJECTION APPARATUS

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...

METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE...

LED-Based Light Source Utilizing Asymmetric Conductors

ELECTRONIC TEXTILE

METHOD FOR CONNECTING ELECTRONIC PART AND JOINED STRUCTURE

METHOD OF MANUFACTURING CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE...

BREAKABLE INTERCONNECTS AND STRUCTURES FORMED THEREBY

Conductive Particles Comprising Complex Metal Layer With Density Gr...

CONDUCTIVE PARTICLES AND METHOD OF PREPARING THE SAME

Resin particle, conductive particle, and anisotropic conductive adh...

Polymer Particles, Conductive Particles, and an Anisotropic Conduct...

Conductive particles for anisotropic conductive interconnection

Contact structure formed by jet printing

Breakable interconnects and structures formed thereby

Insulated conductive particles and an anisotropic conductive film c...

Coated conductive particle coated conductive particle manufacturing...

Conductive particle and adhesive agent

Liquid crystal device and manufacturing method therefor

Resin particle, conductive particle and anisotropic conductive adhe...

Interconnector, method for manufacturing a plasma display device us...

Liquid crystal device and manufacturing method therefor

ANISOTROPIC CONDUCTIVE ADHESIVE FILM

A CONDUCTIVE PARTICLE TO CONDUCTIVELY BOND CONDUCTIVE MEMBERS TO EA...

Anisotropically electroconductive connecting material

Rolling ball connector