Devices for the automatic drive or the program control of the machines

Industry

CPC
B28D5/0064

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0064Devices for the automatic drive or the program control of the machines

Industries

Patents Grantslast 30 patents

Information Patent Grant
Edge alignment method
- Patent number 12,151,401
- Issue date Nov 26, 2024
- Disco Corporation
- Atsushi Komatsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating wafers from donor substrates
- Patent number 12,030,216
- Issue date Jul 9, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of silicon carbide wafer, silicon carbide wafe...
- Patent number 11,969,917
- Issue date Apr 30, 2024
- SENIC INC.
- Jung-Gyu Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Protective member forming apparatus
- Patent number 11,915,963
- Issue date Feb 27, 2024
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-assisted method for parting crystalline material
- Patent number 11,911,842
- Issue date Feb 27, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus
- Patent number 11,820,042
- Issue date Nov 21, 2023
- Disco Corporation
- Kazuki Terada
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Production facility for separating wafers from donor substrates
- Patent number 11,787,083
- Issue date Oct 17, 2023
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing ingot block, method for manufacturing semi...
- Patent number 11,587,792
- Issue date Feb 21, 2023
- Sumco Corporation
- Yasuhiro Saito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Dividing apparatus including an imaging unit for detecting defects...
- Patent number 11,476,137
- Issue date Oct 18, 2022
- Disco Corporation
- Hironari Ohkubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for imaging and cutting semiconductor wafers an...
- Patent number 11,450,577
- Issue date Sep 20, 2022
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-assisted method for parting crystalline material
- Patent number 11,219,966
- Issue date Jan 11, 2022
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 11,173,631
- Issue date Nov 16, 2021
- Disco Corporation
- Takeomi Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of cleaving of buried defects
- Patent number 11,137,356
- Issue date Oct 5, 2021
- SELA SEMICONDUCTOR ENGINEERING LABORATORIES LTD.
- Vladimir Zheleznyak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cutting apparatus
- Patent number 10,974,356
- Issue date Apr 13, 2021
- Disco Corporation
- Kazuki Terada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Incident radiation induced subsurface damage for controlled crack p...
- Patent number 10,940,611
- Issue date Mar 9, 2021
- Halo Industries, Inc.
- Andrei Teodor Iancu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for separating bonded wafer structures
- Patent number 10,910,280
- Issue date Feb 2, 2021
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cleave systems, mountable cleave monitoring systems, and methods fo...
- Patent number 10,679,908
- Issue date Jun 9, 2020
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,654,193
- Issue date May 19, 2020
- GlobalWafers Co., Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-assisted method for parting crystalline material
- Patent number 10,562,130
- Issue date Feb 18, 2020
- Cree, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ingot cutting apparatus, and load detecting device used in ingot cu...
- Patent number 10,363,685
- Issue date Jul 30, 2019
- TEC GIHAN CO., LTD.
- Masayuki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 10,328,606
- Issue date Jun 25, 2019
- Disco Corporation
- Fumio Uchida
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and system for controlling a surface profile of a wafer
- Patent number 10,315,337
- Issue date Jun 11, 2019
- GlobalWafers Co. Ltd.
- Peter D. Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 9,770,842
- Issue date Sep 26, 2017
- Disco Corporation
- Kei Katoh
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Smart gemstone and a preparation method thereof
- Patent number 9,635,912
- Issue date May 2, 2017
- Songjun Chen
- A44 - HABERDASHERY JEWELLERY
Information Patent Grant
Workpiece cutting method using dummy wafer to determine condition o...
- Patent number 9,627,260
- Issue date Apr 18, 2017
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for imaging and cutting semiconductor wafers an...
- Patent number 9,579,825
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing wafers from a workpiece
- Patent number 9,073,135
- Issue date Jul 7, 2015
- Siltronic AG
- Anton Huber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing apparatus and dicing method
- Patent number 9,010,225
- Issue date Apr 21, 2015
- Tokyo Seimitsu Co., Ltd.
- Yoshitami Hojo
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate cutting device and method
- Patent number 8,991,673
- Issue date Mar 31, 2015
- Soitec
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
CNC WIRE CUTTING MACHINE
- Publication number 20240308107
- Publication date Sep 19, 2024
- VISWESH SRINIVASAN
- VISWESH SRINIVASAN
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PROCESSING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD
- Publication number 20240269892
- Publication date Aug 15, 2024
- TDK Corporation
- Atsuhiro NONAKA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
BRICK LOADING/UNLOADING APPARATUS AND METHOD
- Publication number 20240269893
- Publication date Aug 15, 2024
- Hanwha Corporation
- Jong Won LEE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer
- Publication number 20240262008
- Publication date Aug 8, 2024
- Xi'an ESWIN Material Technology Co., Ltd.
- Na YI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
- Publication number 20240189940
- Publication date Jun 13, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...
- Publication number 20230390962
- Publication date Dec 7, 2023
- GLOBALWAFERS CO., LTD.
- Sumeet S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for Separating Wafers from Donor Substrates
- Publication number 20230390961
- Publication date Dec 7, 2023
- SILTECTRA GMBH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PEELING APPARATUS
- Publication number 20230373129
- Publication date Nov 23, 2023
- Disco Corporation
- Koyo HONOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR PROCESSING SILICON WAFERS
- Publication number 20230339069
- Publication date Oct 26, 2023
- Siltronic Corporation
- Andrei Istratov
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Monocrystalline SIC Substrates Having an Asymmetrical Geometry and...
- Publication number 20230317780
- Publication date Oct 5, 2023
- SICRYSTAL GMBH
- Kuniyoshi OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...
- Publication number 20230311363
- Publication date Oct 5, 2023
- SILTRONIC AG
- Georg Pietsch
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230286067
- Publication date Sep 14, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIVIDING APPARATUS
- Publication number 20230278260
- Publication date Sep 7, 2023
- Disco Corporation
- Shinya ARUGA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230278118
- Publication date Sep 7, 2023
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234149
- Publication date Jul 27, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230226629
- Publication date Jul 20, 2023
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFE...
- Publication number 20220219354
- Publication date Jul 14, 2022
- SENIC Inc.
- Jung-Gyu KIM
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
VARIABLE-STEP-DISTANCE MICRO-MILLING REPAIR CUTTER PATH GENERATING...
- Publication number 20220152873
- Publication date May 19, 2022
- HARBIN INSTITUTE OF TECHNOLOGY
- Jian Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
- Publication number 20220126395
- Publication date Apr 28, 2022
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...
- Publication number 20220063135
- Publication date Mar 3, 2022
- DIA&CO Inc.
- YOUNG DAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROTECTIVE MEMBER FORMING APPARATUS
- Publication number 20220059390
- Publication date Feb 24, 2022
- Disco Corporation
- Yoshinori KAKINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20220040882
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20220016802
- Publication date Jan 20, 2022
- Shin-Etsu Handotai Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
FEEDING UNIT FOR A GEMSTONE MACHINE
- Publication number 20210387378
- Publication date Dec 16, 2021
- Sahajanand Technologies Private Limited
- Chirag OZA
- B24 - GRINDING POLISHING
Information Patent Application
EDGE ALIGNMENT METHOD
- Publication number 20210291404
- Publication date Sep 23, 2021
- Disco Corporation
- Atsushi KOMATSU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PROCESSING APPARATUS
- Publication number 20210107180
- Publication date Apr 15, 2021
- Disco Corporation
- Kazuki TERADA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK P...
- Publication number 20210039280
- Publication date Feb 11, 2021
- Halo Industries, Inc.
- Andrei Teodor Iancu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK P...
- Publication number 20210023741
- Publication date Jan 28, 2021
- Halo Industries, Inc.
- Andrei Teodor Iancu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING APPARATUS
- Publication number 20200391410
- Publication date Dec 17, 2020
- Disco Corporation
- Takeomi FUKUOKA
- B28 - WORKING CEMENT, CLAY, OR STONE

Devices for the automatic drive or the program control of the machines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Edge alignment method

Method for producing semiconductor wafers using a wire saw, wire sa...

Method for separating wafers from donor substrates

Manufacturing method of silicon carbide wafer, silicon carbide wafe...

Protective member forming apparatus

Laser-assisted method for parting crystalline material

Processing apparatus

Production facility for separating wafers from donor substrates

Method for manufacturing ingot block, method for manufacturing semi...

Dividing apparatus including an imaging unit for detecting defects...

Methods and systems for imaging and cutting semiconductor wafers an...

Laser-assisted method for parting crystalline material

Cutting apparatus

System and method of cleaving of buried defects

Cutting apparatus

Incident radiation induced subsurface damage for controlled crack p...

Methods for separating bonded wafer structures

Cleave systems, mountable cleave monitoring systems, and methods fo...

Methods and system for controlling a surface profile of a wafer

Laser-assisted method for parting crystalline material

Ingot cutting apparatus, and load detecting device used in ingot cu...

Cutting apparatus

Methods and system for controlling a surface profile of a wafer

Cutting apparatus

Smart gemstone and a preparation method thereof

Workpiece cutting method using dummy wafer to determine condition o...

Methods and systems for imaging and cutting semiconductor wafers an...

Method for slicing wafers from a workpiece

Dicing apparatus and dicing method

Substrate cutting device and method

Patents Applicationslast 30 patents

CNC WIRE CUTTING MACHINE

PROCESSING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD

BRICK LOADING/UNLOADING APPARATUS AND METHOD

Processing Method and System for Reducing Warp of Nitrogen-Doped Wafer

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL

SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLIC...

Method for Separating Wafers from Donor Substrates

PEELING APPARATUS

SYSTEM AND METHOD FOR PROCESSING SILICON WAFERS

Monocrystalline SIC Substrates Having an Asymmetrical Geometry and...

METHOD AND APPARATUS FOR SIMULTANEOUSLY SLICING A MULTIPLICITY OF S...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

DIVIDING APPARATUS

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

MANUFACTURING METHOD OF SILICON CARBIDE WAFER, SILICON CARBIDE WAFE...

VARIABLE-STEP-DISTANCE MICRO-MILLING REPAIR CUTTER PATH GENERATING...

LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL

METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...

PROTECTIVE MEMBER FORMING APPARATUS

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

METHOD FOR SLICING WORKPIECE AND WIRE SAW

FEEDING UNIT FOR A GEMSTONE MACHINE

EDGE ALIGNMENT METHOD

PROCESSING APPARATUS

INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK P...

INCIDENT RADIATION INDUCED SUBSURFACE DAMAGE FOR CONTROLLED CRACK P...

CUTTING APPARATUS