Details of via holes for interconnecting the layers

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Patents Grantslast 30 patents

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    Multilayer coil component

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    • TDK Corporation
    • Kazuya Tobita
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    • Yuya Oshima
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    • MODA-INNOCHIPS CO., LTD.
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    • Murata Manufacturing Co., Ltd.
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    • Patent number 11,777,354
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    • Patent number 11,756,723
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    • Patent number 11,756,720
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    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
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    SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL)

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    • UNIVERSITY COLLEGE CORK, NATIONAL UNIVERSITY OF IRELAND, CORK
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