Details about a collection of particles

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CPC
H05K2201/0263

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0263Details about a collection of particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive particles and signal-transmitting connector havin...
- Patent number 11,763,959
- Issue date Sep 19, 2023
- TSE CO., LTD.
- Chang Su Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 11,729,908
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and insulating film used therein
- Patent number 11,337,305
- Issue date May 17, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dong Joo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Textile integration of electronic circuits
- Patent number 10,149,381
- Issue date Dec 4, 2018
- Imec VZW
- Bjorn Van Keymeulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin composition for prepreg, prepreg, and multilayer printe...
- Patent number 9,206,308
- Issue date Dec 8, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomoaki Iwami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240306312
- Publication date Sep 12, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, RESIN COATED COPPER, A...
- Publication number 20240059863
- Publication date Feb 22, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230180385
- Publication date Jun 8, 2023
- IBIDEN CO., LTD.
- Shogo FUKUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD
- Publication number 20230018333
- Publication date Jan 19, 2023
- NHK Spring Co., Ltd.
- Takeshi Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND INSULATING FILM USED THEREIN
- Publication number 20220183155
- Publication date Jun 9, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Dong Joo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE PARTICLES AND SIGNAL-TRANSMITTING CONNECTOR HAVIN...
- Publication number 20220005626
- Publication date Jan 6, 2022
- TSE CO., LTD.
- Chang Su Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Structure
- Publication number 20210274652
- Publication date Sep 2, 2021
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS
- Publication number 20160100480
- Publication date Apr 7, 2016
- IMEC vzw
- Bjorn Van Keymeulen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTE...
- Publication number 20130096233
- Publication date Apr 18, 2013
- PANASONIC CORPORATION
- Tomoaki Iwami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details about a collection of particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate

Circuit structure

Electroconductive particles and signal-transmitting connector havin...

Circuit structure

Printed circuit board and insulating film used therein

Textile integration of electronic circuits

Epoxy resin composition for prepreg, prepreg, and multilayer printe...

Patents Applicationslast 30 patents

WIRING SUBSTRATE

PRINTED WIRING BOARD

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, RESIN COATED COPPER, A...

Circuit Structure

WIRING SUBSTRATE

LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND INSULATING FILM USED THEREIN

ELECTROCONDUCTIVE PARTICLES AND SIGNAL-TRANSMITTING CONNECTOR HAVIN...

Circuit Structure

TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS

EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTE...