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CPC
H05K2201/10431

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10431Details of mounted components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including PCB including shielding structure, and PCB
- Patent number 12,150,288
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hansu Cheon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Attaching apparatus and attaching method
- Patent number 11,934,222
- Issue date Mar 19, 2024
- BOE Technology Group Co., Ltd.
- Yonghong Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical module
- Patent number 11,914,202
- Issue date Feb 27, 2024
- Fujitsu Optical Components Limited
- Takuya Nakao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibration isolator and method of assembly using flex circuits
- Patent number 11,572,929
- Issue date Feb 7, 2023
- Raytheon Company
- Daniel R. Farmer
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Power conversion device
- Patent number 11,398,766
- Issue date Jul 26, 2022
- Denso Corporation
- Tatsuya Abe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power conversion device including cooling components
- Patent number 11,343,942
- Issue date May 24, 2022
- Mitsubishi Electric Corporation
- Yu Kishiwada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer in the printed circuit board of an SMPS by an integra...
- Patent number 11,224,117
- Issue date Jan 11, 2022
- Flex Ltd.
- Magnus Karlsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector and connector assembly thereof
- Patent number 11,152,724
- Issue date Oct 19, 2021
- Dongguan Luxshare Technologies Co., Ltd.
- Yung-Chih Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical terminal and electrical connector thereof
- Patent number 11,128,070
- Issue date Sep 21, 2021
- Dongguan Luxshare Technologies Co., Ltd.
- Yung-Chih Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device and the same
- Patent number 10,984,950
- Issue date Apr 20, 2021
- TDK Corporation
- Norihisa Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile terminal, power interface, and method for manufacturing powe...
- Patent number 10,855,008
- Issue date Dec 1, 2020
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Guodong Gu
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Grant
Mobile terminal, power adapter and power interface
- Patent number 10,811,793
- Issue date Oct 20, 2020
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD
- Guodong Gu
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Grant
Method of manufacturing electronic device and the same
- Patent number 10,777,353
- Issue date Sep 15, 2020
- TDK Corporation
- Norihisa Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection pad for embedded components in PCB packaging
- Patent number 10,455,707
- Issue date Oct 22, 2019
- Apple Inc.
- Kenneth Leland Kiplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact terminal
- Patent number 10,439,306
- Issue date Oct 8, 2019
- Molex, LLC
- Jang Bum Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed module
- Patent number 10,251,277
- Issue date Apr 2, 2019
- Murata Manufacturing Co., Ltd.
- Shota Ishihara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Component support for dense circuit board
- Patent number 9,585,255
- Issue date Feb 28, 2017
- Raytheon Company
- Dennis W. Mercier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded resin substrate
- Patent number 9,241,409
- Issue date Jan 19, 2016
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRAP FOR A WEARABLE DEVICE
- Publication number 20240215171
- Publication date Jun 27, 2024
- Armour Surveillance Security Equipment and Technology Ltd
- Patrick James FAWCETT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTAMINANT SHIELD FOR AN OSCILLATOR
- Publication number 20240080986
- Publication date Mar 7, 2024
- Apple Inc.
- David A. Karol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Device Power Module Arrangement
- Publication number 20230369256
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PATTERNED MODULE EXTERIOR SURFACE FOR IMPROVED HE...
- Publication number 20230180393
- Publication date Jun 8, 2023
- Qorvo US, Inc.
- Loizos Loizou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATTACHING APPARATUS AND ATTACHING METHOD
- Publication number 20220404865
- Publication date Dec 22, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Yonghong ZHOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING PCB INCLUDING SHIELDING STRUCTURE, AND PCB
- Publication number 20220279685
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Hansu CHEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE
- Publication number 20210333492
- Publication date Oct 28, 2021
- FUJITSU OPTICAL COMPONENTS LIMITED
- Takuya NAKAO
- G02 - OPTICS
Information Patent Application
VIBRATION ISOLATOR AND METHOD OF ASSEMBLY USING FLEX CIRCUITS
- Publication number 20210324936
- Publication date Oct 21, 2021
- Raytheon Company
- Daniel R. Farmer
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20210100129
- Publication date Apr 1, 2021
- Mitsubishi Electric Corporation
- Yu KISHIWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20200366168
- Publication date Nov 19, 2020
- DENSO CORPORATION
- Tatsuya Abe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRICAL TERMINAL AND ELECTRICAL CONNECTOR THEREOF
- Publication number 20200274268
- Publication date Aug 27, 2020
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Yung-Chih Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS HAVING NOISE SUPPRESSION MECHANISM
- Publication number 20200267875
- Publication date Aug 20, 2020
- REALTEK SEMICONDUCTOR CORPORATION
- Hao-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY THEREOF
- Publication number 20200259280
- Publication date Aug 13, 2020
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Yung-Chih Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE TERMINAL, POWER INTERFACE, AND METHOD FOR MANUFACTURING POWE...
- Publication number 20190148854
- Publication date May 16, 2019
- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
- Guodong GU
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND THE SAME
- Publication number 20190080841
- Publication date Mar 14, 2019
- TDK Corporation
- Norihisa ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT TERMINAL
- Publication number 20190020129
- Publication date Jan 17, 2019
- Molex, LLC
- Jang Bum Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Appliance User Interface Panel Having Integrated Components
- Publication number 20170228060
- Publication date Aug 10, 2017
- GENERAL ELECTRIC COMPANY
- Phillip John Duckworth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20170215280
- Publication date Jul 27, 2017
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN-SEALED MODULE
- Publication number 20170048982
- Publication date Feb 16, 2017
- MURATA MANUFACTURING CO., LTD.
- Shota ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD
- Publication number 20160270230
- Publication date Sep 15, 2016
- Dennis W. Mercier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE A...
- Publication number 20150049445
- Publication date Feb 19, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED RESIN SUBSTRATE
- Publication number 20140226288
- Publication date Aug 14, 2014
- MURATA MANUFACTURING CO., LTD.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-...
- Publication number 20140216801
- Publication date Aug 7, 2014
- Meiko Electronics Co., Ltd.
- Tohru Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details of mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device including PCB including shielding structure, and PCB

Attaching apparatus and attaching method

Optical module

Vibration isolator and method of assembly using flex circuits

Power conversion device

Power conversion device including cooling components

Heat transfer in the printed circuit board of an SMPS by an integra...

Electrical connector and connector assembly thereof

Electrical terminal and electrical connector thereof

Method of manufacturing electronic device and the same

Mobile terminal, power interface, and method for manufacturing powe...

Mobile terminal, power adapter and power interface

Method of manufacturing electronic device and the same

Connection pad for embedded components in PCB packaging

Electrical contact terminal

Resin-sealed module

Component support for dense circuit board

Component-embedded resin substrate

Patents Applicationslast 30 patents

STRAP FOR A WEARABLE DEVICE

CONTAMINANT SHIELD FOR AN OSCILLATOR

Multi-Device Power Module Arrangement

THREE-DIMENSIONAL PATTERNED MODULE EXTERIOR SURFACE FOR IMPROVED HE...

ATTACHING APPARATUS AND ATTACHING METHOD

ELECTRONIC DEVICE INCLUDING PCB INCLUDING SHIELDING STRUCTURE, AND PCB

OPTICAL MODULE

VIBRATION ISOLATOR AND METHOD OF ASSEMBLY USING FLEX CIRCUITS

POWER CONVERSION DEVICE

POWER CONVERSION DEVICE

ELECTRICAL TERMINAL AND ELECTRICAL CONNECTOR THEREOF

ELECTRONIC APPARATUS HAVING NOISE SUPPRESSION MECHANISM

ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY THEREOF

MOBILE TERMINAL, POWER INTERFACE, AND METHOD FOR MANUFACTURING POWE...

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND THE SAME

ELECTRICAL CONTACT TERMINAL

Appliance User Interface Panel Having Integrated Components

SELECTIVE TRANSFER OF MICRO DEVICES

RESIN-SEALED MODULE

COMPONENT SUPPORT FOR DENSE CIRCUIT BOARD

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT EMBEDDING SUBSTRATE A...

COMPONENT-EMBEDDED RESIN SUBSTRATE

METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-...