Diaphragm associated with a buried cavity

Industry

CPC
G01L9/0045

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE G01L9/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material by electric or magnetic means

Current Industry

G01L9/0045Diaphragm associated with a buried cavity

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fully differential capacitive pressure sensor including stacked sen...
- Patent number 11,885,705
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Athanasios Kollias
- G01 - MEASURING TESTING
Information Patent Grant
Integrated micro-electromechanical device of semiconductor material...
- Patent number 11,724,932
- Issue date Aug 15, 2023
- STMicroelectronics S.r.l.
- Alberto Pagani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,713,242
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a membrane component and a membrane component
- Patent number 11,708,265
- Issue date Jul 25, 2023
- X-FAB Global Services GmbH
- Steffen Leopold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and method of manufacture
- Patent number 11,600,559
- Issue date Mar 7, 2023
- Melexis Technologies NV
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and structure thereof
- Patent number 11,254,564
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor assemblies with protective pressure feature of a pr...
- Patent number 11,193,842
- Issue date Dec 7, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Martin Pfeiffer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive pressure sensor
- Patent number 11,193,843
- Issue date Dec 7, 2021
- Kathirgamasundaram Sooriakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,174,158
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated system and method for measuring deformations and/or stre...
- Patent number 11,092,499
- Issue date Aug 17, 2021
- POLITECNICO DI TORINO
- Francesco Tondolo
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a stress-decoupled micromechanical pressure se...
- Patent number 10,988,377
- Issue date Apr 27, 2021
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Environmental sensor and manufacturing method thereof
- Patent number 10,760,929
- Issue date Sep 1, 2020
- Weifang Goertek Microelectronics Co., Ltd.
- Junkai Zhan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 10,712,218
- Issue date Jul 14, 2020
- Invensense, Inc.
- Johannes Schumm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure including heater
- Patent number 10,618,804
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-transducer modulus, electronic apparatus including the multi-...
- Patent number 10,605,684
- Issue date Mar 31, 2020
- STMicroelectronics S.r.l.
- Alex Gritti
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,589,981
- Issue date Mar 17, 2020
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro mechanical devices with an improved recess or cavity structure
- Patent number 10,557,769
- Issue date Feb 11, 2020
- Honeywell International Inc.
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS compatible capacitive absolute pressure sensors
- Patent number 10,556,791
- Issue date Feb 11, 2020
- King Abdulaziz City for Science and Technology
- Tariq Salim Alsaiary
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical transducer with thin-membrane for high press...
- Patent number 10,527,511
- Issue date Jan 7, 2020
- STMicroelectronics S.r.l.
- Enri Duqi
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device and manufacturing method
- Patent number 10,386,255
- Issue date Aug 20, 2019
- Infineon Technologies Dresden GmbH
- Thoralf Kautzsch
- G01 - MEASURING TESTING
Information Patent Grant
Integrated micro-electromechanical device of semiconductor material...
- Patent number 10,364,143
- Issue date Jul 30, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro mechanical devices with an improved recess or cavity structure
- Patent number 10,295,421
- Issue date May 21, 2019
- HONEYWELL INTERNATIONAL INC., A DELAWARE CORPORATION
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic part with sensor exposed to ambient air
- Patent number 10,260,974
- Issue date Apr 16, 2019
- Rohm Co., Ltd.
- Masahiro Sakuragi
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor
- Patent number 10,254,185
- Issue date Apr 9, 2019
- Invensense, Inc.
- Johannes Schumm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor and method for producing the pressure sensor
- Patent number 10,180,370
- Issue date Jan 15, 2019
- Robert Bosch GmbH
- Walter Daves
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 9,958,349
- Issue date May 1, 2018
- Invensense, Inc.
- Johannes Schumm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS chip, measuring element and pressure sensor for measuring a pr...
- Patent number 9,927,316
- Issue date Mar 27, 2018
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNT E.V.
- Stephane Kuehne
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for measuring a vacuum pressure using a measuring...
- Patent number 9,791,339
- Issue date Oct 17, 2017
- INFICON AG
- Felix Mullis
- G01 - MEASURING TESTING
Information Patent Grant
MEMS capacitive pressure sensor
- Patent number 9,772,245
- Issue date Sep 26, 2017
- ams International AG
- Willem Frederik Adrianus Besling
- G01 - MEASURING TESTING
Information Patent Grant
Polymer layer system pressure sensor device, and polymer layer syst...
- Patent number 9,766,144
- Issue date Sep 19, 2017
- Robert Bosch GmbH
- Thomas Brettschneider
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY DIFFERENTIAL CAPACITIVE PRESSURE SENSOR CONCEPT
- Publication number 20230054356
- Publication date Feb 23, 2023
- INFINEON TECHNOLOGIES AG
- Athanasios Kollias
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS
- Publication number 20220074803
- Publication date Mar 10, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Steffen BIESELT
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20220063994
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMBRANE COMPONENT AND A MEMBRANE COMPONENT
- Publication number 20210206629
- Publication date Jul 8, 2021
- X-FAB Global Services GmbH
- Steffen Leopold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE
- Publication number 20200386641
- Publication date Dec 10, 2020
- TE Connectivity Solutions GmbH
- Martin Pfeiffer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20200231431
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20200131032
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20200075466
- Publication date Mar 5, 2020
- MELEXIS TECHNOLOGIES NV
- Jian CHEN
- G01 - MEASURING TESTING
Information Patent Application
AN INTEGRATED SYSTEM AND METHOD FOR MEASURING DEFORMATIONS AND/OR S...
- Publication number 20190316979
- Publication date Oct 17, 2019
- Politecnico di Torino
- Francesco TONDOLO
- G01 - MEASURING TESTING
Information Patent Application
Integrated Micro-Electromechanical Device of Semiconductor Material...
- Publication number 20190292045
- Publication date Sep 26, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR
- Publication number 20190226932
- Publication date Jul 25, 2019
- InvenSense, Ref.
- Johannes SCHUMM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE
- Publication number 20190226933
- Publication date Jul 25, 2019
- HONEYWELL INTERNATIONAL INC.
- Carl STEWART
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A STRESS-DECOUPLED MICROMECHANICAL PRESSURE SE...
- Publication number 20190202687
- Publication date Jul 4, 2019
- ROBERT BOSCH GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL TRANSDUCER WITH THIN-MEMBRANE FOR HIGH PRESS...
- Publication number 20190064020
- Publication date Feb 28, 2019
- STMicroelectronics S.r.l.
- Enri DUQI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20180346319
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR
- Publication number 20180202882
- Publication date Jul 19, 2018
- InvenSense, Inc.
- Johannes Schumm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICAT...
- Publication number 20180074090
- Publication date Mar 15, 2018
- MOTION ENGINE INC.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE
- Publication number 20180024021
- Publication date Jan 25, 2018
- Carl Stewart
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC PART
- Publication number 20170284881
- Publication date Oct 5, 2017
- Rohm Co., Ltd.
- Masahiro SAKURAGI
- G01 - MEASURING TESTING
Information Patent Application
Pressure Sensor and Method for Producing the Pressure Sensor
- Publication number 20170097270
- Publication date Apr 6, 2017
- ROBERT BOSCH GmbH
- Walter DAVES
- G01 - MEASURING TESTING
Information Patent Application
MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PR...
- Publication number 20160231189
- Publication date Aug 11, 2016
- KISTLER HOLDING AG
- STEPHANE KUEHNE
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE SENSORS AND METHODS OF MAKING THE SAME
- Publication number 20160109314
- Publication date Apr 21, 2016
- Microlux Technology
- TOM KWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure Sensor Package with Integrated Sealing
- Publication number 20150090042
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POLYMER LAYER SYSTEM PRESSURE SENSOR DEVICE, AND POLYMER LAYER SYST...
- Publication number 20140290373
- Publication date Oct 2, 2014
- ROBERT BOSCH GmbH
- Thomas Brettschneider
- G01 - MEASURING TESTING
Information Patent Application
MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND ME...
- Publication number 20140242740
- Publication date Aug 28, 2014
- Bin Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CATHETER DIE AND METHOD OF FABRICATING THE SAME
- Publication number 20140238142
- Publication date Aug 28, 2014
- Amphenol Thermometrics, Inc.
- Sisira K. GAMAGE
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20140061868
- Publication date Mar 6, 2014
- Reiko HIRUTA
- G01 - MEASURING TESTING
Information Patent Application
PRESSURE DETECTION MODULE AND PRESSURE SENSOR DEVICE HAVING SUCH A...
- Publication number 20140033824
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Masoud HABIBI
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...
- Publication number 20130334624
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Thoralf Kautzsch
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Diaphragm associated with a buried cavity

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fully differential capacitive pressure sensor including stacked sen...

Integrated micro-electromechanical device of semiconductor material...

MEMS device with dummy-area utilization for pressure enhancement

Method for manufacturing a membrane component and a membrane component

Sensor device and method of manufacture

Semiconductor manufacturing method and structure thereof

Pressure sensor assemblies with protective pressure feature of a pr...

Capacitive pressure sensor

MEMS device with dummy-area utilization for pressure enhancement

Integrated system and method for measuring deformations and/or stre...

Method for producing a stress-decoupled micromechanical pressure se...

Environmental sensor and manufacturing method thereof

Pressure sensor

Manufacturing method of semiconductor structure including heater

Multi-transducer modulus, electronic apparatus including the multi-...

Semiconductor pressure sensor

Micro mechanical devices with an improved recess or cavity structure

CMOS compatible capacitive absolute pressure sensors

Microelectromechanical transducer with thin-membrane for high press...

Pressure sensor device and manufacturing method

Integrated micro-electromechanical device of semiconductor material...

Micro mechanical devices with an improved recess or cavity structure

Electronic part with sensor exposed to ambient air

Pressure sensor

Pressure sensor and method for producing the pressure sensor

Pressure sensor

MEMS chip, measuring element and pressure sensor for measuring a pr...

Method and device for measuring a vacuum pressure using a measuring...

MEMS capacitive pressure sensor

Polymer layer system pressure sensor device, and polymer layer syst...

Patents Applicationslast 30 patents

Semiconductor Device and Method for Sensing External Condition in H...

FULLY DIFFERENTIAL CAPACITIVE PRESSURE SENSOR CONCEPT

SEMICONDUCTOR DIE WITH PRESSURE AND ACCELERATION SENSOR ELEMENTS

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

METHOD FOR MANUFACTURING A MEMBRANE COMPONENT AND A MEMBRANE COMPONENT

PRESSURE SENSOR ASSEMBLIES WITH PROTECTIVE PRESSURE FEATURE

SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

SENSOR DEVICE AND METHOD OF MANUFACTURE

AN INTEGRATED SYSTEM AND METHOD FOR MEASURING DEFORMATIONS AND/OR S...

Integrated Micro-Electromechanical Device of Semiconductor Material...

PRESSURE SENSOR

MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE

METHOD FOR PRODUCING A STRESS-DECOUPLED MICROMECHANICAL PRESSURE SE...

MICROELECTROMECHANICAL TRANSDUCER WITH THIN-MEMBRANE FOR HIGH PRESS...

SEMICONDUCTOR MANUFACTURING METHOD

PRESSURE SENSOR

MULTIPLE DEGREE OF FREEDOM MEMS SENSOR CHIP AND METHOD FOR FABRICAT...

MICRO MECHANICAL DEVICES WITH AN IMPROVED RECESS OR CAVITY STRUCTURE

ELECTRONIC PART

Pressure Sensor and Method for Producing the Pressure Sensor

MEMS CHIP, MEASURING ELEMENT AND PRESSURE SENSOR FOR MEASURING A PR...

PRESSURE SENSORS AND METHODS OF MAKING THE SAME

Pressure Sensor Package with Integrated Sealing

POLYMER LAYER SYSTEM PRESSURE SENSOR DEVICE, AND POLYMER LAYER SYST...

MICROMACHINED ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR AND ME...

CATHETER DIE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

PRESSURE DETECTION MODULE AND PRESSURE SENSOR DEVICE HAVING SUCH A...

METHOD OF PROVIDING A SEMICONDUCTOR STRUCTURE WITH FORMING A SACRIF...