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  • CPC
  • H05K2201/0263
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0263Details about a collection of particles
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD
    • Publication number 20250220813
    • Publication date Jul 3, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240306312
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
    • Publication number 20240155760
    • Publication date May 9, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuji YUKIIRI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, RESIN COATED COPPER, A...
    • Publication number 20240059863
    • Publication date Feb 22, 2024
    • LG Innotek Co., Ltd.
    • Yong Suk KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Structure
    • Publication number 20230354515
    • Publication date Nov 2, 2023
    • Ticona LLC
    • Young Shin Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230180385
    • Publication date Jun 8, 2023
    • IBIDEN CO., LTD.
    • Shogo FUKUI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD
    • Publication number 20230018333
    • Publication date Jan 19, 2023
    • NHK Spring Co., Ltd.
    • Takeshi Kawakami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND INSULATING FILM USED THEREIN
    • Publication number 20220183155
    • Publication date Jun 9, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Dong Joo SHIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTROCONDUCTIVE PARTICLES AND SIGNAL-TRANSMITTING CONNECTOR HAVIN...
    • Publication number 20220005626
    • Publication date Jan 6, 2022
    • TSE CO., LTD.
    • Chang Su Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit Structure
    • Publication number 20210274652
    • Publication date Sep 2, 2021
    • Ticona LLC
    • Young Shin Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS
    • Publication number 20160100480
    • Publication date Apr 7, 2016
    • IMEC vzw
    • Bjorn Van Keymeulen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTE...
    • Publication number 20130096233
    • Publication date Apr 18, 2013
    • PANASONIC CORPORATION
    • Tomoaki Iwami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR