Details of electrical connections of non-printed components

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CPC
H05K2201/10613

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10613Details of electrical connections of non-printed components

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Patents Grantslast 30 patents

Information Patent Grant
Isolation of compartments in a layered printed circuit board, and a...
- Patent number 11,972,190
- Issue date Apr 30, 2024
- Management Services Group, Inc.
- Thomas Scott Morgan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Isolation of compartments in a layered printed circuit board, and a...
- Patent number 11,580,287
- Issue date Feb 14, 2023
- Management Service Group, Inc.
- Thomas Scott Morgan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Terminal and electronic device having the same
- Patent number 11,431,116
- Issue date Aug 30, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Chen Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB cavity mode suppression
- Patent number 11,317,502
- Issue date Apr 26, 2022
- Raytheon Company
- Thomas V. Sikina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation of compartments in a layered printed circuit board, and a...
- Patent number 11,210,446
- Issue date Dec 28, 2021
- Management Services Group, Inc.
- Thomas Scott Morgan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module
- Patent number 11,153,973
- Issue date Oct 19, 2021
- Cyntec Co., Ltd.
- Kaipeng Chiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package-on-package structure with through molding via
- Patent number 10,008,480
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with through molding via
- Patent number 9,780,076
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having interconnection members
- Patent number 9,668,344
- Issue date May 30, 2017
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric part soldered onto printed circuit board
- Patent number 9,668,347
- Issue date May 30, 2017
- Dai-Ichi Seiko Co., Ltd.
- Takayoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with through molding via
- Patent number 9,502,387
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with through molding via
- Patent number 9,237,647
- Issue date Jan 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric wiring seat and assembly thereof
- Patent number 9,060,422
- Issue date Jun 16, 2015
- Yu-Syuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PCB CAVITY MODE SUPPRESSION
- Publication number 20210360772
- Publication date Nov 18, 2021
- Raytheon Company
- Thomas V. Sikina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20210249800
- Publication date Aug 12, 2021
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Chen ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20210105898
- Publication date Apr 8, 2021
- CYNTEC CO., LTD.
- KAIPENG CHIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Package-on-Package Structure with Through Molding Via
- Publication number 20180026014
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20150382451
- Publication date Dec 31, 2015
- Nitto Denko Corporation
- Hiroyuki TANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plastic Electronic Device Structures With Embedded Components
- Publication number 20150313003
- Publication date Oct 29, 2015
- Apple Inc.
- Darshan R. Kasar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC WIRING SEAT AND ASSEMBLY THEREOF
- Publication number 20150129294
- Publication date May 14, 2015
- YU-SYUAN CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC PART SOLDERED ONTO PRINTED CIRCUIT BOARD
- Publication number 20150083478
- Publication date Mar 26, 2015
- DAI-ICHI SEIKO CO., LTD.
- Takayoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE BACKPLANE SYSTEM HAVING MOUNTING BLOCKS
- Publication number 20150075856
- Publication date Mar 19, 2015
- Tyco Electronics Corporation
- Christopher David Ritter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-on-Package Structure with Through Molding Via
- Publication number 20150070865
- Publication date Mar 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS

Details of electrical connections of non-printed components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Isolation of compartments in a layered printed circuit board, and a...

Isolation of compartments in a layered printed circuit board, and a...

Terminal and electronic device having the same

PCB cavity mode suppression

Isolation of compartments in a layered printed circuit board, and a...

Electronic module

Package-on-package structure with through molding via

Package-on-package structure with through molding via

Semiconductor packages having interconnection members

Electric part soldered onto printed circuit board

Package-on-package structure with through molding via

Package-on-package structure with through molding via

Electric wiring seat and assembly thereof

Patents Applicationslast 30 patents

PCB CAVITY MODE SUPPRESSION

TERMINAL AND ELECTRONIC DEVICE HAVING THE SAME

Electronic Module

Package-on-Package Structure with Through Molding Via

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...

Plastic Electronic Device Structures With Embedded Components

ELECTRIC WIRING SEAT AND ASSEMBLY THEREOF

ELECTRIC PART SOLDERED ONTO PRINTED CIRCUIT BOARD

CABLE BACKPLANE SYSTEM HAVING MOUNTING BLOCKS

Package-on-Package Structure with Through Molding Via