Different types of terminals for the same component

Industry

CPC
H05K2201/10659

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10659Different types of terminals for the same component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,474,165
- Issue date Oct 18, 2022
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable circuit board module system
- Patent number 11,297,715
- Issue date Apr 5, 2022
- PHYTEC Messtechnik GmbH
- Bodo Huber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,067,645
- Issue date Jul 20, 2021
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density multi-component packages
- Patent number 10,757,810
- Issue date Aug 25, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,721,822
- Issue date Jul 21, 2020
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
High density multi-component packages
- Patent number 10,681,814
- Issue date Jun 9, 2020
- KEMET Electronics Corporation
- John Bultitude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,314,175
- Issue date Jun 4, 2019
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal serial bus hybrid footprint design
- Patent number 9,326,380
- Issue date Apr 26, 2016
- Intel Corporation
- Kuan-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,131,615
- Issue date Sep 8, 2015
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 8,681,509
- Issue date Mar 25, 2014
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board, and car-mounted electric connection box containing t...
- Patent number 8,628,338
- Issue date Jan 14, 2014
- Sumitomo Wiring Systems, Ltd.
- Takashi Miyamoto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Liquid crystal display device
- Patent number 8,300,035
- Issue date Oct 30, 2012
- Hitachi Displays, Ltd.
- Kazuhiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dashboard indicator module formed by a motor and electrical connect...
- Patent number 8,294,561
- Issue date Oct 23, 2012
- Sonceboz Automative SA
- Martin Strahm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic relay
- Patent number 8,279,028
- Issue date Oct 2, 2012
- Fujitsu Component Limited
- Kenichi Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and electronic circuit-integrated motor device...
- Patent number 8,247,937
- Issue date Aug 21, 2012
- Denso Corporation
- Hideki Minato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated semiconductor outline package
- Patent number 8,169,069
- Issue date May 1, 2012
- Infineon Technologies AG
- Stanley Job Doraisamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical semiconductor device with flexible substrate
- Patent number 8,106,408
- Issue date Jan 31, 2012
- Opnext Japan, Inc.
- Takuma Ban
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including hybrid via structures
- Patent number 8,044,305
- Issue date Oct 25, 2011
- Intel Corporation
- Xingjian Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low profile inductors for high density circuit boards
- Patent number 8,040,212
- Issue date Oct 18, 2011
- Volterra Semiconductor Corporation
- Alexandr Ikriannikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High power light emitting diode
- Patent number 8,013,355
- Issue date Sep 6, 2011
- Everlight Electronics Co., Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,957,157
- Issue date Jun 7, 2011
- Kabushiki Kaisha Toshiba
- Yuuichi Koga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Choke module having improved terminal arrangement
- Patent number 7,940,154
- Issue date May 10, 2011
- Hon Hai Precision Ind. Co., Ltd.
- John Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector system
- Patent number 7,833,026
- Issue date Nov 16, 2010
- Tyco Electronics Corporation
- Chad William Morgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite interconnect
- Patent number 7,791,194
- Issue date Sep 7, 2010
- Oracle America, Inc.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board unit
- Patent number 7,787,257
- Issue date Aug 31, 2010
- Fujitsu Limited
- Kenji Fukuzono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector for mounting on circuit board
- Patent number 7,708,590
- Issue date May 4, 2010
- Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
- Zhan-Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect system without through-holes
- Patent number 7,652,381
- Issue date Jan 26, 2010
- Interconnect Portfolio LLC
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead plate-attached coin-type battery whose lead plate is attached...
- Patent number 7,625,666
- Issue date Dec 1, 2009
- Sanyo Electric Co. Ltd.
- Tomoyuki Shose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounted electrical components and method for mounting and r...
- Patent number 7,535,723
- Issue date May 19, 2009
- FCI Americas Technology, Inc.
- Yakov Belopolsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric junction box
- Patent number 7,387,516
- Issue date Jun 17, 2008
- Sumitomo Wiring Systems, Ltd.
- Tatsuya Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
- Publication number 20240147619
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jongwan SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STORAGE DEVICE INCLUDING CONFIGURABLE PRINTED CIRCUIT BOARD
- Publication number 20230284378
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Sun-Ki YUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package Comprising a Cavity with Exposed Contacts and...
- Publication number 20230093341
- Publication date Mar 23, 2023
- Infineon Technologies Austria AG
- Julian Treu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE CIRCUIT BOARD MODULE SYSTEM
- Publication number 20210307169
- Publication date Sep 30, 2021
- PHYTEC Messtechnik GmbH
- Bodo HUBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SENSOR COMPONENT AND ASSEMBLY
- Publication number 20210048489
- Publication date Feb 18, 2021
- Melexis Technologies SA
- Jian CHEN
- G01 - MEASURING TESTING
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNIVERSAL SERIAL BUS HYBRID FOOTPRINT DESIGN
- Publication number 20140182914
- Publication date Jul 3, 2014
- Kuan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140041920
- Publication date Feb 13, 2014
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Semiconductor Outline Package
- Publication number 20120162924
- Publication date Jun 28, 2012
- Infineon Technologies AG
- Stanley Job Doraisamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT BOARD AND A RELATED METHOD THEREOF
- Publication number 20120155044
- Publication date Jun 21, 2012
- GENERAL ELECTRIC COMPANY
- David Mulford Shaddock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS
- Publication number 20110266672
- Publication date Nov 3, 2011
- Jeffrey Scott Sylvester
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED BOARD, AND CAR-MOUNTED ELECTRIC CONNECTION BOX CONTAINING T...
- Publication number 20110201216
- Publication date Aug 18, 2011
- SUMITOMO WIRING SYSTEMS, LTD.
- Takashi Miyamoto
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS...
- Publication number 20110157855
- Publication date Jun 30, 2011
- General Dynamics Advanced Information Systems
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
INTEGRATED PASSIVE DEVICE ASSEMBLY
- Publication number 20110156203
- Publication date Jun 30, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Wook PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and methods of attaching hybrid vlsi chips to printed wir...
- Publication number 20110101075
- Publication date May 5, 2011
- General Dynamics Advanced Information Systems
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DASHBOARD INDICATOR MODULE FORMED BY A MOTOR AND ELECTRICAL CONNECT...
- Publication number 20110043345
- Publication date Feb 24, 2011
- SONCEBOZ AUTOMATIVE SA
- Martin Strahm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Profile Inductors For High Density Circuit Boards
- Publication number 20110018669
- Publication date Jan 27, 2011
- Alexandr Ikriannikov
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE...
- Publication number 20100327709
- Publication date Dec 30, 2010
- DENSO CORPORATION
- Hideki MINATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100220454
- Publication date Sep 2, 2010
- Kabushiki Kaisha Toshiba
- Yuuichi KOGA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHOKE MODULE HAVING IMPROVED TERMINAL ARRANGEMENT
- Publication number 20100134228
- Publication date Jun 3, 2010
- HON HAI Precision Industry CO., LTD.
- JOHN CHOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnect System without Through-Holes
- Publication number 20100127402
- Publication date May 27, 2010
- Interconnect Portfolio LLC
- Kevin P. Grundy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20100046185
- Publication date Feb 25, 2010
- Canon Kabushiki Kaisha
- Hideaki Hirasawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTROMAGNETIC RELAY
- Publication number 20100039196
- Publication date Feb 18, 2010
- FUJITSU COMPONENT LIMITED
- Kenichi YOKOYAMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE
- Publication number 20100006863
- Publication date Jan 14, 2010
- Opnext Japan, Inc.
- Takuma Ban
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Semiconductor Outline Package
- Publication number 20100007006
- Publication date Jan 14, 2010
- Stanley Job Doraisamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT/DIP TYPE CONNECTOR STRUCTURE HAVING AT LEAST THREE ROWS OF TERM...
- Publication number 20100003843
- Publication date Jan 7, 2010
- Harry YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE INTERCONNECT
- Publication number 20090256255
- Publication date Oct 15, 2009
- SUN MICROSYSTEMS, INC.
- Vadim Gektin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Crystal Display Device
- Publication number 20090251446
- Publication date Oct 8, 2009
- Kazuhiro Ogawa
- G02 - OPTICS
Information Patent Application
Apparatus and methods of attaching hybrid vlsi chips to printed wir...
- Publication number 20090250506
- Publication date Oct 8, 2009
- General Dynamics Advanced Information Systems
- Deepak K. Pai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD UNIT
- Publication number 20090196002
- Publication date Aug 6, 2009
- FUJITSU LIMITED
- Kenji Fukuzono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Different types of terminals for the same component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Magnetic sensor component and assembly

Solderable circuit board module system

Magnetic sensor component and assembly

High density multi-component packages

Electric connection structure and electric connection member

High density multi-component packages

Electric connection structure and electric connection member

Universal serial bus hybrid footprint design

Printed circuit board

Printed circuit board

Printed board, and car-mounted electric connection box containing t...

Liquid crystal display device

Dashboard indicator module formed by a motor and electrical connect...

Electromagnetic relay

Semiconductor module and electronic circuit-integrated motor device...

Integrated semiconductor outline package

Optical semiconductor device with flexible substrate

Circuit board including hybrid via structures

Low profile inductors for high density circuit boards

High power light emitting diode

Printed circuit board

Choke module having improved terminal arrangement

Electrical connector system

Composite interconnect

Printed wiring board unit

Electrical connector for mounting on circuit board

Interconnect system without through-holes

Lead plate-attached coin-type battery whose lead plate is attached...

Surface mounted electrical components and method for mounting and r...

Electric junction box

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

STORAGE DEVICE INCLUDING CONFIGURABLE PRINTED CIRCUIT BOARD

Semiconductor Package Comprising a Cavity with Exposed Contacts and...

SOLDERABLE CIRCUIT BOARD MODULE SYSTEM

MAGNETIC SENSOR COMPONENT AND ASSEMBLY

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

UNIVERSAL SERIAL BUS HYBRID FOOTPRINT DESIGN

PRINTED CIRCUIT BOARD

Integrated Semiconductor Outline Package

ELECTRONIC CIRCUIT BOARD AND A RELATED METHOD THEREOF

INTEGRATED-CIRCUIT ATTACHMENT STRUCTURE WITH SOLDER BALLS AND PINS

PRINTED BOARD, AND CAR-MOUNTED ELECTRIC CONNECTION BOX CONTAINING T...

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS...

INTEGRATED PASSIVE DEVICE ASSEMBLY

Apparatus and methods of attaching hybrid vlsi chips to printed wir...

DASHBOARD INDICATOR MODULE FORMED BY A MOTOR AND ELECTRICAL CONNECT...

Low Profile Inductors For High Density Circuit Boards

SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE...

PRINTED CIRCUIT BOARD

CHOKE MODULE HAVING IMPROVED TERMINAL ARRANGEMENT

Interconnect System without Through-Holes

PRINTED CIRCUIT BOARD

ELECTROMAGNETIC RELAY

OPTICAL SEMICONDUCTOR DEVICE

Integrated Semiconductor Outline Package

SMT/DIP TYPE CONNECTOR STRUCTURE HAVING AT LEAST THREE ROWS OF TERM...

COMPOSITE INTERCONNECT

Liquid Crystal Display Device

Apparatus and methods of attaching hybrid vlsi chips to printed wir...

PRINTED WIRING BOARD UNIT