Dielectric details

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CPC
H05K1/024

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/024Dielectric details

Industries

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency front-end structures
- Patent number 12,200,855
- Issue date Jan 14, 2025
- Intel Corporation
- Sidharth Dalmia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 12,200,859
- Issue date Jan 14, 2025
- TOPPAN INC.
- Jun Onohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for minimizing electromagnetic coupling between surface m...
- Patent number 12,191,932
- Issue date Jan 7, 2025
- Skyworks Solutions, Inc.
- John C. Baldwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact arrangement and electronic assembly
- Patent number 12,191,242
- Issue date Jan 7, 2025
- Via Technologies, Inc.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit board and antenna module
- Patent number 12,193,151
- Issue date Jan 7, 2025
- Fujitsu Limited
- Shirou Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,176,615
- Issue date Dec 24, 2024
- Kore Semiconductor Co., Ltd.
- Ying-Chieh Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency high-voltage waveguide device
- Patent number 12,176,595
- Issue date Dec 24, 2024
- TRUMPF Huettinger GmbH + Co. KG
- Christian Wangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency amplifier
- Patent number 12,176,860
- Issue date Dec 24, 2024
- Sumitomo Electric Industries, Ltd.
- Tatsuya Hashinaga
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board (PCB) module comprising an embedded radio-fre...
- Patent number 12,171,058
- Issue date Dec 17, 2024
- GN HEARING A/S
- Maja Amskov Gravad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB having edge antenna, and battery including PCB having edge antenna
- Patent number 12,170,414
- Issue date Dec 17, 2024
- LG ENERGY SOLUTION, LTD.
- Changjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for high-speed data transmission across an elec...
- Patent number 12,161,290
- Issue date Dec 10, 2024
- Intuitive Surgical Operations, Inc.
- Derek C. Liou
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wiring substrate
- Patent number 12,167,535
- Issue date Dec 10, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask arrangement for a component carrier
- Patent number 12,167,543
- Issue date Dec 10, 2024
- AT&S(Chongqing) Company Limited
- Ismadi Bin Ismail
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency antennas and waveguides for communication between i...
- Patent number 12,165,994
- Issue date Dec 10, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating graphene into the skin depth region of high speed commu...
- Patent number 12,160,948
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 12,150,240
- Issue date Nov 19, 2024
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Platforms including microelectronic packages therein coupled to a c...
- Patent number 12,150,271
- Issue date Nov 19, 2024
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase shifter including a dielectric substrate having a first part...
- Patent number 12,148,966
- Issue date Nov 19, 2024
- Outdoor Wireless Networks LLC
- Yan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising antenna module
- Patent number 12,142,815
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jaehoon Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biometric smart card having an apertured metal layer
- Patent number 12,136,008
- Issue date Nov 5, 2024
- IDEX Biometrics ASA
- Fred George Benkley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission device for suppressing glass fiber effect
- Patent number 12,133,323
- Issue date Oct 29, 2024
- Unimicron Technology Corp.
- Chin-Hsun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and operation method of electronic device for det...
- Patent number 12,130,325
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Myeongjae Hong
- G01 - MEASURING TESTING
Information Patent Grant
Insertable wireless communication device for a power tool
- Patent number 12,133,324
- Issue date Oct 29, 2024
- Milwaukee Electric Tool Corporation
- John B. Lienau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna assembly having a circuit board and at least one antenna ar...
- Patent number 12,123,902
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Andreas John
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and electronic device comprising same
- Patent number 12,119,564
- Issue date Oct 15, 2024
- LG Electronics Inc.
- Seungmin Woo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED MICROSTRIP TRACE
- Publication number 20250024586
- Publication date Jan 16, 2025
- Dell Products L.P.
- Sandor FARKAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CABLE DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20250024588
- Publication date Jan 16, 2025
- Yamaichi Electronics Co., Ltd.
- Takahiro SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wideband Millimeter Wave Via Transition
- Publication number 20250016923
- Publication date Jan 9, 2025
- Apple Inc.
- Chi V. Pham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY
- Publication number 20250016908
- Publication date Jan 9, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...
- Publication number 20250016919
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Motoki MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PERMITTIVITY RADIO FREQUENCY SUBSTRATE, ASSEMBLY OF SAME, AND M...
- Publication number 20250008640
- Publication date Jan 2, 2025
- ROGERS CORPORATION
- Trevor POLIDORE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-WIDE BAND RADIO FREQUENCY SYSTEM
- Publication number 20240430032
- Publication date Dec 26, 2024
- Battelle Memorial Institute
- Raphael Joseph Welsh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD...
- Publication number 20240422902
- Publication date Dec 19, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
- Publication number 20240404960
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Guan Huei SEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE ANTENNA ARRAY
- Publication number 20240405446
- Publication date Dec 5, 2024
- Taoglas Group Holdings Limited
- Jeffrey Keith Shamblin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Signal Transmission System
- Publication number 20240397612
- Publication date Nov 28, 2024
- ZTE Corporation
- Xindan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-EMBEDDED CIRCUIT BOARD
- Publication number 20240397605
- Publication date Nov 28, 2024
- The Boeing Company
- Kyle Avery Woolrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240387996
- Publication date Nov 21, 2024
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, AND BATTERY MANAGEMENT SYSTEM AND BATTERY PA...
- Publication number 20240388106
- Publication date Nov 21, 2024
- Samsung SDI Co., Ltd.
- Jin Cheol Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240389221
- Publication date Nov 21, 2024
- KYOCERA CORPORATION
- Satoshi KAWAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER
- Publication number 20240389222
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Eiji FUJIMORI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DE-SKEWING DIFFERENTIAL SIGNALS
- Publication number 20240380371
- Publication date Nov 14, 2024
- Dell Products L.P.
- BHYRAV M. MUTNURY
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE
- Publication number 20240373550
- Publication date Nov 7, 2024
- FUJIFILM CORPORATION
- Yasuyuki SASADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING ANTENNA
- Publication number 20240356202
- Publication date Oct 24, 2024
- LG ELECTRONICS INC.
- Woocheol CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Slots for an Antenna and Printed Circuit Board Interface
- Publication number 20240357732
- Publication date Oct 24, 2024
- Aptiv Technologies Limited
- Yuxiao He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eddy Current Mitigation for On-Chip Inductors
- Publication number 20240357734
- Publication date Oct 24, 2024
- Apple Inc.
- Behzad Biglarbegian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOMETRIC SMART CARD HAVING AN APERTURED METAL LAYER
- Publication number 20240354545
- Publication date Oct 24, 2024
- IDEX Biometrics ASA
- Fred George BENKLEY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Eddy Current Mitigation for On-Chip Inductors
- Publication number 20240357733
- Publication date Oct 24, 2024
- Apple Inc.
- Behzad Biglarbegian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240341034
- Publication date Oct 10, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE
- Publication number 20240324096
- Publication date Sep 26, 2024
- BLACK SESAME TECHNOLOGIES (CHONGQING) CO., LTD.
- Hai Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...
- Publication number 20240324095
- Publication date Sep 26, 2024
- Skyworks Solutions, Inc.
- Bhuvaneshwaran VIJAYAKUMAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

Dielectric details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radio frequency front-end structures

Circuit board

Apparatus for minimizing electromagnetic coupling between surface m...

Contact arrangement and electronic assembly

High-frequency circuit board and antenna module

Capacitive compensation for vertical interconnect accesses

Electronic device and manufacturing method thereof

High-frequency high-voltage waveguide device

Component carrier and method of manufacturing a component carrier

High frequency amplifier

High powered RF part for improved manufacturability

Printed circuit board (PCB) module comprising an embedded radio-fre...

PCB having edge antenna, and battery including PCB having edge antenna

Systems and methods for high-speed data transmission across an elec...

Wiring substrate

Solder mask arrangement for a component carrier

Radio frequency antennas and waveguides for communication between i...

Wiring board and method for manufacturing wiring board

Integrating graphene into the skin depth region of high speed commu...

Bend compensation for conductive traces on printed circuit boards

Platforms including microelectronic packages therein coupled to a c...

Phase shifter including a dielectric substrate having a first part...

Electronic device comprising antenna module

Resetting different pair skew of printed circuit board traces

Biometric smart card having an apertured metal layer

Transmission device for suppressing glass fiber effect

Electronic device and operation method of electronic device for det...

Insertable wireless communication device for a power tool

Antenna assembly having a circuit board and at least one antenna ar...

Antenna module and electronic device comprising same

Patents Applicationslast 30 patents

ENHANCED MICROSTRIP TRACE

CABLE DEVICE AND METHOD OF PRODUCING THE SAME

Wideband Millimeter Wave Via Transition

CARRIER SUBSTRATE, A METHOD, AND AN ELECTRONIC ASSEMBLY

MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...

LOW PERMITTIVITY RADIO FREQUENCY SUBSTRATE, ASSEMBLY OF SAME, AND M...

ULTRA-WIDE BAND RADIO FREQUENCY SYSTEM

DIELECTRIC SHEET, SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD...

RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS

MILLIMETER WAVE ANTENNA ARRAY

Printed Circuit Board and Signal Transmission System

MULTI-EMBEDDED CIRCUIT BOARD

ANTENNA MODULE AND ELECTRONIC DEVICE COMPRISING SAME

PRINTED CIRCUIT BOARD, AND BATTERY MANAGEMENT SYSTEM AND BATTERY PA...

CIRCUIT BOARD

RADIO FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER

DE-SKEWING DIFFERENTIAL SIGNALS

FLEXIBLE LAMINATE MATERIAL

WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

ELECTRONIC DEVICE HAVING ANTENNA

Isolation Slots for an Antenna and Printed Circuit Board Interface

Eddy Current Mitigation for On-Chip Inductors

BIOMETRIC SMART CARD HAVING AN APERTURED METAL LAYER

Eddy Current Mitigation for On-Chip Inductors

WIRING SUBSTRATE

HEAT SPREADER FOR MODIFIED EDGE COOLING

POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE

PACKAGING SUBSTRATES HAVING REDUCED DEFORMATION AND METHODS RELATED...

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...