Details about the mounting of the diaphragm to its support or about the diaphragm edges

Industry

CPC
G01L9/0048

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE G01L9/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material by electric or magnetic means

Current Industry

G01L9/0048Details about the mounting of the diaphragm to its support or about the diaphragm edges

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pressure sensors with tensioned membranes
- Patent number 11,953,399
- Issue date Apr 9, 2024
- The Alfred E. Mann Foundation for Scientific Research
- Siegmar Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Pressure and flow rate measuring cell
- Patent number 11,898,889
- Issue date Feb 13, 2024
- Siemens Aktiengesellschaft
- Gilbert Alexander Erdler
- G01 - MEASURING TESTING
Information Patent Grant
MEMS sensor and method for manufacturing a MEMS sensor including im...
- Patent number 11,828,669
- Issue date Nov 28, 2023
- Robert Bosch GmbH
- Cristian Nagel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive pressure difference sensor with improved bonding and man...
- Patent number 11,788,914
- Issue date Oct 17, 2023
- LANGFANG ZHICHI POWER TECHNOLOGY LTD.
- Tiantong Xu
- G01 - MEASURING TESTING
Information Patent Grant
Micromechanical pressure sensor device including a diaphragm system...
- Patent number 11,788,912
- Issue date Oct 17, 2023
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Differential pressure sensor
- Patent number 11,692,895
- Issue date Jul 4, 2023
- Rosemount Aerospace Inc.
- David P. Potasek
- G01 - MEASURING TESTING
Information Patent Grant
Optical scanning apparatus and lidar with extinction component
- Patent number 11,662,438
- Issue date May 30, 2023
- Ji Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor assembly
- Patent number 11,656,138
- Issue date May 23, 2023
- Rosemount Inc.
- Nicholas Edward Meyer
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensors with tensioned membranes
- Patent number 11,630,013
- Issue date Apr 18, 2023
- The Alfred E. Mann Foundation for Scientific Research
- Siegmar Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Channel structures for optimizing the membrane function of oil-fill...
- Patent number 11,543,317
- Issue date Jan 3, 2023
- Vega Grieshaber KG
- Jochen Huber
- G01 - MEASURING TESTING
Information Patent Grant
Membrane with hierarchically arranged micrometer-sized and sub micr...
- Patent number 11,473,990
- Issue date Oct 18, 2022
- TDK ELECTRONICS AG
- Markus Eberstein
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatuses for providing freeze resistant sensing asse...
- Patent number 11,428,593
- Issue date Aug 30, 2022
- Honeywell International Inc.
- Lokesha Bhat
- G01 - MEASURING TESTING
Information Patent Grant
Membrane-based sensor having a plurality of spacers extending from...
- Patent number 11,402,288
- Issue date Aug 2, 2022
- Robert Bosch GmbH
- Ando Lars Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with improved detection sensitivity
- Patent number 11,359,984
- Issue date Jun 14, 2022
- INNER SENSOR CO., LTD.
- Moon Sik Kang
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor module
- Patent number 11,293,821
- Issue date Apr 5, 2022
- Sciosense B.V.
- Roel Daamen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor element with fastening segment
- Patent number 11,262,261
- Issue date Mar 1, 2022
- Carl Freudenberg KG
- Tanja Claus
- G01 - MEASURING TESTING
Information Patent Grant
Absolute and differential pressure sensors and related methods
- Patent number 11,254,565
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor manufacturing method and structure thereof
- Patent number 11,254,564
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure gauge chip and manufacturing process thereof
- Patent number 11,255,740
- Issue date Feb 22, 2022
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Kevin Chau
- E21 - EARTH DRILLING MINING
Information Patent Grant
Deformable pressure sensor and methods of use thereof
- Patent number 11,204,292
- Issue date Dec 21, 2021
- King Abdulaziz University
- Abdullah Mohamed Asiri
- G01 - MEASURING TESTING
Information Patent Grant
Sealing glass geometries for sensitivity enhancement of thick-film...
- Patent number 11,187,605
- Issue date Nov 30, 2021
- Vitesco Technologies USA, LLC.
- Zhijun Guo
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor chip
- Patent number 11,181,431
- Issue date Nov 23, 2021
- AZBIL CORPORATION
- Tomohisa Tokuda
- G01 - MEASURING TESTING
Information Patent Grant
Optical scanning apparatus and lidar
- Patent number 11,085,997
- Issue date Aug 10, 2021
- SUTENG INNOVATION TECHNOLOGY CO., LTD.
- Ji Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer sealing film for high seal yield
- Patent number 11,034,578
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor including protective film to avoid adhesion of fore...
- Patent number 10,921,205
- Issue date Feb 16, 2021
- Denso Corporation
- Takeru Kanazawa
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,906,800
- Issue date Feb 2, 2021
- Mitsubishi Electric Cornoration
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High temperature protected wire bonded sensors
- Patent number 10,871,415
- Issue date Dec 22, 2020
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Grant
High temperature capacitive MEMS pressure sensor
- Patent number 10,823,631
- Issue date Nov 3, 2020
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor module and method of making the same
- Patent number 10,794,784
- Issue date Oct 6, 2020
- Rohm Co., Ltd.
- Yuto Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical quantity measurement device, method for manufacturing same...
- Patent number 10,788,385
- Issue date Sep 29, 2020
- Hitachi Automotive Systems, Ltd.
- Takuya Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20230304881
- Publication date Sep 28, 2023
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE PRESSURE DIFFERENCE SENSOR, AND MANUFACTURING METHOD AND...
- Publication number 20230258521
- Publication date Aug 17, 2023
- Langfang Zhichi Power Technology Ltd.
- Tiantong Xu
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSORS WITH TENSIONED MEMBRANES
- Publication number 20230243711
- Publication date Aug 3, 2023
- THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH
- Siegmar Schmidt
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SENSOR SET-UP FOR DETERMINING AT LEAST ON...
- Publication number 20220018726
- Publication date Jan 20, 2022
- ROBERT BOSCH GmbH
- Clemens Goldhahn
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Channel structures for optimizing the membrane function of oil-fill...
- Publication number 20220011187
- Publication date Jan 13, 2022
- Vega Grieshaber KG
- Jochen Huber
- G01 - MEASURING TESTING
Information Patent Application
MICROMECHANICAL COMPONENT FOR A CAPACITIVE PRESSURE SENSOR DEVICE
- Publication number 20220003621
- Publication date Jan 6, 2022
- ROBERT BOSCH GmbH
- Thomas Friedrich
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD FOR MANUFACTURING A MEMS SENSOR
- Publication number 20210396616
- Publication date Dec 23, 2021
- ROBERT BOSCH GmbH
- Cristian Nagel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure or Flow Rate Measuring Cell
- Publication number 20210348956
- Publication date Nov 11, 2021
- Siemens Aktiengesellschaft
- Gilbert Alexander ERDLER
- G01 - MEASURING TESTING
Information Patent Application
Membrane, Pressure Sensor System and Method for Producing the Press...
- Publication number 20210318192
- Publication date Oct 14, 2021
- TDK Electronics AG
- Markus Eberstein
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSOR USING FIELD EFFECT AND MANUFACTURING METHOD THEREOF
- Publication number 20210239557
- Publication date Aug 5, 2021
- Moon Sik KANG
- G01 - MEASURING TESTING
Information Patent Application
MICROMECHANICAL PRESSURE SENSOR DEVICE AND CORRESPONDING MANUFACTUR...
- Publication number 20210215559
- Publication date Jul 15, 2021
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUSES FOR PROVIDING FREEZE RESISTANT SENSING ASSE...
- Publication number 20210148775
- Publication date May 20, 2021
- HONEYWELL INTERNATIONAL INC.
- Lokesha Bhat
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensor Module
- Publication number 20210055177
- Publication date Feb 25, 2021
- ams AG
- Roel DAAMEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS
- Publication number 20210041318
- Publication date Feb 11, 2021
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSING WITH CAPACITIVE PRESSURE SENSOR
- Publication number 20200397321
- Publication date Dec 24, 2020
- Koninklijke Philips N.V.
- Peter DIRKSEN
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSORS WITH TENSIONED MEMBRANES
- Publication number 20200355567
- Publication date Nov 12, 2020
- THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH
- Siegmar Schmidt
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20200270121
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20200231431
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR ELEMENT WITH FASTENING SEGMENT
- Publication number 20200182722
- Publication date Jun 11, 2020
- Carl Freudenberg KG
- Tanja Claus
- G01 - MEASURING TESTING
Information Patent Application
ABSOLUTE AND DIFFERENTIAL PRESSURE SENSORS AND RELATED METHODS
- Publication number 20200123002
- Publication date Apr 23, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZORESISTIVE SENSOR WITH SPRING FLEXURES FOR STRESS ISOLATION
- Publication number 20200041371
- Publication date Feb 6, 2020
- Rosemount Aerospace Inc.
- Timothy Thomas Golly
- G01 - MEASURING TESTING
Information Patent Application
HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS
- Publication number 20200011757
- Publication date Jan 9, 2020
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Application
HIGH TEMPERATURE CAPACITIVE MEMS PRESSURE SENSOR
- Publication number 20190323912
- Publication date Oct 24, 2019
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical Quantity Measurement Device, Method for Manufacturing Same...
- Publication number 20190128758
- Publication date May 2, 2019
- Hitachi Automotive Systems, Ltd.
- Takuya AOYAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR
- Publication number 20190120709
- Publication date Apr 25, 2019
- DENSO CORPORATION
- Takeru KANAZAWA
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE GAUGE CHIP AND MANUFACTURING PROCESS THEREOF
- Publication number 20190113411
- Publication date Apr 18, 2019
- Chinese Academy of Sciences Institute of Geology and Geophysics
- Man WONG
- G01 - MEASURING TESTING
Information Patent Application
MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD
- Publication number 20190092622
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Chien Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS
- Publication number 20190041288
- Publication date Feb 7, 2019
- Kulite Semiconductor Products, Inc.
- Alexander A. Ned
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20180346319
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR ASSEMBLY
- Publication number 20180306660
- Publication date Oct 25, 2018
- HONEYWELL INTERNATIONAL INC.
- Richard Wade
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Details about the mounting of the diaphragm to its support or about the diaphragm edges

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sensors with tensioned membranes

Pressure and flow rate measuring cell

MEMS sensor and method for manufacturing a MEMS sensor including im...

Capacitive pressure difference sensor with improved bonding and man...

Micromechanical pressure sensor device including a diaphragm system...

Differential pressure sensor

Optical scanning apparatus and lidar with extinction component

Pressure sensor assembly

Pressure sensors with tensioned membranes

Channel structures for optimizing the membrane function of oil-fill...

Membrane with hierarchically arranged micrometer-sized and sub micr...

Methods and apparatuses for providing freeze resistant sensing asse...

Membrane-based sensor having a plurality of spacers extending from...

Pressure sensor with improved detection sensitivity

Pressure sensor module

Sensor element with fastening segment

Absolute and differential pressure sensors and related methods

Semiconductor manufacturing method and structure thereof

Pressure gauge chip and manufacturing process thereof

Deformable pressure sensor and methods of use thereof

Sealing glass geometries for sensitivity enhancement of thick-film...

Pressure sensor chip

Optical scanning apparatus and lidar

Multi-layer sealing film for high seal yield

Pressure sensor including protective film to avoid adhesion of fore...

Semiconductor pressure sensor

High temperature protected wire bonded sensors

High temperature capacitive MEMS pressure sensor

Sensor module and method of making the same

Physical quantity measurement device, method for manufacturing same...

Patents Applicationslast 30 patents

MICROMECHANICAL COMPONENT

CAPACITIVE PRESSURE DIFFERENCE SENSOR, AND MANUFACTURING METHOD AND...

PRESSURE SENSORS WITH TENSIONED MEMBRANES

METHOD OF MANUFACTURING A SENSOR SET-UP FOR DETERMINING AT LEAST ON...

Channel structures for optimizing the membrane function of oil-fill...

MICROMECHANICAL COMPONENT FOR A CAPACITIVE PRESSURE SENSOR DEVICE

MEMS SENSOR AND METHOD FOR MANUFACTURING A MEMS SENSOR

Pressure or Flow Rate Measuring Cell

Membrane, Pressure Sensor System and Method for Producing the Press...

PRESSURE SENSOR USING FIELD EFFECT AND MANUFACTURING METHOD THEREOF

MICROMECHANICAL PRESSURE SENSOR DEVICE AND CORRESPONDING MANUFACTUR...

METHODS AND APPARATUSES FOR PROVIDING FREEZE RESISTANT SENSING ASSE...

Pressure Sensor Module

HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS

PRESSURE SENSING WITH CAPACITIVE PRESSURE SENSOR

PRESSURE SENSORS WITH TENSIONED MEMBRANES

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF

SENSOR ELEMENT WITH FASTENING SEGMENT

ABSOLUTE AND DIFFERENTIAL PRESSURE SENSORS AND RELATED METHODS

PIEZORESISTIVE SENSOR WITH SPRING FLEXURES FOR STRESS ISOLATION

HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS

HIGH TEMPERATURE CAPACITIVE MEMS PRESSURE SENSOR

Physical Quantity Measurement Device, Method for Manufacturing Same...

PRESSURE SENSOR

PRESSURE GAUGE CHIP AND MANUFACTURING PROCESS THEREOF

MULTI-LAYER SEALING FILM FOR HIGH SEAL YIELD

HIGH TEMPERATURE PROTECTED WIRE BONDED SENSORS

SEMICONDUCTOR MANUFACTURING METHOD

PRESSURE SENSOR ASSEMBLY