Dynamic random access memory structures

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H01L27/108

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/108Dynamic random access memory structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,700,726
- Issue date Jul 11, 2023
- Samsung Electronics Co., Ltd.
- Jin Sub Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure, method of forming the same, semiconductor devi...
- Patent number 11,695,034
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Seongyul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method for manufacturing the same
- Patent number 11,688,779
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Hui-Jung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional dynamic random-access memory array
- Patent number 11,690,210
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Vladimir Machkaoutsan
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuitry, DRAM circuitry
- Patent number 11,683,927
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,678,478
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Youngjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,676,820
- Issue date Jun 13, 2023
- SK Hynix Inc.
- Oh-Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory systems with vertical integration
- Patent number 11,676,641
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,975
- Issue date Jun 13, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and DRAM device including the same
- Patent number 11,678,476
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Cheoljin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions, and semiconductor processing methods
- Patent number 11,678,477
- Issue date Jun 13, 2023
- Micron Technology, Inc.
- Mark Kiehlbauch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure oxide semiconductor vertical gate-all-around (VGAA)...
- Patent number 11,672,110
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,700
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Young-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,670,707
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having buried gate ele...
- Patent number 11,670,537
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Byung-jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,673
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyun-suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,670,344
- Issue date Jun 6, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Tomoaki Atsumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for manufacturing a plurality th...
- Patent number 11,672,111
- Issue date Jun 6, 2023
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing shorting between FinFET epitaxial regions
- Patent number 11,664,375
- Issue date May 30, 2023
- TESSERA LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having 2-transistor vertical memory cell and a common...
- Patent number 11,665,880
- Issue date May 30, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device
- Patent number 11,665,882
- Issue date May 30, 2023
- Kioxia Corporation
- Masaharu Wada
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure having a landing area extends from first po...
- Patent number 11,665,887
- Issue date May 30, 2023
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having spacer capping pattern disposed...
- Patent number 11,665,883
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Inkyoung Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making interconnect structure having ferroelectric capaci...
- Patent number 11,664,415
- Issue date May 30, 2023
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having improved electrical characteristics an...
- Patent number 11,658,117
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Taejin Park
- G11 - INFORMATION STORAGE
Information Patent Grant
Super CMOS devices on a microelectronics system
- Patent number 11,658,178
- Issue date May 23, 2023
- SCHOTTKY LSI, INC.
- Augustine Wei-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,659,702
- Issue date May 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies containing diffusion alleviating two-dimensio...
- Patent number 11,658,242
- Issue date May 23, 2023
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, semiconductor device, and electronic device
- Patent number 11,658,247
- Issue date May 23, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Takahiko Ishizu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, memory device, and electronic device
- Patent number 11,657,867
- Issue date May 23, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Tatsuya Onuki
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE
- Publication number 20240237326
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-FAN KUAN
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...
- Publication number 20240234482
- Publication date Jul 11, 2024
- Micron Technology, Inc.
- Sanket S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS
- Publication number 20240224504
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240206148
- Publication date Jun 20, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL WITH IMPROVED INSULATING STRUCTURE
- Publication number 20240206155
- Publication date Jun 20, 2024
- NANYA TECHNOLOGY CORPORATION
- Chung-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING ULTRA-LIGHTLY DOPED REGION
- Publication number 20240196595
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- Chung-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240196589
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240188277
- Publication date Jun 6, 2024
- WINBOND ELECTRONICS CORP.
- Shih-Han Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240186255
- Publication date Jun 6, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRUCTURE WITH FRONTSIDE AND BACKSIDE DRAMS
- Publication number 20240188282
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240188275
- Publication date Jun 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAM TRANSISTOR INCLUDING HORIZONAL BODY CONTACT
- Publication number 20240188279
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240179889
- Publication date May 30, 2024
- WINBOND ELECTRONICS CORP.
- Chien-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240179891
- Publication date May 30, 2024
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND FABRICATING METHOD THEREOF
- Publication number 20240178267
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Hsiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240172414
- Publication date May 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Jen-I LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical FinFet Formation Using Directional Deposition
- Publication number 20240172419
- Publication date May 23, 2024
- Applied Materials, Inc.
- Qintao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240164088
- Publication date May 16, 2024
- NANYA TECHNOLOGY CORPORATION
- YEN-HO CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, RELATED MEM...
- Publication number 20240164083
- Publication date May 16, 2024
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FET DRAM WITH BACKSIDE BITLINE
- Publication number 20240155826
- Publication date May 9, 2024
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240153873
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Yu-Hsin WU
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240147690
- Publication date May 2, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ASSISTANCE FEATURES AND METHOD FOR FABRIC...
- Publication number 20240147703
- Publication date May 2, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WORD LINE EMBEDDED IN GATE TRENCH
- Publication number 20240147699
- Publication date May 2, 2024
- Micron Technology, Inc.
- Toshiyasu Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...
- Publication number 20240136391
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Sanket S. Kelkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE
- Publication number 20240138138
- Publication date Apr 25, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-FAN KUAN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH PERIPHERAL GATE STRUCTURE AND METHOD FOR...
- Publication number 20240130102
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING 3D MEMORY STRUCTURE
- Publication number 20240121939
- Publication date Apr 11, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-FAN KUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM CONTACT FORMATION FOR 4F2 VERTICAL DRAM
- Publication number 20240121937
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS
- Publication number 20240114692
- Publication date Apr 4, 2024
- Intel Corporation
- Nazila Haratipour
- G11 - INFORMATION STORAGE

Dynamic random access memory structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Capacitor structure, method of forming the same, semiconductor devi...

Semiconductor memory device and method for manufacturing the same

Three-dimensional dynamic random-access memory array

Integrated circuitry, DRAM circuitry

Semiconductor devices

Semiconductor device and method for fabricating the same

Memory systems with vertical integration

Semiconductor device

Capacitor and DRAM device including the same

Semiconductor constructions, and semiconductor processing methods

Heterostructure oxide semiconductor vertical gate-all-around (VGAA)...

Semiconductor device

Integrated assemblies and methods of forming integrated assemblies

Method of manufacturing semiconductor device having buried gate ele...

Semiconductor device

Semiconductor device

Semiconductor structure and method for manufacturing a plurality th...

Minimizing shorting between FinFET epitaxial regions

Memory device having 2-transistor vertical memory cell and a common...

Semiconductor memory device

Semiconductor structure having a landing area extends from first po...

Semiconductor memory device having spacer capping pattern disposed...

Method of making interconnect structure having ferroelectric capaci...

Semiconductor devices having improved electrical characteristics an...

Super CMOS devices on a microelectronics system

Bonded semiconductor devices having processor and static random-acc...

Integrated assemblies containing diffusion alleviating two-dimensio...

Memory device, semiconductor device, and electronic device

Semiconductor device, memory device, and electronic device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE

MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...

DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS

MEMORY DEVICES AND METHODS FOR FORMING THE SAME

MEMORY CELL WITH IMPROVED INSULATING STRUCTURE

MEMORY DEVICE HAVING ULTRA-LIGHTLY DOPED REGION

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

STRUCTURE WITH FRONTSIDE AND BACKSIDE DRAMS

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

DRAM TRANSISTOR INCLUDING HORIZONAL BODY CONTACT

MEMORY DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CAPACITOR AND FABRICATING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Vertical FinFet Formation Using Directional Deposition

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, RELATED MEM...

FET DRAM WITH BACKSIDE BITLINE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH ASSISTANCE FEATURES AND METHOD FOR FABRIC...

SEMICONDUCTOR DEVICE HAVING WORD LINE EMBEDDED IN GATE TRENCH

MICROELECTRONIC DEVICES INCLUDING CAPACITORS, AND RELATED ELECTRONI...

SEMICONDUCTOR DEVICE INCLUDING MEMORY STRUCTURE

SEMICONDUCTOR DEVICE WITH PERIPHERAL GATE STRUCTURE AND METHOD FOR...

SEMICONDUCTOR DEVICE INCLUDING 3D MEMORY STRUCTURE

BOTTOM CONTACT FORMATION FOR 4F2 VERTICAL DRAM

INVERTED FERROELECTRIC AND ANTIFERROLECETRIC CAPACITORS