Differences in wettability

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CPC
H05K2203/1173

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1173Differences in wettability

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method for printing silver nanowire harness network structure by us...
- Patent number 12,053,995
- Issue date Aug 6, 2024
- XI'AN JIAOTONG UNIVERSITY
- Jianlei Cui
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method of multilayered board
- Patent number 11,503,707
- Issue date Nov 15, 2022
- UNIJET CO., LTD.
- Sung-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic devices comprising a via and methods of forming such ele...
- Patent number 11,284,521
- Issue date Mar 22, 2022
- 3M Innovative Properties, Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,255,018
- Issue date Feb 22, 2022
- KATEEVA, LTD.
- Nava Shpaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for a high temperature vacuum-safe solder resist...
- Patent number 11,135,669
- Issue date Oct 5, 2021
- Cree, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit forming method
- Patent number 11,006,529
- Issue date May 11, 2021
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 10,913,064
- Issue date Feb 9, 2021
- Abbott Laboratories
- Andrew Fischer
- G01 - MEASURING TESTING
Information Patent Grant
Structure, wiring board, substrate for wiring board, copper clad la...
- Patent number 10,912,193
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Hajime Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 10,806,035
- Issue date Oct 13, 2020
- Kateeva, Inc.
- Nava Shpaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,760,162
- Issue date Sep 1, 2020
- The Research Foundation for the State University of New York
- Siyuan Ma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent electrode and method for manufacturing same
- Patent number 10,750,613
- Issue date Aug 18, 2020
- Research & Business Foundation Sungkyunkwan University
- Hyoyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixing dimers for moisture resistant materials
- Patent number 10,743,421
- Issue date Aug 11, 2020
- Yang Yun
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Systems with low-friction matte flexible printed circuits
- Patent number 10,712,773
- Issue date Jul 14, 2020
- Apple Inc.
- Bryan W. Posner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite member and method of manufacturing the same, and aliphati...
- Patent number 10,634,996
- Issue date Apr 28, 2020
- Japan Advanced Institute of Science and Technology
- Satoshi Inoue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Patterned overcoat layer
- Patent number 10,492,305
- Issue date Nov 26, 2019
- 3M Innovative Properties Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 10,477,694
- Issue date Nov 12, 2019
- Dexerials Corporation
- Makiya Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless copper plating polydopamine nanoparticles
- Patent number 10,294,567
- Issue date May 21, 2019
- The Research Foundation for the State University of New York
- Siyuan Ma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trace design for bump-on-trace (BOT) assembly
- Patent number 10,269,759
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 10,136,521
- Issue date Nov 20, 2018
- Dexerials Corporation
- Makiya Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems with low-friction matte flexible printed circuits
- Patent number 10,120,411
- Issue date Nov 6, 2018
- Apple Inc.
- Bryan W. Posner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Carrier plate, device having the carrier plate and method for produ...
- Patent number 10,117,329
- Issue date Oct 30, 2018
- QUALCOMM Incorporated
- Sebastian Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for a high temperature vacuum-safe solder stop ut...
- Patent number 10,076,800
- Issue date Sep 18, 2018
- Cree Fayetteville, Inc.
- Jennifer Stabach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 10,076,042
- Issue date Sep 11, 2018
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting device and wiring board thereof
- Patent number 10,008,651
- Issue date Jun 26, 2018
- Nichia Corporation
- Masato Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure, semiconductor substrate structure,...
- Patent number 9,955,590
- Issue date Apr 24, 2018
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film of a touch panel and manufacturing method thereof
- Patent number 9,948,296
- Issue date Apr 17, 2018
- TPK Touch Solutions (Xiamen) Inc.
- Yuh-Wen Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electrical devices with solder dam
- Patent number 9,949,378
- Issue date Apr 17, 2018
- Presidio Components, Inc.
- Hung Van Trinh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME
- Publication number 20240260186
- Publication date Aug 1, 2024
- ams-OSRAM International GmbH
- Thomas KIPPES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240206068
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Yang LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE SLURRY, WATERPROOF PRESSING STRUCTURE, CIRCUIT MEMBRANE...
- Publication number 20230309243
- Publication date Sep 28, 2023
- LITE-ON TECHNOLOGY CORPORATION
- Jen-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20220136113
- Publication date May 5, 2022
- Kateeva, Inc.
- Nava Shpaisman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20210007225
- Publication date Jan 7, 2021
- Kateeva, Inc.
- Nava Shpaisman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...
- Publication number 20200214126
- Publication date Jul 2, 2020
- KABUSHIKI KAISHA TOSHIBA
- Hajime NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Trace Design for Bump-on-Trace (BOT) Assembly
- Publication number 20190252347
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20190159345
- Publication date May 23, 2019
- DEXERIALS CORPORATION
- Makiya ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT FORMING METHOD
- Publication number 20190150292
- Publication date May 16, 2019
- FUJl CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems With Low-Friction Matte Flexible Printed Circuits
- Publication number 20190041906
- Publication date Feb 7, 2019
- Apple Inc.
- Bryan W. Posner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PATTERNED OVERCOAT LAYER
- Publication number 20180160548
- Publication date Jun 7, 2018
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICES COMPRISING A VIA AND METHODS OF FORMING SUCH ELE...
- Publication number 20180139855
- Publication date May 17, 2018
- 3M Innovative Properties Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Devices and Methods for Solder Flow Control in Three-Dimensional Mi...
- Publication number 20170055348
- Publication date Feb 23, 2017
- Nuvotronics, Inc.
- David W. Sherrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20160183384
- Publication date Jun 23, 2016
- Presidio Components. Inc.
- Hung Van Trinh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DISPLAY DEVICE
- Publication number 20160007478
- Publication date Jan 7, 2016
- AU OPTRONICS CORPORATION
- Ching-Kun Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20150296623
- Publication date Oct 15, 2015
- Presidio Components, Inc.
- Hung Van Trinh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD...
- Publication number 20150289382
- Publication date Oct 8, 2015
- C. UYEMURA & CO., LTD
- Masaharu Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD OF FORMING CIRCUIT PATTERN
- Publication number 20140353016
- Publication date Dec 4, 2014
- TORAY ENGINEERING CO., LTD.
- Takashi Iwade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN FORMATION METHOD
- Publication number 20140342574
- Publication date Nov 20, 2014
- FUJIFILM CORPORATION
- Kimiaki MIYAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Ink Structure using Fluoropolymer Template
- Publication number 20140290513
- Publication date Oct 2, 2014
- Kurt Ulmer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHODS OF FORMING CONDUCTIVE PATTERNS USING INKJET PRINTING METHODS
- Publication number 20140138345
- Publication date May 22, 2014
- Jin-seok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING SOLDER RESIST AND SUBSTRATE FOR PACKAGE
- Publication number 20140054073
- Publication date Feb 27, 2014
- Samsung Electro-Mechannics Co., Ltd
- Chang Bo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling Printed Ink Line Widths using Fluoropolymer Templates
- Publication number 20130260536
- Publication date Oct 3, 2013
- Kurt ULMER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CONDUCTIVE FILM OF A TOUCH PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20130249839
- Publication date Sep 26, 2013
- TPK TOUCH SOLUTIONS (XIAMEN) INC.
- Yuh-Wen Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING METHOD
- Publication number 20130220688
- Publication date Aug 29, 2013
- NEC Corporation
- Masahiro Kubo
- G02 - OPTICS
Information Patent Application
PATTERN FORMATION METHOD
- Publication number 20130078389
- Publication date Mar 28, 2013
- Kei NARA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
TRANSPARENT CONDUCTIVE COATINGS FOR OPTOELECTRONIC AND ELECTRONIC D...
- Publication number 20120204950
- Publication date Aug 16, 2012
- Yissum Research Development Company of the Hebrew University of Jerusalem
- Shlomo Magdassi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Differences in wettability

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Droplet actuator fabrication apparatus, systems, and related methods

Method for printing silver nanowire harness network structure by us...

Methods for producing an etch resist pattern on a metallic surface

Manufacturing method of multilayered board

Fluororesin base material, printed wiring board, and circuit module

Electronic devices comprising a via and methods of forming such ele...

Methods for producing an etch resist pattern on a metallic surface

Method and device for a high temperature vacuum-safe solder resist...

Circuit forming method

Droplet actuator fabrication apparatus, systems, and related methods

Structure, wiring board, substrate for wiring board, copper clad la...

Methods for producing an etch resist pattern on a metallic surface

Electroless copper plating polydopamine nanoparticles

Transparent electrode and method for manufacturing same

Mixing dimers for moisture resistant materials

Systems with low-friction matte flexible printed circuits

Composite member and method of manufacturing the same, and aliphati...

Patterned overcoat layer

Wiring board manufacturing method and wiring board

Electroless copper plating polydopamine nanoparticles

Trace design for bump-on-trace (BOT) assembly

Wiring board and method for manufacturing the same

Systems with low-friction matte flexible printed circuits

Carrier plate, device having the carrier plate and method for produ...

Method and device for a high temperature vacuum-safe solder stop ut...

Devices and methods for solder flow control in three-dimensional mi...

Light emitting device and wiring board thereof

Redistribution layer structure, semiconductor substrate structure,...

Conductive film of a touch panel and manufacturing method thereof

Electrical devices with solder dam

Patents Applicationslast 30 patents

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

OPTOELECTRONIC ASSEMBLY AND METHOD FOR THE PRODUCTION OF SAME

PRINTED CIRCUIT BOARD

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

CONDUCTIVE SLURRY, WATERPROOF PRESSING STRUCTURE, CIRCUIT MEMBRANE...

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...

Trace Design for Bump-on-Trace (BOT) Assembly

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

CIRCUIT FORMING METHOD

Systems With Low-Friction Matte Flexible Printed Circuits

PATTERNED OVERCOAT LAYER

ELECTRONIC DEVICES COMPRISING A VIA AND METHODS OF FORMING SUCH ELE...

Devices and Methods for Solder Flow Control in Three-Dimensional Mi...

ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME

DISPLAY DEVICE

ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME

PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD...

CIRCUIT SUBSTRATE AND METHOD OF FORMING CIRCUIT PATTERN

PATTERN FORMATION METHOD

Printed Ink Structure using Fluoropolymer Template

METHODS OF FORMING CONDUCTIVE PATTERNS USING INKJET PRINTING METHODS

METHOD FOR FORMING SOLDER RESIST AND SUBSTRATE FOR PACKAGE

Controlling Printed Ink Line Widths using Fluoropolymer Templates

CONDUCTIVE FILM OF A TOUCH PANEL AND MANUFACTURING METHOD THEREOF

MOUNTING STRUCTURE AND MOUNTING METHOD

PATTERN FORMATION METHOD

TRANSPARENT CONDUCTIVE COATINGS FOR OPTOELECTRONIC AND ELECTRONIC D...