Displaced conductors

Industry

CPC
H05K2201/0385

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0385Displaced conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flexible device including sliding interconnection structure
- Patent number 9,888,567
- Issue date Feb 6, 2018
- SK hynix Inc.
- Seung Yeop Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a tab pin with no tie bar
- Patent number 9,793,034
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Jong-hyun Seok
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic component
- Patent number 9,349,549
- Issue date May 24, 2016
- Novalia Ltd.
- Kate Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 9,241,410
- Issue date Jan 19, 2016
- Nitto Denko Corporation
- Saori Ishigaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board with thermo-conductive pillar
- Patent number 8,698,186
- Issue date Apr 15, 2014
- COFAN USA, Inc.
- Lac Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a collapsed filled via hole
- Patent number 7,178,233
- Issue date Feb 20, 2007
- Mitsui Mining & Smelting Co., Ltd.
- Toshiyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190306973
- Publication date Oct 3, 2019
- Fujitsu Limited
- Shunji Baba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR
- Publication number 20150373848
- Publication date Dec 24, 2015
- Samsung Electronics Co., Ltd.
- Jong-hyun SEOK
- G11 - INFORMATION STORAGE
Information Patent Application
Electronic Component
- Publication number 20130341173
- Publication date Dec 26, 2013
- NOVALIA LTD.
- Kate Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR
- Publication number 20130020606
- Publication date Jan 24, 2013
- Chang HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20130014976
- Publication date Jan 17, 2013
- Nitto Denko Corporation
- Saori ISHIGAKI
- G11 - INFORMATION STORAGE
Information Patent Application
CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080099922
- Publication date May 1, 2008
- Noriaki Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a printed wiring board-forming sheet and mult...
- Publication number 20040111882
- Publication date Jun 17, 2004
- Toshiyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Displaced conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flexible device including sliding interconnection structure

Semiconductor module having a tab pin with no tie bar

Electronic component

Wired circuit board and producing method thereof

Circuit board with thermo-conductive pillar

Process for producing a collapsed filled via hole

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR

Electronic Component

CIRCUIT BOARD WITH THERMO-CONDUCTIVE PILLAR

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Process for producing a printed wiring board-forming sheet and mult...