Differential fluid pressure delaminating means

Industry

CPC
Y10T156/1928

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/1928Differential fluid pressure delaminating means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for peeling pressure-sensitive adhesive sheet
- Patent number 11,970,644
- Issue date Apr 30, 2024
- Nitto Denko Corporation
- Naofumi Kosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing carrier plate
- Patent number 11,222,808
- Issue date Jan 11, 2022
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Lining material peeling method
- Patent number 11,097,528
- Issue date Aug 24, 2021
- IHI Corporation
- Akira Sadaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Lining material peeling method
- Patent number 11,052,646
- Issue date Jul 6, 2021
- IHI Corporation
- Akira Sadaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Carrier plate removing method
- Patent number 10,933,618
- Issue date Mar 2, 2021
- Disco Corporation
- Katsuhiko Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Removal method of carrier plate
- Patent number 10,926,524
- Issue date Feb 23, 2021
- Disco Corporation
- Katsuhiko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling bar for peeling polarizing film from panel, peeling apparat...
- Patent number 10,870,267
- Issue date Dec 22, 2020
- LG Chem, Ltd.
- San Park
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and device for dismantling multilayer systems including at l...
- Patent number 10,507,597
- Issue date Dec 17, 2019
- Centre National de la Recherche Scientifique
- Cyril Aymonier
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Peeling apparatus
- Patent number 10,507,637
- Issue date Dec 17, 2019
- Disco Corporation
- Kazuyuki Hinohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separating device for bonded cine film and method therefor
- Patent number 10,444,630
- Issue date Oct 15, 2019
- Shaanxi Normal University
- Zhihui Jia
- F17 - STORING OF DISTRIBUTING GASES OR LIQUIDS
Information Patent Grant
Processing apparatus and processing method of stack
- Patent number 10,442,172
- Issue date Oct 15, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Kayo Kumakura
- G02 - OPTICS
Information Patent Grant
Method for mount tape die release system for thin die ejection
- Patent number 10,043,688
- Issue date Aug 7, 2018
- Micron Technology, Inc.
- Jeremy E. Minnich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
De-bonding and cleaning process and system
- Patent number 9,895,871
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate separation apparatus for stacked body
- Patent number 9,805,953
- Issue date Oct 31, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling apparatus and stack manufacturing apparatus
- Patent number 9,770,894
- Issue date Sep 26, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for forming separation starting point, stack manufacturing a...
- Patent number 9,764,488
- Issue date Sep 19, 2017
- Semiconductor Energy Laboratory Co., Ltd.
- Ryu Komatsu
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
De-bonding and cleaning process and system
- Patent number 9,662,872
- Issue date May 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Handling of epoxy resins
- Patent number 9,545,783
- Issue date Jan 17, 2017
- COEXPAIR
- Marc Gillard
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermoplastic coating and removal using bonding interface with cata...
- Patent number 9,481,160
- Issue date Nov 1, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
De-bonding and cleaning process and system
- Patent number 9,475,272
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detaching a product substrate off a carrier substrate
- Patent number 9,457,552
- Issue date Oct 4, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Peeling apparatus and stack manufacturing apparatus
- Patent number 9,427,949
- Issue date Aug 30, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Device for detaching a product substrate off a carrier substrate
- Patent number 9,381,729
- Issue date Jul 5, 2016
- EV Group GmbH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polarizing sheet removing tool and removing method
- Patent number 9,272,430
- Issue date Mar 1, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Minute convexo-concave pattern forming method and forming device, a...
- Patent number 9,272,462
- Issue date Mar 1, 2016
- FUJIFILM Corporation
- Shinichiro Okada
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Polarizing sheet removing tool and removing method
- Patent number 9,272,431
- Issue date Mar 1, 2016
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Tape for mass-sealing bottles and similar containers, and apparati...
- Patent number 8,616,258
- Issue date Dec 31, 2013
- Ribi Pack S.p.A.
- Leon Antoine Ribi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Thermoplastic coating and removal using bonding interface with cata...
- Patent number 8,580,337
- Issue date Nov 12, 2013
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- B32 - LAYERED PRODUCTS
Information Patent Grant
Debonding equipment and methods for debonding temporary bonded wafers
- Patent number 8,551,291
- Issue date Oct 8, 2013
- Suss Microtec Lithography, GmbH
- Gregory George
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Polarizing Sheet Removing Tool and Removing Method
- Publication number 20140144302
- Publication date May 29, 2014
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Yizhuang Zhuang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...
- Publication number 20140034247
- Publication date Feb 6, 2014
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele SJONG
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING APPARATUS AND METHOD OF ORGANIC LIGHT EMITTING DIODE...
- Publication number 20140004767
- Publication date Jan 2, 2014
- Jun NAMKUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...
- Publication number 20130276990
- Publication date Oct 24, 2013
- EV GROUP GMBH
- Friedrich Paul Lindner
- B32 - LAYERED PRODUCTS
Information Patent Application
HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS
- Publication number 20130255887
- Publication date Oct 3, 2013
- Corning Incorporated
- Michael Yoshiya Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINUTE CONVEXO-CONCAVE PATTERN FORMING METHOD AND FORMING DEVICE, A...
- Publication number 20130207309
- Publication date Aug 15, 2013
- FUJIFILM CORPORATION
- Shinichiro Okada
- B82 - NANO-TECHNOLOGY
Information Patent Application
DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...
- Publication number 20130025796
- Publication date Jan 31, 2013
- Jürgen Burggraf
- B32 - LAYERED PRODUCTS
Information Patent Application
Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair
- Publication number 20120247686
- Publication date Oct 4, 2012
- MEMC Electronic Materials, Inc.
- Anca Stefanescu
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS
- Publication number 20110253315
- Publication date Oct 20, 2011
- SUSS MICROTEC LITHOGRAPHY, GMBH
- GREGORY GEORGE
- B32 - LAYERED PRODUCTS
Information Patent Application
FILM REMOVING DEVICE AND FILM REMOVING METHOD
- Publication number 20110247659
- Publication date Oct 13, 2011
- TOKYO ELECTRON LIMITED
- Shigenori Kamei
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Tape for Mass-Sealing Bottles and Similar Containers, and Apparati...
- Publication number 20110210093
- Publication date Sep 1, 2011
- Leon Antoine Ribi
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE
- Publication number 20110146899
- Publication date Jun 23, 2011
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...
- Publication number 20110114260
- Publication date May 19, 2011
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele Sjong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRIC...
- Publication number 20110053466
- Publication date Mar 3, 2011
- ASAHI GLASS COMPANY, LIMITED
- Tomohiro HOSHINO
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS
- Publication number 20100104402
- Publication date Apr 29, 2010
- Michael Yoshiya Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape for mass-sealing bottles and similar containers, and apparati...
- Publication number 20090184085
- Publication date Jul 23, 2009
- Leon Antoine Ribi
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20090114348
- Publication date May 7, 2009
- Jae Seok HWANG
- G02 - OPTICS
Information Patent Application
METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TA...
- Publication number 20090072976
- Publication date Mar 19, 2009
- Mitsubishi Heavy Industries, Ltd.
- Nobukatsu NISHIDA
- B08 - CLEANING
Information Patent Application
METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TA...
- Publication number 20090066514
- Publication date Mar 12, 2009
- Mitsubishi Heavy Industries, Ltd.
- Nobukatsu NISHIDA
- B08 - CLEANING
Information Patent Application
Replacement of a lubricant layer bonded to a part of a gas turbine...
- Publication number 20090038739
- Publication date Feb 12, 2009
- United Technologies Corporation
- Brian K. Holland
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stripping Liquid for Use in Separating Paper From Plaster/Paper Lam...
- Publication number 20090032187
- Publication date Feb 5, 2009
- Shingo Hiranaka
- B32 - LAYERED PRODUCTS
Information Patent Application
RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE
- Publication number 20080230183
- Publication date Sep 25, 2008
- NITTO DENKO CORPORATION
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
THIN FILM REMOVING DEVICE AND THIN FILM REMOVING METHOD
- Publication number 20080105377
- Publication date May 8, 2008
- TOKYO ELECTRON LIMITED
- Shinji Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM REMOVING DEVICE AND FILM REMOVING METHOD
- Publication number 20080041523
- Publication date Feb 21, 2008
- TOKYO ELECTRON LIMITED
- Shigenori Kamei
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for joining adhesive tape to semiconductor wafer, method for...
- Publication number 20080023133
- Publication date Jan 31, 2008
- Nitto Denko Corporation
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORTING PLATE
- Publication number 20070151674
- Publication date Jul 5, 2007
- Tokyo Ohka Kogyo Co., Ltd.
- Atsushi Miyanari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR CUTTING AN ASSEMBLY
- Publication number 20070148915
- Publication date Jun 28, 2007
- S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES S.A.,
- Olivier Rayssac
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Supporting plate, apparatus, and method for stripping supporting plate
- Publication number 20070062644
- Publication date Mar 22, 2007
- Tokyo Ohka Kogyo Co., Ltd.
- Akihiko Nakamura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Releasing method and releasing apparatus of work having adhesive tape
- Publication number 20070034331
- Publication date Feb 15, 2007
- Nitto Denko Corporation
- Masayuki Yamamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for releasing adhered article
- Publication number 20060144515
- Publication date Jul 6, 2006
- Toshio Tada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Differential fluid pressure delaminating means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for peeling pressure-sensitive adhesive sheet

Carrier plate removing method

Method of removing carrier plate

Lining material peeling method

Lining material peeling method

Carrier plate removing method

Removal method of carrier plate

Peeling bar for peeling polarizing film from panel, peeling apparat...

Method and device for dismantling multilayer systems including at l...

Peeling apparatus

Separating device for bonded cine film and method therefor

Processing apparatus and processing method of stack

Method for mount tape die release system for thin die ejection

De-bonding and cleaning process and system

Substrate separation apparatus for stacked body

Peeling apparatus and stack manufacturing apparatus

Device for forming separation starting point, stack manufacturing a...

De-bonding and cleaning process and system

Handling of epoxy resins

Thermoplastic coating and removal using bonding interface with cata...

De-bonding and cleaning process and system

Method for detaching a product substrate off a carrier substrate

Peeling apparatus and stack manufacturing apparatus

Device for detaching a product substrate off a carrier substrate

Polarizing sheet removing tool and removing method

Minute convexo-concave pattern forming method and forming device, a...

Polarizing sheet removing tool and removing method

Tape for mass-sealing bottles and similar containers, and apparati...

Thermoplastic coating and removal using bonding interface with cata...

Debonding equipment and methods for debonding temporary bonded wafers

Patents Applicationslast 30 patents

Polarizing Sheet Removing Tool and Removing Method

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...

MANUFACTURING APPARATUS AND METHOD OF ORGANIC LIGHT EMITTING DIODE...

DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...

HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS

MINUTE CONVEXO-CONCAVE PATTERN FORMING METHOD AND FORMING DEVICE, A...

DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE OFF A CARRIER S...

Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair

DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS

FILM REMOVING DEVICE AND FILM REMOVING METHOD

Tape for Mass-Sealing Bottles and Similar Containers, and Apparati...

SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE

THERMOPLASTIC COATING AND REMOVAL USING BONDING INTERFACE WITH CATA...

GLASS SUBSTRATE SPACER SEPARATING SYSTEM AND GLASS SUBSTRATE FABRIC...

HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS

Tape for mass-sealing bottles and similar containers, and apparati...

SUBSTRATE BONDING APPARATUS

METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TA...

METHOD, SYSTEM, AND APPARATUS FOR DETACHING AND COLLECTING AN IC TA...

Replacement of a lubricant layer bonded to a part of a gas turbine...

Stripping Liquid for Use in Separating Paper From Plaster/Paper Lam...

RELEASING METHOD AND RELEASING APPARATUS OF WORK HAVING ADHESIVE TAPE

THIN FILM REMOVING DEVICE AND THIN FILM REMOVING METHOD

FILM REMOVING DEVICE AND FILM REMOVING METHOD

Method for joining adhesive tape to semiconductor wafer, method for...

SUBSTRATE SUPPORTING PLATE

DEVICE AND METHOD FOR CUTTING AN ASSEMBLY

Supporting plate, apparatus, and method for stripping supporting plate

Releasing method and releasing apparatus of work having adhesive tape

Method for releasing adhered article