Dummy component, dummy PCB or template

Industry

CPC
H05K2201/10204

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10204Dummy component, dummy PCB or template

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 12,082,346
- Issue date Sep 3, 2024
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing display substrate and display substrate mot...
- Patent number 11,277,930
- Issue date Mar 15, 2022
- BOE Technology Group Co., Ltd.
- Zhongying Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overmolded electronic module with an integrated electromagnetic shi...
- Patent number 11,166,399
- Issue date Nov 2, 2021
- Skyworks Solutions, Inc.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper-respondent assembly with interconnect characteristic(s) obsc...
- Patent number 11,147,158
- Issue date Oct 12, 2021
- International Business Machines Corporation
- James A. Busby
- G01 - MEASURING TESTING
Information Patent Grant
Support part for a component of a secured electronic device
- Patent number 11,099,415
- Issue date Aug 24, 2021
- Marion Froment
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component carriers sandwiching a sacrificial structure and having p...
- Patent number 11,051,410
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and printed circuit board strip
- Patent number 11,039,536
- Issue date Jun 15, 2021
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit
- Patent number 10,701,810
- Issue date Jun 30, 2020
- Sivantos Pte. Ltd.
- Stefanie Beyfuss
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Tamper-respondent assembly with interconnect characteristic(s) obsc...
- Patent number 10,575,398
- Issue date Feb 25, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tamper-respondent assembly with interconnect characteristic(s) obsc...
- Patent number 10,568,202
- Issue date Feb 18, 2020
- International Business Machines Corporation
- James A. Busby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for EMI shielding structure
- Patent number 10,477,687
- Issue date Nov 12, 2019
- Samsung Electronics Co., Ltd.
- Il-ju Mun
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Circuit board including dummy electrode formed on substrate
- Patent number 10,470,298
- Issue date Nov 5, 2019
- Brother Kogyo Kabushiki Kaisha
- Shoko Ota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic module with an integrated electromagnetic shi...
- Patent number 10,349,568
- Issue date Jul 9, 2019
- Skyworks Solutions, Inc.
- Philip H. Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and printed circuit board for camera module
- Patent number 10,333,193
- Issue date Jun 25, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Hyun Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device and display device
- Patent number 10,299,371
- Issue date May 21, 2019
- Japan Display Inc.
- Atsuhiro Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency signal line and manufacturing method thereof
- Patent number 10,158,157
- Issue date Dec 18, 2018
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rollable display apparatus
- Patent number 10,135,018
- Issue date Nov 20, 2018
- Samsung Electronics Co., Ltd.
- Taean Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control module and method for producing an electronic co...
- Patent number 10,098,240
- Issue date Oct 9, 2018
- Robert Bosch GmbH
- Uwe Liskow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, display panel, and display device
- Patent number 9,995,977
- Issue date Jun 12, 2018
- SHARP KABUSHIKI KAISHA
- Masaki Nakayama
- G02 - OPTICS
Information Patent Grant
Support entering into the fabrication of an electronic device, corr...
- Patent number 9,980,374
- Issue date May 22, 2018
- INGENICO GROUP
- Stephane Pavageau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate, semiconductor module and method for manufa...
- Patent number 9,966,333
- Issue date May 8, 2018
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, semiconductor module and method for manufa...
- Patent number 9,812,387
- Issue date Nov 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency signal line and manufacturing method thereof
- Patent number 9,774,070
- Issue date Sep 26, 2017
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing substrate gap supporter
- Patent number 9,748,023
- Issue date Aug 29, 2017
- GNE TECH CO., LTD.
- Jae Ku Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Absorbing termination in an interconnect
- Patent number 9,750,129
- Issue date Aug 29, 2017
- Intel Corporation
- Shaowu Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing wiring substrate, and wiring substrate
- Patent number 9,699,916
- Issue date Jul 4, 2017
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier substrate
- Patent number 9,659,884
- Issue date May 23, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surge arrester for an electric machine
- Patent number 9,603,237
- Issue date Mar 21, 2017
- Robert Bosch GmbH
- Tobias Stiefel
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Component-embedded substrate and manufacturing method thereof
- Patent number 9,585,256
- Issue date Feb 28, 2017
- Murata Manufacturing Co., Ltd.
- Naoki Gouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Absorbing termination in an interconnect
- Patent number 9,485,854
- Issue date Nov 1, 2016
- Intel Corporation
- Shaowu Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...
- Publication number 20240292544
- Publication date Aug 29, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032208
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD AND OPER...
- Publication number 20240007551
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Bowoong SEO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD
- Publication number 20230300987
- Publication date Sep 21, 2023
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20210242269
- Publication date Aug 5, 2021
- Canon Kabushiki Kaisha
- Daisuke Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD STRIP
- Publication number 20210022250
- Publication date Jan 21, 2021
- LG Innotek Co., Ltd.
- Won Suk JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT PART FOR A COMPONENT OF A SECURED ELECTRONIC DEVICE
- Publication number 20200026115
- Publication date Jan 23, 2020
- Ingenico Group
- Marion Froment
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUMMY ELECTRONIC COMPONENT
- Publication number 20190373731
- Publication date Dec 5, 2019
- Hewlett-Packard Development Company, L.P.
- Tiffany L Greyson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...
- Publication number 20190037686
- Publication date Jan 31, 2019
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...
- Publication number 20190037687
- Publication date Jan 31, 2019
- International Business Machines Corporation
- James A. BUSBY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD INCLUDING DUMMY ELECTRODE FORMED ON SUBSTRATE
- Publication number 20180288869
- Publication date Oct 4, 2018
- BROTHER KOGYO KABUSHIKI KAISHA
- Shoko OTA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR MODULE AND METHOD FOR MANUFA...
- Publication number 20180033719
- Publication date Feb 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROLLABLE DISPLAY APPARATUS
- Publication number 20170373269
- Publication date Dec 28, 2017
- SAMSUNG DISPLAY CO., LTD.
- Taean Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, DISPLAY PANEL, AND DISPLAY DEVICE
- Publication number 20170131586
- Publication date May 11, 2017
- Sharp Kabushiki Kaisha
- Masaki NAKAYAMA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR MODULE AND METHOD FOR MANUFA...
- Publication number 20170077023
- Publication date Mar 16, 2017
- Advanced Semiconductor Engineering, Inc.
- Li-Chuan TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE
- Publication number 20170047295
- Publication date Feb 16, 2017
- Powertech Technology Inc.
- Yuan-Fu Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABSORBING TERMINATION IN AN INTERCONNECT
- Publication number 20170006698
- Publication date Jan 5, 2017
- Intel Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20160234929
- Publication date Aug 11, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Sung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE
- Publication number 20150334850
- Publication date Nov 19, 2015
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY COMPRISING THE SAME
- Publication number 20150289367
- Publication date Oct 8, 2015
- SAMSUNG DISPLAY CO., LTD.
- Rae Young KIM
- G02 - OPTICS
Information Patent Application
FAULT CONTAINMENT ROUTING
- Publication number 20150264801
- Publication date Sep 17, 2015
- Honeywell International Inc.
- Kenneth Lee Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate, Semiconductor Device, and Method of Manufacturing...
- Publication number 20150245473
- Publication date Aug 27, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-WIRE ELECTRODE STRUCTURE WITH SINGLE-LAYER DUMMY MICRO-WIRES
- Publication number 20150242010
- Publication date Aug 27, 2015
- Ronald Steven Cok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SURGE ARRESTER FOR AN ELECTRIC MACHINE
- Publication number 20150230332
- Publication date Aug 13, 2015
- ROBERT BOSCH GmbH
- Tobias Stiefel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20150228567
- Publication date Aug 13, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Job Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20150228706
- Publication date Aug 13, 2015
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- G02 - OPTICS
Information Patent Application
MICRO-WIRE ELECTRODES WITH DUMMY MICRO-DOTS
- Publication number 20150212613
- Publication date Jul 30, 2015
- William Yurich Fowlkes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT ON WIRIN...
- Publication number 20150144390
- Publication date May 28, 2015
- KYOCERA CIRCUIT SOLUTIONS, INC.
- Takayuki NEJIME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150145628
- Publication date May 28, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yu Sin KIM
- H01 - BASIC ELECTRIC ELEMENTS

Dummy component, dummy PCB or template

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Method of manufacturing display substrate and display substrate mot...

Overmolded electronic module with an integrated electromagnetic shi...

Tamper-respondent assembly with interconnect characteristic(s) obsc...

Support part for a component of a secured electronic device

Component carriers sandwiching a sacrificial structure and having p...

Printed circuit board and printed circuit board strip

Method for manufacturing a circuit

Tamper-respondent assembly with interconnect characteristic(s) obsc...

Tamper-respondent assembly with interconnect characteristic(s) obsc...

Manufacturing method for EMI shielding structure

Circuit board including dummy electrode formed on substrate

Overmolded electronic module with an integrated electromagnetic shi...

Printed circuit board and printed circuit board for camera module

Electronic device and display device

High-frequency signal line and manufacturing method thereof

Rollable display apparatus

Electronic control module and method for producing an electronic co...

Circuit board, display panel, and display device

Support entering into the fabrication of an electronic device, corr...

Semiconductor substrate, semiconductor module and method for manufa...

Semiconductor substrate, semiconductor module and method for manufa...

High-frequency signal line and manufacturing method thereof

Method for manufacturing substrate gap supporter

Absorbing termination in an interconnect

Method of manufacturing wiring substrate, and wiring substrate

Carrier substrate

Surge arrester for an electric machine

Component-embedded substrate and manufacturing method thereof

Absorbing termination in an interconnect

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARD AND OPER...

WIRING BOARD

IMAGE SENSOR PACKAGE

PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD STRIP

SUPPORT PART FOR A COMPONENT OF A SECURED ELECTRONIC DEVICE

DUMMY ELECTRONIC COMPONENT

TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...

TAMPER-RESPONDENT ASSEMBLY WITH INTERCONNECT CHARACTERISTIC(S) OBSC...

CIRCUIT BOARD INCLUDING DUMMY ELECTRODE FORMED ON SUBSTRATE

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR MODULE AND METHOD FOR MANUFA...

ROLLABLE DISPLAY APPARATUS

CIRCUIT BOARD, DISPLAY PANEL, AND DISPLAY DEVICE

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR MODULE AND METHOD FOR MANUFA...

CARRIER SUBSTRATE

ABSORBING TERMINATION IN AN INTERCONNECT

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE

BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY COMPRISING THE SAME

FAULT CONTAINMENT ROUTING

Wiring Substrate, Semiconductor Device, and Method of Manufacturing...

MICRO-WIRE ELECTRODE STRUCTURE WITH SINGLE-LAYER DUMMY MICRO-WIRES

SURGE ARRESTER FOR AN ELECTRIC MACHINE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE USING THE SAME

DISPLAY DEVICE

MICRO-WIRE ELECTRODES WITH DUMMY MICRO-DOTS

WIRING BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT ON WIRIN...

PRINTED CIRCUIT BOARD