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CPC
H01G4/002

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/002Details

Industries

Patents Grantslast 30 patents

Information Patent Grant
Miniaturization process of passive component
- Patent number 12,014,875
- Issue date Jun 18, 2024
- Trusval Technology Co., Ltd.
- Shih-Pao Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer chip component
- Patent number 11,983,583
- Issue date May 14, 2024
- TDK Corporation
- Gaku Echigoya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Devices and methods for improving voltage handling and/or bi-direct...
- Patent number 11,671,091
- Issue date Jun 6, 2023
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer chip component
- Patent number 11,645,480
- Issue date May 9, 2023
- TDK Corporation
- Gaku Echigoya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatuses for use in tuning reactance in a circuit de...
- Patent number 11,606,087
- Issue date Mar 14, 2023
- pSemi Corporation
- Ronald Eugene Reedy
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Capacitor cluster having capacitors with different shapes
- Patent number 11,545,304
- Issue date Jan 3, 2023
- Murata Manufacturing Co., Ltd.
- Masatomi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor assembly structure and method of manufacturing the same
- Patent number 11,335,512
- Issue date May 17, 2022
- Apaq Technology Co., Ltd.
- Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in digitally tuning a capacitor in an...
- Patent number 11,258,440
- Issue date Feb 22, 2022
- pSemi Corporation
- Tero Tapio Ranta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,206,737
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,166,375
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for improving voltage handling and/or bi-direct...
- Patent number 11,082,040
- Issue date Aug 3, 2021
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,910,157
- Issue date Feb 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and electronic component device
- Patent number 10,847,314
- Issue date Nov 24, 2020
- TDK Corporation
- Takeru Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and electronic component device
- Patent number 10,804,032
- Issue date Oct 13, 2020
- TDK Corporation
- Takeru Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a leadless stack comprising multiple components
- Patent number 10,790,094
- Issue date Sep 29, 2020
- KEMET Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component
- Patent number 10,748,707
- Issue date Aug 18, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of production thereof
- Patent number 10,685,782
- Issue date Jun 16, 2020
- CAPACITOR SCIENCES INCORPORATED
- Pavel Ivan Lazarev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 10,672,558
- Issue date Jun 2, 2020
- Taiyo Yuden Co., Ltd.
- Koichiro Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for improving voltage handling and/or bi-direct...
- Patent number 10,630,284
- Issue date Apr 21, 2020
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and electronic component device
- Patent number 10,622,146
- Issue date Apr 14, 2020
- TDK Corporation
- Takeru Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic structure
- Patent number 10,622,157
- Issue date Apr 14, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic structure
- Patent number 10,593,483
- Issue date Mar 17, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,580,574
- Issue date Mar 3, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ho Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element with embedded information
- Patent number 10,542,619
- Issue date Jan 21, 2020
- Eastman Kodak Company
- Carolyn Rae Ellinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transducer driver
- Patent number 10,497,358
- Issue date Dec 3, 2019
- Ultrahaptics IP Ltd
- David Philip Tester
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Film capacitor
- Patent number 10,475,585
- Issue date Nov 12, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shinya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High quality factor time delay filters using multi-layer fringe cap...
- Patent number 10,447,228
- Issue date Oct 15, 2019
- KUMU Networks, Inc.
- Wilhelm Steffen Hahn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite electronic component and board having the same mounted th...
- Patent number 10,446,322
- Issue date Oct 15, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ho Yoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanocrystal film-coated substrate, manufacturing method of same, an...
- Patent number 10,438,744
- Issue date Oct 8, 2019
- National Institute of Advanced Industrial Science and Technology
- Ken-ichi Mimura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Multilayer ceramic structure
- Patent number 10,410,794
- Issue date Sep 10, 2019
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240222010
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Eun Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Improving Voltage Handling and/or Bi-Direct...
- Publication number 20240128968
- Publication date Apr 18, 2024
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatuses for Use in Tuning Reactance in a Circuit De...
- Publication number 20230283275
- Publication date Sep 7, 2023
- pSemi Corporation
- Ronald Eugene Reedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CHIP COMPONENT
- Publication number 20230237285
- Publication date Jul 27, 2023
- TDK Corporation
- Gaku ECHIGOYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MINIATURIZATION PROCESS OF PASSIVE COMPONENT
- Publication number 20230114576
- Publication date Apr 13, 2023
- TRUSVAL TECHNOLOGY CO., LTD.
- SHIH-PAO CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND MANUFACTURING METHOD AND OPERATING METHOD T...
- Publication number 20230008075
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIN-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR FORMED WITH COUPLED DIES
- Publication number 20220415572
- Publication date Dec 29, 2022
- Intel Corporation
- Changyok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN A GLASS SUBSTRATE
- Publication number 20220406523
- Publication date Dec 22, 2022
- Intel Corporation
- Telesphor KAMGAING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for use in Digitally Tuning a Capacitor in an...
- Publication number 20220255545
- Publication date Aug 11, 2022
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Improving Voltage Handling and/or Bi-Direct...
- Publication number 20220021384
- Publication date Jan 20, 2022
- pSemi Corporation
- Tero Tapio Ranta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-SENSORY DEVICE INTEGRATED IN A SINGLE STRUCTURE
- Publication number 20210310974
- Publication date Oct 7, 2021
- King Abdullah University of Science and Technology
- Muhammad Mustafa HUSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER CHIP COMPONENT
- Publication number 20210248327
- Publication date Aug 12, 2021
- TDK Corporation
- Gaku ECHIGOYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER CHIP COMPONENT
- Publication number 20210248435
- Publication date Aug 12, 2021
- TDK Corporation
- Gaku ECHIGOYA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAPACITOR ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210175023
- Publication date Jun 10, 2021
- APAQ TECHNOLOGY CO., LTD.
- CHIEH LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatuses for Use in Tuning Reactance in a Circuit De...
- Publication number 20210099169
- Publication date Apr 1, 2021
- pSemi Corporation
- Ronald Eugene Reedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR CLUSTER
- Publication number 20210027951
- Publication date Jan 28, 2021
- Murata Manufacturing Co., Ltd.
- Masatomi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20210006177
- Publication date Jan 7, 2021
- Honda Motor Co., Ltd.
- Takahiro Uneme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Improving Voltage Handling and/or Bi-Direct...
- Publication number 20200295750
- Publication date Sep 17, 2020
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20200253057
- Publication date Aug 6, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Man Su BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20200245463
- Publication date Jul 30, 2020
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200126720
- Publication date Apr 23, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20200092999
- Publication date Mar 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Man Su BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200090864
- Publication date Mar 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ho Yoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200082979
- Publication date Mar 12, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Ho Yoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for use in Digitally Tuning a Capacitor in an...
- Publication number 20200014382
- Publication date Jan 9, 2020
- pSemi Corporation
- Tero Tapio Ranta
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Multilayer Ceramic Structure
- Publication number 20190355523
- Publication date Nov 21, 2019
- Kemet Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD OF PRODUCTION THEREOF
- Publication number 20190341188
- Publication date Nov 7, 2019
- Capacitor Sciences Incorporated
- Pavel Ivan Lazarev
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Leadless Stack Comprising Multiple Components
- Publication number 20190318877
- Publication date Oct 17, 2019
- Kemet Electronics Corporation
- John E. McConnell
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MULTILAYER CAPACITOR AND ELECTRONIC COMPONENT DEVICE
- Publication number 20190189344
- Publication date Jun 20, 2019
- TDK Corporation
- Takeru YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT WITH EMBEDDED INFORMATION
- Publication number 20190182951
- Publication date Jun 13, 2019
- Carolyn Rae Ellinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Miniaturization process of passive component

Multilayer chip component

Devices and methods for improving voltage handling and/or bi-direct...

Method of manufacturing multilayer chip component

Methods and apparatuses for use in tuning reactance in a circuit de...

Capacitor cluster having capacitors with different shapes

Capacitor assembly structure and method of manufacturing the same

Method and apparatus for use in digitally tuning a capacitor in an...

Composite electronic component and board having the same

Composite electronic component and board having the same

Devices and methods for improving voltage handling and/or bi-direct...

Electronic component

Multilayer capacitor and electronic component device

Multilayer capacitor and electronic component device

Method of forming a leadless stack comprising multiple components

Electronic component

Capacitor and method of production thereof

Multilayer ceramic capacitor

Devices and methods for improving voltage handling and/or bi-direct...

Multilayer capacitor and electronic component device

Multilayer ceramic structure

Multilayer ceramic structure

Electronic component

Electronic element with embedded information

Transducer driver

Film capacitor

High quality factor time delay filters using multi-layer fringe cap...

Composite electronic component and board having the same mounted th...

Nanocrystal film-coated substrate, manufacturing method of same, an...

Multilayer ceramic structure

Patents Applicationslast 30 patents

MULTILAYER ELECTRONIC COMPONENT

Devices and Methods for Improving Voltage Handling and/or Bi-Direct...

Methods and Apparatuses for Use in Tuning Reactance in a Circuit De...

MULTILAYER CHIP COMPONENT

MINIATURIZATION PROCESS OF PASSIVE COMPONENT

CAPACITOR STRUCTURE AND MANUFACTURING METHOD AND OPERATING METHOD T...

CAPACITOR FORMED WITH COUPLED DIES

CAPACITORS IN A GLASS SUBSTRATE

Method and Apparatus for use in Digitally Tuning a Capacitor in an...

Devices and Methods for Improving Voltage Handling and/or Bi-Direct...

MULTI-SENSORY DEVICE INTEGRATED IN A SINGLE STRUCTURE

METHOD OF MANUFACTURING MULTILAYER CHIP COMPONENT

METHOD OF MANUFACTURING MULTILAYER CHIP COMPONENT

CAPACITOR ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Methods and Apparatuses for Use in Tuning Reactance in a Circuit De...

CAPACITOR CLUSTER

POWER CONVERSION APPARATUS

Devices and Methods for Improving Voltage Handling and/or Bi-Direct...

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS

ELECTRONIC COMPONENT

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT

Method and Apparatus for use in Digitally Tuning a Capacitor in an...

Multilayer Ceramic Structure

CAPACITOR AND METHOD OF PRODUCTION THEREOF

Leadless Stack Comprising Multiple Components

MULTILAYER CAPACITOR AND ELECTRONIC COMPONENT DEVICE

ELECTRONIC ELEMENT WITH EMBEDDED INFORMATION