during, before or after processing of insulating layers

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H01L21/0206

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0206during, before or after processing of insulating layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selective passivation and selective deposition
- Patent number 12,322,593
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Jan Willem Hub Maes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,324,193
- Issue date Jun 3, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshinobu Asami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage container storing treatment liquid for manufacturing semico...
- Patent number 12,313,976
- Issue date May 27, 2025
- FUJIFILM Corporation
- Tetsuya Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor silicon wafer
- Patent number 12,308,228
- Issue date May 20, 2025
- Globalwafers Japan Co., Ltd
- Takeshi Senda
- C30 - CRYSTAL GROWTH
Information Patent Grant
Deposition window enlargement
- Patent number 12,300,496
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide interlayer structure for NFET and PFET
- Patent number 12,300,739
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device pre-cleaning
- Patent number 12,300,542
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with devices having different top layer thickne...
- Patent number 12,302,637
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistant contact method and structure
- Patent number 12,300,729
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 12,300,539
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices
- Patent number 12,293,910
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,715
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching composition and method for selectively removing silicon nit...
- Patent number 12,281,251
- Issue date Apr 22, 2025
- VERSUM MATERIALS US, LLC
- Jhih Kuei Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,283,476
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,283,481
- Issue date Apr 22, 2025
- United Microelectronics Corp.
- Yu Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor device and method of forming the same
- Patent number 12,278,146
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,276,027
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Katsuhiro Morikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatment liquid and substrate treatment method
- Patent number 12,275,921
- Issue date Apr 15, 2025
- FUJIFILM Corporation
- Tomonori Takahashi
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Selective internal gate structure for ferroelectric semiconductor d...
- Patent number 12,278,287
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a barrier layer in an interconnect structure of s...
- Patent number 12,266,567
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jhih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with recessed silicon cap and method forming same
- Patent number 12,266,655
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch of a substrate
- Patent number 12,261,049
- Issue date Mar 25, 2025
- Applied Materials , Inc.
- David Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 12,255,062
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer line structure
- Patent number 12,255,145
- Issue date Mar 18, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating film forming method, coating film forming apparatus, and st...
- Patent number 12,240,012
- Issue date Mar 4, 2025
- Tokyo Electron Limited
- Yusaku Hashimoto
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,237,398
- Issue date Feb 25, 2025
- United Microelectronics Corp.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,237,342
- Issue date Feb 25, 2025
- Japan Display Inc.
- Akihiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selective removal of surface oxides on metal films
- Patent number 12,237,166
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Omid Zandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,230,509
- Issue date Feb 18, 2025
- United Microelectronics Corp.
- Ming Thai Chai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER SURFACE PASSIVATION COMPOSITION, USE THEREOF, AND PHOTORESIS...
- Publication number 20250180997
- Publication date Jun 5, 2025
- Zhejiang Aufirst Material Technology Co., Ltd.
- Jun HOU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE BOTTOM-UP FILL
- Publication number 20250183054
- Publication date Jun 5, 2025
- ASM IP HOLDING B.V.
- Guannan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL-COMPOUND-REMOVING SOLVENT AND METHOD IN LITHOGRAPHY
- Publication number 20250172879
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING SUBSTRATE USING BORON COMPOUND
- Publication number 20250174454
- Publication date May 29, 2025
- TES CO., LTD
- Hyeong-Wook MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD, AND SUBSTRATE PR...
- Publication number 20250174468
- Publication date May 29, 2025
- SEMES CO., LTD.
- Yong Hoon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250169140
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Chia-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors with Recessed Silicon Cap and Method Forming Same
- Publication number 20250169170
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING FILM FORMING METHOD, COATING FILM FORMING APPARATUS, AND ST...
- Publication number 20250161979
- Publication date May 22, 2025
- TOKYO ELECTRON LIMITED
- Yusaku HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BLOCKING OF METAL SURFACES USING N-HETEROCYCLIC CARBENES...
- Publication number 20250157855
- Publication date May 15, 2025
- Applied Materials, Inc.
- Bhaskar Jyoti Bhuyan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Selective metal Capping with Metal Halide enhancement
- Publication number 20250157824
- Publication date May 15, 2025
- Applied Materials, Inc.
- Shumao ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL BORON DOPING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND U...
- Publication number 20250149339
- Publication date May 8, 2025
- Beijing Superstring Academy of Memory Technology
- Jianfeng Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250149344
- Publication date May 8, 2025
- UNITED MICROELECTRONICS CORP.
- MING THAI CHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...
- Publication number 20250140548
- Publication date May 1, 2025
- Tokyo Ohka Kogyo Co., Ltd.
- Jun IIOKA
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...
- Publication number 20250140549
- Publication date May 1, 2025
- Tokyo Ohka Kogyo Co., Ltd.
- Jun IIOKA
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METAL OXIDE CONVERSION FOR MEOL AND BEOL APPLICATIONS
- Publication number 20250132146
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Mohammad Mahdi TAVAKOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURIZED IMPLANTABLE MEDICAL DEVICES AND ASSOCIATED FABRICATION...
- Publication number 20250133814
- Publication date Apr 24, 2025
- University of Florida Research Foundation, Incoprated
- Adam Khalifa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20250126883
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING COMPOSITIONS
- Publication number 20250101303
- Publication date Mar 27, 2025
- Fujifilm Electronic Materials U.S.A., Inc.
- Jieying Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...
- Publication number 20250084351
- Publication date Mar 13, 2025
- Tokyo Ohka Kogyo Co., Ltd.
- Jun IIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-REGION DIFFUSION BARRIER CONTAINING TITANIUM, SILICON AND NIT...
- Publication number 20250087534
- Publication date Mar 13, 2025
- EUGENUS, INC.
- Vinayak Veer Vats
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...
- Publication number 20250087631
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250089325
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250087578
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of Manufacture
- Publication number 20250079368
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20250079238
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
- Publication number 20250075363
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Kazuhito TSUJI
- B08 - CLEANING
Information Patent Application
METHODS FOR WET ATOMIC LAYER ETCHING OF MOLYBDENUM
- Publication number 20250079180
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Tulashi Dahal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS
- Publication number 20250069881
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Lin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT
- Publication number 20250062160
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE
- Publication number 20250054767
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

during, before or after processing of insulating layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective passivation and selective deposition

Semiconductor device and method for manufacturing the same

Storage container storing treatment liquid for manufacturing semico...

Manufacturing method for semiconductor silicon wafer

Deposition window enlargement

Metal oxide interlayer structure for NFET and PFET

Semiconductor device pre-cleaning

Semiconductor wafer with devices having different top layer thickne...

Low resistant contact method and structure

Source/drain contact formation methods and devices

Interconnect structure for semiconductor devices

Semiconductor device and manufacturing method thereof

Etching composition and method for selectively removing silicon nit...

Method of manufacturing semiconductor device, substrate processing...

Method for manufacturing semiconductor device

Fin field-effect transistor device and method of forming the same

Substrate processing apparatus and substrate processing method

Treatment liquid and substrate treatment method

Selective internal gate structure for ferroelectric semiconductor d...

Contact features of semiconductor device and method of forming same

Method of forming a barrier layer in an interconnect structure of s...

Transistors with recessed silicon cap and method forming same

Selective etch of a substrate

Integrate rinse module in hybrid bonding platform

Multi-layer line structure

Coating film forming method, coating film forming apparatus, and st...

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing semiconductor device

Methods for selective removal of surface oxides on metal films

Method for fabricating semiconductor device

Patents Applicationslast 30 patents

COPPER SURFACE PASSIVATION COMPOSITION, USE THEREOF, AND PHOTORESIS...

SELECTIVE BOTTOM-UP FILL

METAL-COMPOUND-REMOVING SOLVENT AND METHOD IN LITHOGRAPHY

METHOD FOR TREATING SUBSTRATE USING BORON COMPOUND

SUBSTRATE PROCESSING METHOD, MANUFACTURING METHOD, AND SUBSTRATE PR...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Transistors with Recessed Silicon Cap and Method Forming Same

COATING FILM FORMING METHOD, COATING FILM FORMING APPARATUS, AND ST...

SELECTIVE BLOCKING OF METAL SURFACES USING N-HETEROCYCLIC CARBENES...

Selective metal Capping with Metal Halide enhancement

CONFORMAL BORON DOPING METHOD FOR THREE-DIMENSIONAL STRUCTURE AND U...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...

METAL OXIDE CONVERSION FOR MEOL AND BEOL APPLICATIONS

MINIATURIZED IMPLANTABLE MEDICAL DEVICES AND ASSOCIATED FABRICATION...

Semiconductor Structure Cutting Process and Structures Formed Thereby

ETCHING COMPOSITIONS

PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FO...

MULTI-REGION DIFFUSION BARRIER CONTAINING TITANIUM, SILICON AND NIT...

SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Semiconductor Device Package and Method of Manufacture

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

PLATING APPARATUS AND SUBSTRATE CLEANING METHOD

METHODS FOR WET ATOMIC LAYER ETCHING OF MOLYBDENUM

METHOD FOR REDUCING CHARGING OF SEMICONDUCTOR WAFERS

METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT

SELECTIVE METAL CAPPING PROCESSES FOR A JUNCTION SILICIDE