Detecting endpoint of process

Industry

CPC
H01J2237/30466

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J2237/00Discharge tubes exposing object to beam

Current Industry

H01J2237/30466Detecting endpoint of process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ion beam device
- Patent number 12,148,593
- Issue date Nov 19, 2024
- HITACHI HIGH-TECH CORPORATION
- Shinichi Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of preparing integrated circuits for backside pro...
- Patent number 11,605,525
- Issue date Mar 14, 2023
- FEI Company
- James Vickers
- G01 - MEASURING TESTING
Information Patent Grant
Line-based endpoint detection
- Patent number 11,355,313
- Issue date Jun 7, 2022
- FEI Company
- Brian Routh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dose-based end-pointing for low-kV FIB milling in TEM sample prepar...
- Patent number 11,313,042
- Issue date Apr 26, 2022
- FEI Company
- Thomas G. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Depth-controllable ion milling
- Patent number 11,049,690
- Issue date Jun 29, 2021
- SELA—SOLUTIONS ENABLING NANO ANALYSIS LTD.
- Vladimir Zheleznyak
- G01 - MEASURING TESTING
Information Patent Grant
Tomography-assisted TEM prep with requested intervention automation...
- Patent number 11,004,651
- Issue date May 11, 2021
- FEI Company
- Roger Louis Alvis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement and endpointing of sample thickness
- Patent number 10,978,272
- Issue date Apr 13, 2021
- FEI Company
- Tomas Vystavel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for permanently repairing defects of absent mater...
- Patent number 10,732,501
- Issue date Aug 4, 2020
- Carl Zeiss SMT GmbH
- Jens Oster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cleaning electrostatic chuck
- Patent number 10,699,876
- Issue date Jun 30, 2020
- Advanced Ion Beam Technology, Inc.
- Yu-Ho Ni
- B08 - CLEANING
Information Patent Grant
Patterned atomic layer etching and deposition using miniature-colum...
- Patent number 10,607,845
- Issue date Mar 31, 2020
- Kevin M. Monahan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Endpointing for focused ion beam processing
- Patent number 10,529,538
- Issue date Jan 7, 2020
- FEI Company
- Scott Edward Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dose-based end-pointing for low-kV FIB milling TEM sample preparation
- Patent number 10,465,293
- Issue date Nov 5, 2019
- FEI Company
- Thomas G. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Endpointing for focused ion beam processing
- Patent number 10,204,762
- Issue date Feb 12, 2019
- FEI Company
- Scott Edward Fuller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charged particle beam drawing apparatus and charged particle beam d...
- Patent number 10,153,130
- Issue date Dec 11, 2018
- NuFlare Technology, Inc.
- Sumito Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential imaging with pattern recognition for process automatio...
- Patent number 9,881,766
- Issue date Jan 30, 2018
- FEI Company
- Alexander Buxbaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for preparing a sample for microscopy
- Patent number 9,779,914
- Issue date Oct 3, 2017
- E. A. Fischione Instruments, Inc.
- Paul E. Fischione
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing the thickness of a target sample
- Patent number 9,704,689
- Issue date Jul 11, 2017
- Oxford Instruments Nanotechnology Tools Limited
- Christian Lang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision substrate material removal using miniature-column charged...
- Patent number 9,673,114
- Issue date Jun 6, 2017
- Multibeam Corporation
- David K. Lam
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Endpoint determination for capillary-assisted flow control
- Patent number 9,631,778
- Issue date Apr 25, 2017
- Entegris, Inc.
- Joseph D. Sweeney
- G05 - CONTROLLING REGULATING
Information Patent Grant
Particle beam device and method for processing and/or analyzing a s...
- Patent number 9,455,120
- Issue date Sep 27, 2016
- Carl Zeiss Microscopy GmbH
- Andreas Schertel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint detection for photolithography mask repair
- Patent number 9,312,101
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Lin Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Differential imaging with pattern recognition for process automatio...
- Patent number 9,297,727
- Issue date Mar 29, 2016
- FEI Company
- Alexander Buxbaum
- G01 - MEASURING TESTING
Information Patent Grant
Particle beam device and method for processing and/or analyzing a s...
- Patent number 9,275,832
- Issue date Mar 1, 2016
- Carl Zeiss Microscopy GmbH
- Andreas Schertel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Focused ion beam system, sample processing method using the same, a...
- Patent number 9,218,939
- Issue date Dec 22, 2015
- Hitachi High-Tech Science Corporation
- Tatsuya Asahata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement and endpointing of sample thickness
- Patent number 9,184,025
- Issue date Nov 10, 2015
- FEI Company
- Richard J. Young
- G01 - MEASURING TESTING
Information Patent Grant
Ion beam device and machining method
- Patent number 9,111,721
- Issue date Aug 18, 2015
- Hitachi High-Technologies Corporation
- Shinya Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Endpoint detection for photolithography mask repair
- Patent number 9,040,212
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Lin Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electron induced chemical etching and deposition for local circuit...
- Patent number 8,821,682
- Issue date Sep 2, 2014
- Micron Technology, Inc.
- Mark J. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-section processing and observation apparatus
- Patent number 8,637,819
- Issue date Jan 28, 2014
- Hitachi High-Tech Science Corporation
- Makoto Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Navigation and sample processing using an ion source containing bot...
- Patent number 8,455,822
- Issue date Jun 4, 2013
- FEI Company
- Chad Rue
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
END POINT DETERMINATION BY MEANS OF CONTRAST GAS
- Publication number 20230341766
- Publication date Oct 26, 2023
- Carl Zeiss SMT GMBH
- Daniel Rhinow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINTING WITH DETERMINATION OF REMAINING DISTANCE
- Publication number 20230307209
- Publication date Sep 28, 2023
- FEI Company
- Zoltán Orémus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Automatic Detection of Required Peak for Sample Machining...
- Publication number 20230215689
- Publication date Jul 6, 2023
- TESCAN Brno, s.r.o.
- Sharang Sharang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU ETCH RATE OR DEPOSITION RATE MEASUREMENT SYSTEM
- Publication number 20230139375
- Publication date May 4, 2023
- BÜHLER ALZENAU GMBH
- Steffen GUERTLER
- G01 - MEASURING TESTING
Information Patent Application
ION BEAM DELAYERING SYSTEM AND METHOD, AND ENDPOINT MONITORING SYST...
- Publication number 20220122805
- Publication date Apr 21, 2022
- TechInsights Inc.
- Christopher PAWLOWICZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LINE-BASED ENDPOINT DETECTION
- Publication number 20210407765
- Publication date Dec 30, 2021
- FEI Company
- Brian Routh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON BEAM PVD ENDPOINT DETECTION AND CLOSED-LOOP PROCESS CONTRO...
- Publication number 20210062324
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- David Masayuki ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT AND ENDPOINTING OF SAMPLE THICKNESS
- Publication number 20200135427
- Publication date Apr 30, 2020
- FEI Company
- Tomás Vystavel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOSE-BASED END-POINTING FOR LOW-KV FIB MILLING IN TEM SAMPLE PREPAR...
- Publication number 20200095688
- Publication date Mar 26, 2020
- FEI Company
- Thomas G. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TOMOGRAPHY-ASSISTED TEM PREP WITH REQUESTED INTERVENTION AUTOMATION...
- Publication number 20200027692
- Publication date Jan 23, 2020
- FEI Company
- Roger Louis Alvis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SURFACE BY MEANS OF A PARTICLE BEAM
- Publication number 20190244784
- Publication date Aug 8, 2019
- SCIA SYSTEMS GMBH
- Thoralf Dunger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINTING FOR FOCUSED ION BEAM PROCESSING
- Publication number 20190172680
- Publication date Jun 6, 2019
- FEI Company
- Scott Edward FULLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPTH-CONTROLLABLE ION MILLING
- Publication number 20190103251
- Publication date Apr 4, 2019
- SELA – Solutions EnabLing nano Analysis LTD.
- Vladimir Zheleznyak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING THE THICKNESS OF A TARGET SAMPLE
- Publication number 20160093468
- Publication date Mar 31, 2016
- OXFORD INSTRUMENTS NANOTCHNOLOGY TOOLS LIMITED
- Christian LANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Preparing a Sample for Microscopy
- Publication number 20160027612
- Publication date Jan 28, 2016
- E.A. Fischione lnstruments, lnc.
- Paul E. Fischione
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Endpoint Detection for Photolithography Mask Repair
- Publication number 20150214006
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Differential Imaging with Pattern Recognition for Process Automatio...
- Publication number 20150136977
- Publication date May 21, 2015
- FEI Company
- Alexander Buxbaum
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS FOR A NON-CONTACT EDGE POLISHING MODULE USING...
- Publication number 20140308813
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Samuel Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOCUSED ION BEAM SYSTEM, SAMPLE PROCESSING METHOD USING THE SAME, A...
- Publication number 20140284307
- Publication date Sep 25, 2014
- HITACHI HIGH-TECH SCIENCE CORPORATION
- Tatsuya ASAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Endpoint Detection for Photolithography Mask Repair
- Publication number 20140255826
- Publication date Sep 11, 2014
- Chien-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dose-Based End-Pointing for Low-KV FIB Milling TEM Sample Preparation
- Publication number 20140061032
- Publication date Mar 6, 2014
- FEI Company
- Thomas G. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ION BEAM DEVICE AND MACHINING METHOD
- Publication number 20130334034
- Publication date Dec 19, 2013
- Hitachi High-Technologies Corporation
- Shinya Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED PARTICLE BEAM DEVICE AND METHOD OF MANUFACTURE OF SAMPLE
- Publication number 20130277552
- Publication date Oct 24, 2013
- Hitachi High-Technologies Corporation
- Terutaka Nanri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-SECTION PROCESSING AND OBSERVATION APPARATUS
- Publication number 20130248710
- Publication date Sep 26, 2013
- HITACHI HIGH-TECH SCIENCE CORPORATION
- Makoto SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT DETERMINATION FOR CAPILLARY-ASSISTED FLOW CONTROL
- Publication number 20130125999
- Publication date May 23, 2013
- Advanced Technology Materials, Inc.
- Joseph D. Sweeney
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Application
CHARGED PARTICLE BEAM APPARATUS, AND SAMPLE PROCESSING AND OBSERVAT...
- Publication number 20120326028
- Publication date Dec 27, 2012
- Hiroyuki MUTO
- G01 - MEASURING TESTING
Information Patent Application
PARTICLE BEAM DEVICE AND METHOD FOR PROCESSING AND/OR ANALYZING A S...
- Publication number 20120205538
- Publication date Aug 16, 2012
- Andreas SCHERTEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT AND ENDPOINTING OF SAMPLE THICKNESS
- Publication number 20120187285
- Publication date Jul 26, 2012
- FEI Company
- RICHARD J. YOUNG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120175726
- Publication date Jul 12, 2012
- Jin Kashiwagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Navigation and Sample Processing Using an Ion Source Containing bot...
- Publication number 20120056088
- Publication date Mar 8, 2012
- FEI Company
- Chad Rue
- H01 - BASIC ELECTRIC ELEMENTS

Detecting endpoint of process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ion beam device

System and method of preparing integrated circuits for backside pro...

Line-based endpoint detection

Dose-based end-pointing for low-kV FIB milling in TEM sample prepar...

Depth-controllable ion milling

Tomography-assisted TEM prep with requested intervention automation...

Measurement and endpointing of sample thickness

Method and device for permanently repairing defects of absent mater...

Method of cleaning electrostatic chuck

Patterned atomic layer etching and deposition using miniature-colum...

Endpointing for focused ion beam processing

Dose-based end-pointing for low-kV FIB milling TEM sample preparation

Endpointing for focused ion beam processing

Charged particle beam drawing apparatus and charged particle beam d...

Differential imaging with pattern recognition for process automatio...

Apparatus for preparing a sample for microscopy

Method of reducing the thickness of a target sample

Precision substrate material removal using miniature-column charged...

Endpoint determination for capillary-assisted flow control

Particle beam device and method for processing and/or analyzing a s...

Endpoint detection for photolithography mask repair

Differential imaging with pattern recognition for process automatio...

Particle beam device and method for processing and/or analyzing a s...

Focused ion beam system, sample processing method using the same, a...

Measurement and endpointing of sample thickness

Ion beam device and machining method

Endpoint detection for photolithography mask repair

Electron induced chemical etching and deposition for local circuit...

Cross-section processing and observation apparatus

Navigation and sample processing using an ion source containing bot...

Patents Applicationslast 30 patents

END POINT DETERMINATION BY MEANS OF CONTRAST GAS

ENDPOINTING WITH DETERMINATION OF REMAINING DISTANCE

Method of Automatic Detection of Required Peak for Sample Machining...

IN-SITU ETCH RATE OR DEPOSITION RATE MEASUREMENT SYSTEM

ION BEAM DELAYERING SYSTEM AND METHOD, AND ENDPOINT MONITORING SYST...

LINE-BASED ENDPOINT DETECTION

ELECTRON BEAM PVD ENDPOINT DETECTION AND CLOSED-LOOP PROCESS CONTRO...

MEASUREMENT AND ENDPOINTING OF SAMPLE THICKNESS

DOSE-BASED END-POINTING FOR LOW-KV FIB MILLING IN TEM SAMPLE PREPAR...

TOMOGRAPHY-ASSISTED TEM PREP WITH REQUESTED INTERVENTION AUTOMATION...

METHOD OF PROCESSING A SURFACE BY MEANS OF A PARTICLE BEAM

ENDPOINTING FOR FOCUSED ION BEAM PROCESSING

DEPTH-CONTROLLABLE ION MILLING

METHOD OF REDUCING THE THICKNESS OF A TARGET SAMPLE

Apparatus for Preparing a Sample for Microscopy

Endpoint Detection for Photolithography Mask Repair

Differential Imaging with Pattern Recognition for Process Automatio...

METHODS AND APPARATUS FOR A NON-CONTACT EDGE POLISHING MODULE USING...

FOCUSED ION BEAM SYSTEM, SAMPLE PROCESSING METHOD USING THE SAME, A...

Endpoint Detection for Photolithography Mask Repair

Dose-Based End-Pointing for Low-KV FIB Milling TEM Sample Preparation

ION BEAM DEVICE AND MACHINING METHOD

CHARGED PARTICLE BEAM DEVICE AND METHOD OF MANUFACTURE OF SAMPLE

CROSS-SECTION PROCESSING AND OBSERVATION APPARATUS

ENDPOINT DETERMINATION FOR CAPILLARY-ASSISTED FLOW CONTROL

CHARGED PARTICLE BEAM APPARATUS, AND SAMPLE PROCESSING AND OBSERVAT...

PARTICLE BEAM DEVICE AND METHOD FOR PROCESSING AND/OR ANALYZING A S...

MEASUREMENT AND ENDPOINTING OF SAMPLE THICKNESS

SEMICONDUCTOR DEVICE

Navigation and Sample Processing Using an Ion Source Containing bot...