Dielectric details

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CPC
H05K1/024

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/024Dielectric details

Industries

Patents Grantslast 30 patents

Information Patent Grant
Opto-electric hybrid board
- Patent number 12,366,715
- Issue date Jul 22, 2025
- Nitto Denko Corporation
- Tadao Okawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit fabrication method that includes reconfiguration of via con...
- Patent number 12,369,257
- Issue date Jul 22, 2025
- Innovium, Inc.
- Vittal Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,369,250
- Issue date Jul 22, 2025
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-planar antennas for portable storage devices
- Patent number 12,369,279
- Issue date Jul 22, 2025
- Western Digital Technologies, Inc.
- Aadesh Gupta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmission line embedded in a portion of a chassis of an electron...
- Patent number 12,366,899
- Issue date Jul 22, 2025
- Intel Corporation
- Santhosh Ap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transmitting data signals on separate layers of a memory module, an...
- Patent number 12,361,978
- Issue date Jul 15, 2025
- Lodestar Licensing Group LLC
- Yogesh Sharma
- G11 - INFORMATION STORAGE
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and power supply device comprising same
- Patent number 12,342,451
- Issue date Jun 24, 2025
- LG Innotek Co., Ltd
- Sung June Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module and communication device
- Patent number 12,336,089
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Yuji Takematsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module and communication device
- Patent number 12,336,086
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Takanori Uejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact thin film surface mountable coupler having wide-band perfor...
- Patent number 12,327,903
- Issue date Jun 10, 2025
- KYOCERA AVX Components Corporation
- Michael Marek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising antenna module and coaxial cable
- Patent number 12,324,090
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Seungjae Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit and signal transmission method
- Patent number 12,324,092
- Issue date Jun 3, 2025
- Realtek Semiconductor Corporation
- Li Chung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configurable radio transceiver and method thereof
- Patent number 12,323,179
- Issue date Jun 3, 2025
- Realtek Semiconductor Corp.
- Ahmed Kord
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component carrier for microwave applications with stack pieces inte...
- Patent number 12,324,091
- Issue date Jun 3, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solderable waveguide antenna
- Patent number 12,315,999
- Issue date May 27, 2025
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module and communication device
- Patent number 12,317,413
- Issue date May 27, 2025
- Murata Manufacturing Co., Ltd.
- Masateru Higashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High-frequency module and communication device
- Patent number 12,317,412
- Issue date May 27, 2025
- Murata Manufacturing Co., Ltd.
- Yoichi Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Common-mode filtering for converting differential signaling to sing...
- Patent number 12,317,414
- Issue date May 27, 2025
- MARVELL ASIA PTE. LTD.
- Shaowu Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Feeding circuit layout for 4 x 4 linear AoX arrays
- Patent number 12,316,007
- Issue date May 27, 2025
- Silicon Laboratories Inc.
- Ádám Süle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electrical circuitry in a quantum computing system
- Patent number 12,308,505
- Issue date May 20, 2025
- Rigetti & Co, LLC
- Tristan Ossama El Bouayadi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Module
- Patent number 12,309,913
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising antenna module with connector for coax...
- Patent number 12,301,300
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Kwangbok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed conductor and rectifier package for power transfer
- Patent number 12,294,223
- Issue date May 6, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yanghe Liu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pad and via pattern arrangement for differential signal shielding
- Patent number 12,295,094
- Issue date May 6, 2025
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,289,828
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure for insertion loss reduction in signal trans...
- Patent number 12,283,488
- Issue date Apr 22, 2025
- Yuan Ze University
- Cheng En Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inhomogeneous dielectric medium high-speed stripline trace system
- Patent number 12,284,751
- Issue date Apr 22, 2025
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIELECTRIC AND METHOD FOR PRODUCING SAME
- Publication number 20250230289
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS INCLUDING PLURALITY OF COILS
- Publication number 20250233460
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Taejun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPRINGLOADED RIVET FOR RADAR WAVEGUIDE PCBA INTERFACE
- Publication number 20250223992
- Publication date Jul 10, 2025
- GM Cruise Holdings LLC
- Mathias SATTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING LAYER WITH ROUGHNESS AND E...
- Publication number 20250220808
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Assembly and Electronic Device
- Publication number 20250220096
- Publication date Jul 3, 2025
- Honor Device Co., Ltd.
- Tianye Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRUCTURES FOR REDUCING CROSSTALK INSIDE A SHIELDED DEVICE
- Publication number 20250212315
- Publication date Jun 26, 2025
- Intel Corporation
- Lidar Glazer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20250212318
- Publication date Jun 26, 2025
- MURATA MANUFACTURING CO., LTD.
- Hisanori MURASE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS FOR MINIMIZING ELECTROMAGNETIC COUPLING BETWEEN SURFACE M...
- Publication number 20250202529
- Publication date Jun 19, 2025
- Skyworks Solutions, Inc.
- John C. Baldwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Module
- Publication number 20250203758
- Publication date Jun 19, 2025
- Nippon Telegraph and Telephone Corporation
- Josuke Ozaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250203759
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Nanami YUMURA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BEND COMPENSATION FOR MOLDED WAVEGUIDE ANTENNAS
- Publication number 20250189624
- Publication date Jun 12, 2025
- Aptiv Technologies AG
- Kevin MCREYNOLDS
- G01 - MEASURING TESTING
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20250193997
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES
- Publication number 20250193996
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Samuel R. Connor
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250193998
- Publication date Jun 12, 2025
- Innolux Corporation
- Ying-Jen Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Transmission Line Capacitor and Circuit Board Including the Same Em...
- Publication number 20250185154
- Publication date Jun 5, 2025
- KYOCRA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA PACKAGE INCLUDING A SUBSTRATE FOR SEMICONDUCTOR PACKAGING F...
- Publication number 20250183514
- Publication date Jun 5, 2025
- UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Jimin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...
- Publication number 20250185153
- Publication date Jun 5, 2025
- Nippon Telegraph and Telephone Corporation
- Masayuki Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250175203
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Takanori UEJIMA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MILLIWAVE RF DEVICE BASED ON FLEXIBLE AND DEFORMABLE MATERIALS WITH...
- Publication number 20250176097
- Publication date May 29, 2025
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Chi Ho KWOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCTION USING TRACE COUPLING IN INTEGRATED CIRCUIT COMP...
- Publication number 20250174569
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Gong OUYANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...
- Publication number 20250164568
- Publication date May 22, 2025
- Garrett Transportation I Inc.
- Jaroslav Pekar
- B60 - VEHICLES IN GENERAL
Information Patent Application
SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD F...
- Publication number 20250168969
- Publication date May 22, 2025
- Circuit Foil Luxembourg
- Roman MICHEZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250168970
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Daichi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250150061
- Publication date May 8, 2025
- Innolux Corporation
- Yan-Zheng Wu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD
- Publication number 20250142714
- Publication date May 1, 2025
- Dell Products L.P.
- Changsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER RADIO FREQUENCY COMPONENT
- Publication number 20250118881
- Publication date Apr 10, 2025
- Knowles Cazenovia, Inc.
- Jared P. Burdick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTACLE ASSEMBLY AND CIRCUIT BOARD
- Publication number 20250120007
- Publication date Apr 10, 2025
- Yamaichi Electronics Co., Ltd.
- Toshiyasu ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20250113433
- Publication date Apr 3, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB IMPEDANCE TUNING TO ACHIEVE WIDEBAND AND HIGH ACCEPTANCE OF COI...
- Publication number 20250108669
- Publication date Apr 3, 2025
- The Goodyear Tire and Rubber Company
- Cheng-Hsiung Lin
- B60 - VEHICLES IN GENERAL
Information Patent Application
WIRELESS EARBUD COMPRISING ANTENNA
- Publication number 20250112358
- Publication date Apr 3, 2025
- LG ELECTRONICS INC.
- Duckyun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Dielectric details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Opto-electric hybrid board

Circuit fabrication method that includes reconfiguration of via con...

Circuit board structure and manufacturing method thereof

Non-planar antennas for portable storage devices

Transmission line embedded in a portion of a chassis of an electron...

Transmitting data signals on separate layers of a memory module, an...

Reconstituted substrate structure and fabrication methods for heter...

Package component

Electronic component module and power supply device comprising same

Radio frequency module and communication device

High-frequency module and communication device

Compact thin film surface mountable coupler having wide-band perfor...

Electronic device comprising antenna module and coaxial cable

Integrated circuit and signal transmission method

Configurable radio transceiver and method thereof

Component carrier for microwave applications with stack pieces inte...

Solderable waveguide antenna

High-frequency module and communication device

High-frequency module and communication device

Common-mode filtering for converting differential signaling to sing...

Feeding circuit layout for 4 x 4 linear AoX arrays

Connecting electrical circuitry in a quantum computing system

Module

Electronic device comprising antenna module with connector for coax...

Printed conductor and rectifier package for power transfer

Pad and via pattern arrangement for differential signal shielding

Circuit board

Interconnect structure for insertion loss reduction in signal trans...

Semiconductor packages

Inhomogeneous dielectric medium high-speed stripline trace system

Patents Applicationslast 30 patents

DIELECTRIC AND METHOD FOR PRODUCING SAME

ELECTRONIC APPARATUS INCLUDING PLURALITY OF COILS

SPRINGLOADED RIVET FOR RADAR WAVEGUIDE PCBA INTERFACE

FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING LAYER WITH ROUGHNESS AND E...

Circuit Board Assembly and Electronic Device

STRUCTURES FOR REDUCING CROSSTALK INSIDE A SHIELDED DEVICE

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

APPARATUS FOR MINIMIZING ELECTROMAGNETIC COUPLING BETWEEN SURFACE M...

Optical Module

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

BEND COMPENSATION FOR MOLDED WAVEGUIDE ANTENNAS

MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

THERMALLY DECOUPLED SIGNAL TRANSMISSION LINES

ELECTRONIC DEVICE

Transmission Line Capacitor and Circuit Board Including the Same Em...

ANTENNA PACKAGE INCLUDING A SUBSTRATE FOR SEMICONDUCTOR PACKAGING F...

BGA Radio Frequency Module, Substrate for BGA Radio Frequency Modul...

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

MILLIWAVE RF DEVICE BASED ON FLEXIBLE AND DEFORMABLE MATERIALS WITH...

CROSSTALK REDUCTION USING TRACE COUPLING IN INTEGRATED CIRCUIT COMP...

METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...

SURFACE-TREATED COPPER FOIL FOR HIGH-FREQUENCY CIRCUIT AND METHOD F...

WIRING BOARD

ELECTRONIC DEVICE

MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD

MULTILAYER RADIO FREQUENCY COMPONENT

RECEPTACLE ASSEMBLY AND CIRCUIT BOARD

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

PCB IMPEDANCE TUNING TO ACHIEVE WIDEBAND AND HIGH ACCEPTANCE OF COI...

WIRELESS EARBUD COMPRISING ANTENNA