Edge treatment, chamfering

Industry

CPC
H01L21/02021

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02021Edge treatment, chamfering

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer and manufacturing method for SiC wafer
- Patent number 12,139,813
- Issue date Nov 12, 2024
- Toyota Tsusho Corporation
- Masatake Nagaya
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon carbide substrate
- Patent number 12,104,278
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Tsubasa Honke
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Processing method of wafer
- Patent number 12,106,966
- Issue date Oct 1, 2024
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked wafer structure and method for forming the same
- Patent number 12,080,544
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate
- Patent number 12,071,708
- Issue date Aug 27, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Indium phosphide substrate
- Patent number 12,065,759
- Issue date Aug 20, 2024
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Semiconductor wafer and semiconductor chip
- Patent number 12,046,514
- Issue date Jul 23, 2024
- Kioxia Corporation
- Mika Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate
- Patent number 12,031,233
- Issue date Jul 9, 2024
- Sumitomo Electric Industries, Ltd.
- Kyoko Okita
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and apparatus for treating substrate
- Patent number 11,972,939
- Issue date Apr 30, 2024
- Semes Co., Ltd.
- Ohyeol Kwon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Damage prevention during wafer edge trimming
- Patent number 11,951,569
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
- Patent number 11,901,171
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
As-sliced wafer processing method
- Patent number 11,878,387
- Issue date Jan 23, 2024
- Disco Corporation
- Satoshi Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-assisted method for parting crystalline material
- Patent number 11,826,846
- Issue date Nov 28, 2023
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indium phosphide substrate, semiconductor epitaxial wafer, and meth...
- Patent number 11,788,203
- Issue date Oct 17, 2023
- JX Metals Corporation
- Shunsuke Oka
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method and apparatus for manufacturing semiconductor device
- Patent number 11,735,411
- Issue date Aug 22, 2023
- OKAMOTO MACHINE TOOL WORKS, LTD.
- Eiichi Yamamoto
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer trimming device
- Patent number 11,705,323
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Jungseok Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and semiconductor chip
- Patent number 11,694,928
- Issue date Jul 4, 2023
- Kioxia Corporation
- Mika Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing epitaxy substrate
- Patent number 11,688,628
- Issue date Jun 27, 2023
- GlobalWafers Co., Ltd.
- Ying-Ru Shih
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer structure and trimming method thereof
- Patent number 11,682,551
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Ning Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for treating substrate
- Patent number 11,679,447
- Issue date Jun 20, 2023
- Semes Co., Ltd.
- Soo Young Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,621,170
- Issue date Apr 4, 2023
- Disco Corporation
- Karen Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Taiko wafer ring cut process method
- Patent number 11,551,923
- Issue date Jan 10, 2023
- PHOENIX SILICON INTERNATIONAL CORP.
- Chien-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing the remainder of a donor substrate, substrate...
- Patent number 11,542,155
- Issue date Jan 3, 2023
- Soitec
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chamfered silicon carbide substrate and method of chamfering
- Patent number 11,515,140
- Issue date Nov 29, 2022
- SICRYSTAL GMBH
- Bernhard Ecker
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for evaluating edge shape of silicon wafer, apparatus for ev...
- Patent number 11,486,833
- Issue date Nov 1, 2022
- Shin-Etsu Handotai Co., Ltd.
- Masahiro Sakurada
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing wafer
- Patent number 11,482,408
- Issue date Oct 25, 2022
- Disco Corporation
- Steve Latina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and trimming method thereof
- Patent number 11,456,169
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Ning Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system with eccentricity detection device and...
- Patent number 11,450,523
- Issue date Sep 20, 2022
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using a polishing system
- Patent number 11,358,252
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chi Lin
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250006484
- Publication date Jan 2, 2025
- Disco Corporation
- Akira MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240416450
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Kazuya HISANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240371625
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER
- Publication number 20240274431
- Publication date Aug 15, 2024
- Disco Corporation
- Kazuma Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
- Publication number 20240198455
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
- Publication number 20240165765
- Publication date May 23, 2024
- Shin-Etsu Handotai Co., Ltd.
- Ryo HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP
- Publication number 20240162031
- Publication date May 16, 2024
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Junji SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED WAFER PROCESSING METHOD
- Publication number 20240153776
- Publication date May 9, 2024
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20240136174
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240128087
- Publication date Apr 18, 2024
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS
- Publication number 20240112902
- Publication date Apr 4, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRIMMING METHOD
- Publication number 20240112928
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- An-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING EDGE OF SUBSTRATE IN SEMICONDUCTOR STRUCTURE
- Publication number 20230411141
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kenichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
- Publication number 20230392289
- Publication date Dec 7, 2023
- JX NIPPON MINING & METALS CORPORATION
- Kodai YAMAGISHI
- C30 - CRYSTAL GROWTH
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...
- Publication number 20230378274
- Publication date Nov 23, 2023
- JX NIPPON MINING & METALS CORPORATION
- Kodai YAMAGISHI
- C30 - CRYSTAL GROWTH
Information Patent Application
WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING
- Publication number 20230317445
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Xuefeng Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP
- Publication number 20230290685
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Mika FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SUPPLIER, PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEM...
- Publication number 20230253222
- Publication date Aug 10, 2023
- Kokusai Electric Corporation
- Kenta Kasamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20230207303
- Publication date Jun 29, 2023
- Semiconductor Manufacturing International (Beijing) Corporation
- Qingzhao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE
- Publication number 20230082020
- Publication date Mar 16, 2023
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- C30 - CRYSTAL GROWTH
Information Patent Application
CHAMFERED SILICON CARBIDE SUBSTRATE AND METHOD OF CHAMFERING
- Publication number 20230078982
- Publication date Mar 16, 2023
- SiCrystal GmbH
- Bernhard Ecker
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...
- Publication number 20230073003
- Publication date Mar 9, 2023
- SOITEC
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER STRUCTURE AND TRIMMING METHOD THEREOF
- Publication number 20220367172
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Ning Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE PREVENTION DURING WAFER EDGE TRIMMING
- Publication number 20220362887
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220344150
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...
- Publication number 20220316092
- Publication date Oct 6, 2022
- JX NIPPON MINING & METALS CORPORATION
- Shunsuke OKA
- C30 - CRYSTAL GROWTH
Information Patent Application
LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME
- Publication number 20220319835
- Publication date Oct 6, 2022
- GlobalWafers Japan Co., Ltd.
- Tatsuhiko AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAIKO WAFER RING CUT PROCESS METHOD
- Publication number 20220230869
- Publication date Jul 21, 2022
- Phoenix Silicon International Corp.
- CHIEN-HSIUNG HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Edge treatment, chamfering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated aligned stealth laser for wafer edge trimming process

SiC wafer and manufacturing method for SiC wafer

Silicon carbide substrate

Processing method of wafer

Stacked wafer structure and method for forming the same

Silicon carbide substrate

Indium phosphide substrate

Semiconductor wafer and semiconductor chip

Silicon carbide substrate

Method and apparatus for treating substrate

Damage prevention during wafer edge trimming

Integrated aligned stealth laser with blade and grinding apparatus...

As-sliced wafer processing method

Laser-assisted method for parting crystalline material

Indium phosphide substrate, semiconductor epitaxial wafer, and meth...

Method and apparatus for manufacturing semiconductor device

Wafer trimming device

Semiconductor wafer and semiconductor chip

Method of manufacturing epitaxy substrate

Wafer structure and trimming method thereof

Apparatus and method for treating substrate

Wafer processing method

Taiko wafer ring cut process method

Method for preparing the remainder of a donor substrate, substrate...

Chamfered silicon carbide substrate and method of chamfering

Method for evaluating edge shape of silicon wafer, apparatus for ev...

Method of processing wafer

Wafer structure and trimming method thereof

Substrate processing system with eccentricity detection device and...

Method of using a polishing system

Patents Applicationslast 30 patents

PROCESSING METHOD OF WAFER

PROCESSING METHOD AND PROCESSING SYSTEM

PROCESSING METHOD AND PROCESSING SYSTEM

STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME

WAFER, AND FRONT/BACK SURFACE DETERMINATION METHOD FOR WAFER

DAMAGE PREVENTION DURING WAFER EDGE TRIMMING

METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

METHOD OF PRODUCING GAAS WAFER, AND GAAS WAFER GROUP

BONDED WAFER PROCESSING METHOD

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

WAFER PROCESSING METHOD

PROCESSING METHOD OF BONDED WAFER AND PROCESSING APPARATUS

TRIMMING METHOD

METHOD FOR REMOVING EDGE OF SUBSTRATE IN SEMICONDUCTOR STRUCTURE

INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...

INDIUM PHOSPHIDE SUBSTRATE, METHOD FOR MANUFACTURING INDIUM PHOSPHI...

WAFER EDGE DEPOSITION FOR WAFER LEVEL PACKAGING

SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP

GAS SUPPLIER, PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEM...

SEMICONDUCTOR PACKAGING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

INDIUM PHOSPHIDE SUBSTRATE

CHAMFERED SILICON CARBIDE SUBSTRATE AND METHOD OF CHAMFERING

METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...

WAFER STRUCTURE AND TRIMMING METHOD THEREOF

DAMAGE PREVENTION DURING WAFER EDGE TRIMMING

STACKED WAFER STRUCTURE AND METHOD FOR FORMING THE SAME

INDIUM PHOSPHIDE SUBSTRATE, SEMICONDUCTOR EPITAXIAL WAFER, AND METH...

LAMINATION WAFERS AND METHOD OF PRODUCING BONDED WAFERS USING THE SAME

TAIKO WAFER RING CUT PROCESS METHOD