Electric field

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CPC
C23C18/1671

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CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating Contact plating

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C23C18/1671Electric field

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Patents Grantslast 30 patents

Information Patent Grant
Method for metal layer formation
- Patent number 11,746,421
- Issue date Sep 5, 2023
- ORELTECH LTD.
- Natalia Zamoshchik
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal-plated carbon material and manufacturing method thereof
- Patent number 11,268,194
- Issue date Mar 8, 2022
- Yazaki Corporation
- Yutaka Handa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method, bubble ejection member, plating apparatus, and device
- Patent number 11,242,610
- Issue date Feb 8, 2022
- Kyushu University, National University Corporation
- Yoko Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating method
- Patent number 10,287,688
- Issue date May 14, 2019
- Toyoda Gosei Co., Ltd.
- Takao Hiei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing core-shell catalyst
- Patent number 9,941,521
- Issue date Apr 10, 2018
- Toyota Jidosha Kabushiki Kaisha
- Noriyuki Kitao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a nickel-metal layer
- Patent number 9,631,282
- Issue date Apr 25, 2017
- Schauenburg Ruhrkunststoff GmbH
- Stefan Koppe
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High temperature resistant silver coated substrates
- Patent number 9,114,594
- Issue date Aug 25, 2015
- Rohm and Haas Electronic Materials LLC
- Wan Zhang-Beglinger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electroless plating apparatus, method of electroless plating, and m...
- Patent number 8,893,648
- Issue date Nov 25, 2014
- Nitto Denko Corporation
- Makoto Tsunekawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device manufacturing method, semiconductor manufactur...
- Patent number 8,242,026
- Issue date Aug 14, 2012
- Tokyo Electron Limited
- Sumie Nagaseki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal layer over a patterned dielectric by wet...
- Patent number 7,517,782
- Issue date Apr 14, 2009
- Advanced Micro Devices, Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, cartridge and copper dissolution tank for use in...
- Patent number 7,279,079
- Issue date Oct 9, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming on a metallic substrate a sulphur-free metallic...
- Patent number 7,160,582
- Issue date Jan 9, 2007
- Office National d'Etudes et de Recherches Aerospatiales
- Benoît Girard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seed layer deposition
- Patent number 6,824,665
- Issue date Nov 30, 2004
- Shipley Company, L.L.C.
- James G. Shelnut
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electric field initiated electroless metal deposition
- Patent number 5,660,706
- Issue date Aug 26, 1997
- Sematech, Inc.
- Bin Zhao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for detecting start of electroless plating
- Patent number 4,718,990
- Issue date Jan 12, 1988
- C. Uyemura & Co., Ltd.
- Shigeo Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of partially metallizing electrically conductive non-metalli...
- Patent number 4,478,690
- Issue date Oct 23, 1984
- U.S. Philips Corporation
- Eltjo Scholtens
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Passivation of metallic equipment surfaces in electroless copper de...
- Patent number 4,391,841
- Issue date Jul 5, 1983
- Kollmorgen Technologies Corporation
- Rudolph J. Zeblisky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process and device for the production of metal-complex compounds su...
- Patent number 4,208,255
- Issue date Jun 17, 1980
- Kollmorgen Technologies Corporation
- Fritz Stahl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
3558349
- Patent number 3,558,349
- Issue date Jan 26, 1971
- B60 - VEHICLES IN GENERAL
Information Patent Grant
3303111
- Patent number 3,303,111
- Issue date Feb 7, 1967
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR METAL LAYER FORMATION
- Publication number 20200017974
- Publication date Jan 16, 2020
- OrelTech Ltd.
- Natalia ZAMOSHCHIK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING METHOD
- Publication number 20160258066
- Publication date Sep 8, 2016
- Toyoda Gosei Co., Ltd.
- Takao HIEI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Single Solution for Electro-Electroless Deposition of Metals
- Publication number 20160177455
- Publication date Jun 23, 2016
- UNIVERSITY OF WINDSOR
- Mordechay SCHLESINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Composite Electroless Nickel Plating
- Publication number 20160010214
- Publication date Jan 14, 2016
- MACDERMID ACUMEN, INC.
- Boules H. Morcos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHT INDUCED NICKEL PLATING METHOD FOR P-TYPE SILICON AND N/P SOL...
- Publication number 20140110264
- Publication date Apr 24, 2014
- Atomic Energy Council-Institute of Nuclear Research
- Yu-Han Su
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Tribologically Loadable Mixed Noble Metal/Metal Layers
- Publication number 20140076798
- Publication date Mar 20, 2014
- Schauenburg Ruhrkunststoff GmbH
- Stefan Koppe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Depositing a Nickel-Metal Layer
- Publication number 20130202910
- Publication date Aug 8, 2013
- Stefan Koppe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES
- Publication number 20130196174
- Publication date Aug 1, 2013
- Rohm and Haas Electronic Materials L.L.C.
- Wan ZHANG-BEGLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLESS PLATING APPARATUS, METHOD OF ELECTROLESS PLATING, AND M...
- Publication number 20120251733
- Publication date Oct 4, 2012
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTUR...
- Publication number 20100003807
- Publication date Jan 7, 2010
- Tokyo Electron Limited
- Sumie Nagaseki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS
- Publication number 20080202922
- Publication date Aug 28, 2008
- Ting Zhong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODE CHEMICAL CONTROL SYSTEM AND METHOD
- Publication number 20080156650
- Publication date Jul 3, 2008
- Surfect Technologies, Inc.
- Solomon B. BASAME
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING APPARATUS, CARTRIDGE AND COPPER DISSOLUTION TANK FOR USE IN...
- Publication number 20070235341
- Publication date Oct 11, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET...
- Publication number 20070166982
- Publication date Jul 19, 2007
- Axel Preusse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for forming on a metal substrate a protective sulphur-free m...
- Publication number 20040241833
- Publication date Dec 2, 2004
- Benoit Girard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plating apparatus, cartridge and copper dissolution tank for use in...
- Publication number 20040069647
- Publication date Apr 15, 2004
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of depositing a catalytic layer
- Publication number 20030143837
- Publication date Jul 31, 2003
- APPLIED MATERIALS, INC.
- Srinivas Gandikota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Seed layer deposition
- Publication number 20020066671
- Publication date Jun 6, 2002
- Shipley Company, L.L.C.
- James G. Shelnut
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Electric field

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for metal layer formation

Metal-plated carbon material and manufacturing method thereof

Plating method, bubble ejection member, plating apparatus, and device

Plating method

Method for producing core-shell catalyst

Method for depositing a nickel-metal layer

High temperature resistant silver coated substrates

Electroless plating apparatus, method of electroless plating, and m...

Semiconductor device manufacturing method, semiconductor manufactur...

Method of forming a metal layer over a patterned dielectric by wet...

Plating apparatus, cartridge and copper dissolution tank for use in...

Method for forming on a metallic substrate a sulphur-free metallic...

Seed layer deposition

Electric field initiated electroless metal deposition

Method for detecting start of electroless plating

Method of partially metallizing electrically conductive non-metalli...

Passivation of metallic equipment surfaces in electroless copper de...

Process and device for the production of metal-complex compounds su...

3558349

3303111

Patents Applicationslast 30 patents

METHOD FOR METAL LAYER FORMATION

PLATING METHOD

Single Solution for Electro-Electroless Deposition of Metals

Composite Electroless Nickel Plating

LIGHT INDUCED NICKEL PLATING METHOD FOR P-TYPE SILICON AND N/P SOL...

Tribologically Loadable Mixed Noble Metal/Metal Layers

Method for Depositing a Nickel-Metal Layer

HIGH TEMPERATURE RESISTANT SILVER COATED SUBSTRATES

ELECTROLESS PLATING APPARATUS, METHOD OF ELECTROLESS PLATING, AND M...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR MANUFACTUR...

HYBRID ELECTRO-DEPOSITION OF SOFT MAGNETIC COBALT ALLOY FILMS

ELECTRODE CHEMICAL CONTROL SYSTEM AND METHOD

PLATING APPARATUS, CARTRIDGE AND COPPER DISSOLUTION TANK FOR USE IN...

METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET...

Method for forming on a metal substrate a protective sulphur-free m...

Plating apparatus, cartridge and copper dissolution tank for use in...

Method of depositing a catalytic layer

Seed layer deposition