Electric or magnetic shielding of printed inductances

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H01F2017/008

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HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

Current Industry

H01F2017/008Electric or magnetic shielding of printed inductances

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Inductor devices and stacked power supply topologies
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- Yihua Yang
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Information Patent Grant
Semiconductor device with inductor windings around a core above an...
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- Chien-Hsien Kuo
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Information Patent Grant
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Hexagonal semiconductor package structure
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- Tzu-Sung Huang
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- Kyle K. Kirby
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Embedded vertical inductor in laminate stacked substrates
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Information Patent Grant
Package structure and method of forming thereof
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Hexagonal semiconductor package structure
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Coil electronic component
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Conductor design for integrated magnetic devices
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Asymmetric spiral inductor
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- Su Bong Jang
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Semiconductor element
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Electronic substrates having embedded magnetic material using photo...
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Coil component
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Information Patent Grant
Electronic component
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Integrated vertical inductor
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Semiconductor element
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Information Patent Grant
Vertical inductor for WLCSP
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- Issue date Feb 15, 2022
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including shield electrodes
- Patent number 11,244,785
- Issue date Feb 8, 2022
- Murata Manufacturing Co., Ltd.
- Kunihiro Miyahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductors with compensated electromagnetic coupling
- Patent number 11,239,018
- Issue date Feb 1, 2022
- Marvell Asia Pte, Ltd.
- Marco Garampazzi
- H01 - BASIC ELECTRIC ELEMENTS

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COIL STRUCTURE AND METHOD OF MAKING SAME
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INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
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INDUCTOR AND METHOD OF FORMING THE SAME
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SEMICONDUCTOR DEVICE
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STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER
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EMI Magnetic Bead Inductor
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SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...
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STACKED SPIRAL INDUCTOR
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- CSMC TECHNOLOGIES FAB2 CO., LTD.
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MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE
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Hexagonal Semiconductor Package Structure
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INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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- Samsung Electronics Co., Ltd.
- Yukyung Park
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COUPLED INDUCTOR STRUCTURES UTILIZING MAGNETIC FILMS
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LAMINATED SHIELDING INDUCTOR
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INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES
- Publication number 20210082818
- Publication date Mar 18, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
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MULTILAYER ELECTRONIC COMPONENT
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- Publication date Nov 12, 2020
- TDK Corporation
- Shohei KUSUMOTO
- H03 - BASIC ELECTRONIC CIRCUITRY

Electric or magnetic shielding of printed inductances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inductor devices and stacked power supply topologies

Laminated shielding inductor

Semiconductor device with inductor windings around a core above an...

Stacked spiral inductor

Hexagonal semiconductor package structure

Vertical inductor for WLCSP

Inductors with through-substrate via cores

Embedded vertical inductor in laminate stacked substrates

Galvanic isolation of integrated closed magnetic path transformer w...

Coaxial magnetic inductors with pre-fabricated ferrite cores

Power amplifier module

Coil-incorporated multilayer substrate and method for manufacturing...

Package structure and method of forming thereof

Coupling inductors in an IC device using interconnecting elements w...

Integrated circuit with an embedded inductor or transformer

Hexagonal semiconductor package structure

Coil electronic component

Coupled inductor structures utilizing magnetic films

Conductor design for integrated magnetic devices

Asymmetric spiral inductor

Coil component

Semiconductor element

Electronic substrates having embedded magnetic material using photo...

Coil component

Electronic component

Integrated vertical inductor

Semiconductor element

Vertical inductor for WLCSP

Electronic component including shield electrodes

Inductors with compensated electromagnetic coupling

Patents Applicationslast 30 patents

INDUCTOR PERFORMANCE ENHANCEMENT USING AN OUTER, PERIPHERAL PATTERN...

INDUCTANCE ASSEMBLY AND INTEGRATED POWER CONVERTER MODULE

VOLTAGE-ISOLATED INTEGRATED CIRCUIT PACKAGES WITH PIN-COUPLED COILS

INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUT...

COIL STRUCTURE AND METHOD OF MAKING SAME

INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES

INDUCTOR AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

STACKED MAGNETIC COMPOUND MOLDED INTEGRATED ISOLATION TRANSFORMER

EMI Magnetic Bead Inductor

SEMICONDUCTOR DIE WITH PECULIAR BOND PAD ARRANGEMENT FOR LEVERAGING...

STACKED SPIRAL INDUCTOR

MULTILAYER-TYPE ON-CHIP INDUCTOR STRUCTURE

INTEGRATED INDUCTOR WITH INDUCTOR WIRE FORMED IN AN INTEGRATED CIRC...

INTEGRATED INDUCTOR INCLUDING MULTI-COMPONENT VIA LAYER INDUCTOR EL...

Hexagonal Semiconductor Package Structure

INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

COUPLED INDUCTOR STRUCTURES UTILIZING MAGNETIC FILMS

Asymmetric spiral inductor

INDUCTOR DEVICES AND STACKED POWER SUPPLY TOPOLOGIES

LAMINATED SHIELDING INDUCTOR

POWER AMPLIFIER MODULE

INDUCTORS WITH COMPENSATED ELECTROMAGNETIC COUPLING

COAXIAL MAGNETIC INDUCTORS WITH PRE-FABRICATED FERRITE CORES

INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES

INTEGRATED CIRCUIT WITH AN EMBEDDED INDUCTOR OR TRANSFORMER

MULTILAYER ELECTRONIC COMPONENT