Details of rigid insulating substrates therefor

Industry

CPC
H05K1/119

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/119Details of rigid insulating substrates therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly for a communication system
- Patent number 12,119,577
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Randall Robert Henry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure between printed circuit board and terminal blo...
- Patent number 11,955,739
- Issue date Apr 9, 2024
- Daikin Industries, Ltd.
- Kazunari Fukagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-directional power converter module
- Patent number 11,935,681
- Issue date Mar 19, 2024
- NAVITAS SEMICONDUCTOR LIMITED
- Hao Sun
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit apparatus
- Patent number 11,894,626
- Issue date Feb 6, 2024
- Autonetworks Technologies, Ltd.
- Takamune Kikuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder composition for use in solder joints of printed circuit boards
- Patent number 11,832,386
- Issue date Nov 28, 2023
- Dell Products L.P.
- Deeder M. Aurongzeb
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module
- Patent number 11,825,603
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Tomomi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive member for touch panel and touch panel
- Patent number 11,758,660
- Issue date Sep 12, 2023
- FUJIFILM Corporation
- Masaya Nakayama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Addressable switch assembly for wellbore systems and method
- Patent number 11,725,488
- Issue date Aug 15, 2023
- GEODYNAMICS. INC.
- Phillip Phelps
- F42 - AMMUNITION BLASTING
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,729,912
- Issue date Aug 15, 2023
- Ibiden Co., Ltd.
- Kosuke Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitively coupled resonators for high frequency galvanic isolators
- Patent number 11,711,894
- Issue date Jul 25, 2023
- Analog Devices International Unlimited Company
- Jinglin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure embedded substrate
- Patent number 11,659,665
- Issue date May 23, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Hyung Ham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly
- Patent number 11,616,019
- Issue date Mar 28, 2023
- NVIDIA Corp.
- Jacky Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply device and conductive spring contact thereof
- Patent number 11,588,260
- Issue date Feb 21, 2023
- Delta Electronics, Inc.
- Tsun-Sung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boards having solderless interconnects
- Patent number 11,582,870
- Issue date Feb 14, 2023
- The Regents of the University of California
- Stijn Wielandt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film for interlayer insulating layer with support, multilayer...
- Patent number 11,553,593
- Issue date Jan 10, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takayuki Suzukawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method therefor
- Patent number 11,464,117
- Issue date Oct 4, 2022
- LG Innotek Co., Ltd
- Hee Young Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patch substrate configured as a shield located over a cavity of a b...
- Patent number 11,452,246
- Issue date Sep 20, 2022
- QUALCOMM Incorporated
- Charles David Paynter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flipped-conductor-patch lamination for ultra fine-line substrate cr...
- Patent number 11,432,402
- Issue date Aug 30, 2022
- Microchip Technology Caldicot Limited
- John Adam Tracy deMercleden Smithells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a connector connection and electrical connector...
- Patent number 11,417,977
- Issue date Aug 16, 2022
- IMS Connector Systems GmbH
- Kevin Kreklow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and electronic device
- Patent number 11,406,013
- Issue date Aug 2, 2022
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB interconnect scheme for co-planar LED strips
- Patent number 11,396,985
- Issue date Jul 26, 2022
- Illumina, Inc.
- Brian Elliot Sinofsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having a three dimensionally printed wiring struc...
- Patent number 11,388,824
- Issue date Jul 12, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Aerosol generator and atomizing module
- Patent number 11,375,613
- Issue date Jun 28, 2022
- MicroBase Technology Corp.
- Chien-Hua Lin
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wire embedding system with a curved delivery path
- Patent number 11,317,515
- Issue date Apr 26, 2022
- Board of Regents, The University of Texas System
- David Espalin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Connector assembly coupled to a side of circuit board
- Patent number 11,316,309
- Issue date Apr 26, 2022
- SENSORVIEW CO., LTD.
- Byoung Nam Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240258121
- Publication date Aug 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240222250
- Publication date Jul 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Jun-Hao FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-DIRECTIONAL POWER CONVERTER MODULE
- Publication number 20240203635
- Publication date Jun 20, 2024
- Navitas Semiconductor Limited
- Hao SUN
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...
- Publication number 20240164024
- Publication date May 16, 2024
- Nitto Denko Corporation
- Ikuya HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...
- Publication number 20240074047
- Publication date Feb 29, 2024
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20230389172
- Publication date Nov 30, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD
- Publication number 20230340862
- Publication date Oct 26, 2023
- GeoDynamics, Inc.
- Phillip PHELPS
- F42 - AMMUNITION BLASTING
Information Patent Application
ANTENNA STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230328887
- Publication date Oct 12, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Na Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR-WIRE-EMBEDDED WIRING BOARD
- Publication number 20230319998
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- SOOJAE PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY FOR A COMMUNICATION SYSTEM
- Publication number 20230318210
- Publication date Oct 5, 2023
- TE Connectivity Solutions GMBH
- Randall Robert Henry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD AND PROBE CARD
- Publication number 20230266363
- Publication date Aug 24, 2023
- KYOCERA CORPORATION
- Hitoshi TEGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITIVELY COUPLED RESONATORS FOR HIGH FREQUENCY GALVANIC ISOLATORS
- Publication number 20230247767
- Publication date Aug 3, 2023
- Analog Devices International Unlimited Company
- Jinglin Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE
- Publication number 20230209713
- Publication date Jun 29, 2023
- KINPO ELECTRONICS, INC.
- Chuan-Wang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230199961
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- Yu-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230164919
- Publication date May 25, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- SHI-JIE ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141270
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED VOLTAGE REGULATOR
- Publication number 20230093166
- Publication date Mar 23, 2023
- Navitas Semiconductor Limited
- Hao SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...
- Publication number 20230061125
- Publication date Mar 2, 2023
- HARTING AG
- Thomas HESS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Different Stack Heights and Vertical Opening...
- Publication number 20230043085
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect and Method for Manufacturing the Same
- Publication number 20220287179
- Publication date Sep 8, 2022
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT APPARATUS
- Publication number 20220255249
- Publication date Aug 11, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Takamune KIKUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232694
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE EMBEDDED SUBSTRATE
- Publication number 20220210921
- Publication date Jun 30, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Ho Hyung HAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly
- Publication number 20220199528
- Publication date Jun 23, 2022
- NVIDIA Corp.
- Jacky Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARDS HAVING SOLDERLESS INTERCONNECTS
- Publication number 20220192024
- Publication date Jun 16, 2022
- The Regents of the University of California
- Stijn Wielandt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MEMBER FOR TOUCH PANEL AND TOUCH PANEL
- Publication number 20220171503
- Publication date Jun 2, 2022
- FUJIFILM CORPORATION
- Masaya NAKAYAMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD
- Publication number 20220162926
- Publication date May 26, 2022
- GeoDynamics, Inc.
- Phillip PHELPS
- F42 - AMMUNITION BLASTING
Information Patent Application
MEDICAL DEVICE WITH NOVEL ELECTRICAL INTERCONNECTS, AND RELATED MET...
- Publication number 20220117539
- Publication date Apr 21, 2022
- Boston Scientific SciMed Inc.
- Robert K. Fagerlund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details of rigid insulating substrates therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic assembly for a communication system

Manufacturing method of circuit board

Connection structure between printed circuit board and terminal blo...

Bi-directional power converter module

Printed circuit board

Circuit apparatus

Solder composition for use in solder joints of printed circuit boards

High-frequency module

Circuit board and manufacturing method thereof and electronic device

Component carrier for arranging electrical components on a circuit...

Conductive member for touch panel and touch panel

Addressable switch assembly for wellbore systems and method

Wiring substrate and method for manufacturing wiring substrate

Capacitively coupled resonators for high frequency galvanic isolators

Adapter board and method for making adapter board

Connection structure embedded substrate

Semiconductor assembly

Power supply device and conductive spring contact thereof

Boards having solderless interconnects

Resin film for interlayer insulating layer with support, multilayer...

Printed circuit board and manufacturing method therefor

Patch substrate configured as a shield located over a cavity of a b...

Flipped-conductor-patch lamination for ultra fine-line substrate cr...

Circuit board with a connector connection and electrical connector...

Resin multilayer substrate and electronic device

PCB interconnect scheme for co-planar LED strips

Component carrier having a three dimensionally printed wiring struc...

Aerosol generator and atomizing module

Wire embedding system with a curved delivery path

Connector assembly coupled to a side of circuit board

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

BI-DIRECTIONAL POWER CONVERTER MODULE

METHOD FOR PRODUCING WIRING CIRCUIT BOARD, WIRING CIRCUIT BOARD WIT...

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...

MANUFACTURING METHOD OF CIRCUIT BOARD

ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD

ANTENNA STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME

CAPACITOR-WIRE-EMBEDDED WIRING BOARD

ELECTRONIC ASSEMBLY FOR A COMMUNICATION SYSTEM

CIRCUIT BOARD AND PROBE CARD

CAPACITIVELY COUPLED RESONATORS FOR HIGH FREQUENCY GALVANIC ISOLATORS

PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE

ELECTRONIC APPARATUS

CIRCUIT BOARD ASSEMLY AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

INTEGRATED VOLTAGE REGULATOR

COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...

Component Carrier With Different Stack Heights and Vertical Opening...

Interconnect and Method for Manufacturing the Same

CIRCUIT APPARATUS

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

CONNECTION STRUCTURE EMBEDDED SUBSTRATE

Semiconductor Assembly

BOARDS HAVING SOLDERLESS INTERCONNECTS

CONDUCTIVE MEMBER FOR TOUCH PANEL AND TOUCH PANEL

ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD

MEDICAL DEVICE WITH NOVEL ELECTRICAL INTERCONNECTS, AND RELATED MET...

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD