Diaphragm associated with a buried cavity

Industry

CPC
G01L9/0045

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE G01L9/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material by electric or magnetic means

Current Industry

G01L9/0045Diaphragm associated with a buried cavity

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Jan 30, 2024
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- G01 - MEASURING TESTING
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Integrated micro-electromechanical device of semiconductor material...
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- STMicroelectronics S.r.l.
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MEMS device with dummy-area utilization for pressure enhancement
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- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
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Method for manufacturing a membrane component and a membrane component
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- Issue date Mar 7, 2023
- Melexis Technologies NV
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- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor manufacturing method and structure thereof
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- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor assemblies with protective pressure feature of a pr...
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- Issue date Dec 7, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Martin Pfeiffer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive pressure sensor
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- Issue date Dec 7, 2021
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
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- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated system and method for measuring deformations and/or stre...
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- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a stress-decoupled micromechanical pressure se...
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- Robert Bosch GmbH
- Arne Dannenberg
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Information Patent Grant
Environmental sensor and manufacturing method thereof
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- Issue date Sep 1, 2020
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- Junkai Zhan
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Information Patent Grant
Pressure sensor
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Information Patent Grant
Manufacturing method of semiconductor structure including heater
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Multi-transducer modulus, electronic apparatus including the multi-...
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- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor pressure sensor
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- Issue date Mar 17, 2020
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro mechanical devices with an improved recess or cavity structure
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- Issue date Feb 11, 2020
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Information Patent Grant
CMOS compatible capacitive absolute pressure sensors
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- Issue date Feb 11, 2020
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- Tariq Salim Alsaiary
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Information Patent Grant
Microelectromechanical transducer with thin-membrane for high press...
- Patent number 10,527,511
- Issue date Jan 7, 2020
- STMicroelectronics S.r.l.
- Enri Duqi
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device and manufacturing method
- Patent number 10,386,255
- Issue date Aug 20, 2019
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Grant
Integrated micro-electromechanical device of semiconductor material...
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- Issue date Jul 30, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro mechanical devices with an improved recess or cavity structure
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- Issue date May 21, 2019
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- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic part with sensor exposed to ambient air
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- Issue date Apr 16, 2019
- Rohm Co., Ltd.
- Masahiro Sakuragi
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Information Patent Grant
Pressure sensor
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- Issue date Apr 9, 2019
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- Johannes Schumm
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Information Patent Grant
Pressure sensor and method for producing the pressure sensor
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- Issue date Jan 15, 2019
- Robert Bosch GmbH
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Information Patent Grant
Pressure sensor
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- Issue date May 1, 2018
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- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS chip, measuring element and pressure sensor for measuring a pr...
- Patent number 9,927,316
- Issue date Mar 27, 2018
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNT E.V.
- Stephane Kuehne
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for measuring a vacuum pressure using a measuring...
- Patent number 9,791,339
- Issue date Oct 17, 2017
- INFICON AG
- Felix Mullis
- G01 - MEASURING TESTING
Information Patent Grant
MEMS capacitive pressure sensor
- Patent number 9,772,245
- Issue date Sep 26, 2017
- ams International AG
- Willem Frederik Adrianus Besling
- G01 - MEASURING TESTING
Information Patent Grant
Polymer layer system pressure sensor device, and polymer layer syst...
- Patent number 9,766,144
- Issue date Sep 19, 2017
- Robert Bosch GmbH
- Thomas Brettschneider
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SENSOR
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- Publication date Oct 31, 2024
- Rohm Co., Ltd.
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- G01 - MEASURING TESTING
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SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS
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- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
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METHOD FOR MANUFACTURING A MEMBRANE COMPONENT AND A MEMBRANE COMPONENT
- Publication number 20210206629
- Publication date Jul 8, 2021
- X-FAB Global Services GmbH
- Steffen Leopold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE
- Publication number 20200386641
- Publication date Dec 10, 2020
- TE Connectivity Solutions GmbH
- Martin Pfeiffer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20200231431
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20200131032
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
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SENSOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20200075466
- Publication date Mar 5, 2020
- MELEXIS TECHNOLOGIES NV
- Jian CHEN
- G01 - MEASURING TESTING
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AN INTEGRATED SYSTEM AND METHOD FOR MEASURING DEFORMATIONS AND/OR S...
- Publication number 20190316979
- Publication date Oct 17, 2019
- Politecnico di Torino
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Integrated Micro-Electromechanical Device of Semiconductor Material...
- Publication number 20190292045
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- STMicroelectronics S.r.l.
- Alberto Pagani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
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PRESSURE SENSOR
- Publication number 20190226932
- Publication date Jul 25, 2019
- InvenSense, Ref.
- Johannes SCHUMM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE
- Publication number 20190226933
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- HONEYWELL INTERNATIONAL INC.
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METHOD FOR PRODUCING A STRESS-DECOUPLED MICROMECHANICAL PRESSURE SE...
- Publication number 20190202687
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- Arne Dannenberg
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- Enri DUQI
- G01 - MEASURING TESTING
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- Publication number 20180346319
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
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- InvenSense, Inc.
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MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICAT...
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- MOTION ENGINE INC.
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MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE
- Publication number 20180024021
- Publication date Jan 25, 2018
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PART
- Publication number 20170284881
- Publication date Oct 5, 2017
- Rohm Co., Ltd.
- Masahiro SAKURAGI
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensor and Method for Producing the Pressure Sensor
- Publication number 20170097270
- Publication date Apr 6, 2017
- ROBERT BOSCH GmbH
- Walter DAVES
- G01 - MEASURING TESTING
Information Patent Application
MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PR...
- Publication number 20160231189
- Publication date Aug 11, 2016
- KISTLER HOLDING AG
- STEPHANE KUEHNE
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSORS AND METHODS OF MAKING THE SAME
- Publication number 20160109314
- Publication date Apr 21, 2016
- Microlux Technology
- TOM KWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure Sensor Package with Integrated Sealing
- Publication number 20150090042
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POLYMER LAYER SYSTEM PRESSURE SENSOR DEVICE, AND POLYMER LAYER SYST...
- Publication number 20140290373
- Publication date Oct 2, 2014
- ROBERT BOSCH GmbH
- Thomas Brettschneider
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND ME...
- Publication number 20140242740
- Publication date Aug 28, 2014
- Bin Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CATHETER DIE AND METHOD OF FABRICATING THE SAME
- Publication number 20140238142
- Publication date Aug 28, 2014
- Amphenol Thermometrics, Inc.
- Sisira K. GAMAGE
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20140061868
- Publication date Mar 6, 2014
- Reiko HIRUTA
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE DETECTION MODULE AND PRESSURE SENSOR DEVICE HAVING SUCH A...
- Publication number 20140033824
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Masoud HABIBI
- G01 - MEASURING TESTING

Diaphragm associated with a buried cavity

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fully differential capacitive pressure sensor including stacked sen...

Integrated micro-electromechanical device of semiconductor material...

MEMS device with dummy-area utilization for pressure enhancement

Method for manufacturing a membrane component and a membrane component

Sensor device and method of manufacture

Semiconductor manufacturing method and structure thereof

Pressure sensor assemblies with protective pressure feature of a pr...

Capacitive pressure sensor

MEMS device with dummy-area utilization for pressure enhancement

Integrated system and method for measuring deformations and/or stre...

Method for producing a stress-decoupled micromechanical pressure se...

Environmental sensor and manufacturing method thereof

Pressure sensor

Manufacturing method of semiconductor structure including heater

Multi-transducer modulus, electronic apparatus including the multi-...

Semiconductor pressure sensor

Micro mechanical devices with an improved recess or cavity structure

CMOS compatible capacitive absolute pressure sensors

Microelectromechanical transducer with thin-membrane for high press...

Pressure sensor device and manufacturing method

Integrated micro-electromechanical device of semiconductor material...

Micro mechanical devices with an improved recess or cavity structure

Electronic part with sensor exposed to ambient air

Pressure sensor

Pressure sensor and method for producing the pressure sensor

Pressure sensor

MEMS chip, measuring element and pressure sensor for measuring a pr...

Method and device for measuring a vacuum pressure using a measuring...

MEMS capacitive pressure sensor

Polymer layer system pressure sensor device, and polymer layer syst...

Patents Applicationslast 30 patents

SENSOR

Semiconductor Device and Method for Sensing External Condition in H...

FULLY DIFFERENTIAL CAPACITIVE PRESSURE SENSOR CONCEPT

SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

METHOD FOR MANUFACTURING A MEMBRANE COMPONENT AND A MEMBRANE COMPONENT

PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE

SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

SENSOR DEVICE AND METHOD OF MANUFACTURE

AN INTEGRATED SYSTEM AND METHOD FOR MEASURING DEFORMATIONS AND/OR S...

Integrated Micro-Electromechanical Device of Semiconductor Material...

PRESSURE SENSOR

MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE

METHOD FOR PRODUCING A STRESS-DECOUPLED MICROMECHANICAL PRESSURE SE...

MICROELECTROMECHANICAL TRANSDUCER WITH THIN-MEMBRANE FOR HIGH PRESS...

SEMICONDUCTOR MANUFACTURING METHOD

PRESSURE SENSOR

MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICAT...

MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE

ELECTRONIC PART

Pressure Sensor and Method for Producing the Pressure Sensor

MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PR...

PRESSURE SENSORS AND METHODS OF MAKING THE SAME

Pressure Sensor Package with Integrated Sealing

POLYMER LAYER SYSTEM PRESSURE SENSOR DEVICE, AND POLYMER LAYER SYST...

MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND ME...

CATHETER DIE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

PRESSURE DETECTION MODULE AND PRESSURE SENSOR DEVICE HAVING SUCH A...