Electroforming

Industry

CPC
H05K2203/0726

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0726Electroforming

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Solder paste stencil with aperture wall coating
- Patent number 12,069,810
- Issue date Aug 20, 2024
- SanDisk Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact arrangement for microfabricated ultrasonic trans...
- Patent number 11,672,179
- Issue date Jun 6, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Electrodeposited copper foil and copper clad laminate
- Patent number 11,492,718
- Issue date Nov 8, 2022
- Chang Chun Petrochemical Co., Ltd.
- Yao-Sheng Lai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil with minimized bagginess and tear, electrode comprising...
- Patent number 11,352,707
- Issue date Jun 7, 2022
- SK NEXILIS CO., LTD.
- Seung Min Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board pad resonance control system
- Patent number 10,779,404
- Issue date Sep 15, 2020
- Dell Products L.P.
- Vasa Mallikarjun Goud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact arrangement for microfabricated ultrasonic trans...
- Patent number 10,497,856
- Issue date Dec 3, 2019
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,332,756
- Issue date Jun 25, 2019
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 10,257,938
- Issue date Apr 9, 2019
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 10,178,775
- Issue date Jan 8, 2019
- JX Nippon Mining & Metals Corporation
- Yoshiyuki Miyoshi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metalization of flexible polymer sheets
- Patent number 10,131,998
- Issue date Nov 20, 2018
- Global Solar Energy, Inc.
- Scott Wiedeman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 9,955,583
- Issue date Apr 24, 2018
- JX Nippon Mining & Metals Corporation
- Masafumi Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of interposed substrate
- Patent number 9,859,130
- Issue date Jan 2, 2018
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 9,839,124
- Issue date Dec 5, 2017
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil structure having blackened ultra-thin foil and manufact...
- Patent number 9,258,900
- Issue date Feb 9, 2016
- Nan Ya Plastics Corporation
- Ming-Jen Tzou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil structure having blackened ultra-thin foil and manufact...
- Patent number 9,078,353
- Issue date Jul 7, 2015
- Nan Ya Plastics Corporation
- Ming-Jen Tzou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Interposed substrate and manufacturing method thereof
- Patent number 8,952,268
- Issue date Feb 10, 2015
- Unimicron Technology Corp.
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a package substrate
- Patent number 8,499,444
- Issue date Aug 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong An
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal plugged substrates with no adhesive between metal and polyimide
- Patent number 8,471,155
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Donald C Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,024,856
- Issue date Sep 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,918,018
- Issue date Apr 5, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate manufacturing method
- Patent number 7,716,826
- Issue date May 18, 2010
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a resilient contact
- Patent number 7,621,044
- Issue date Nov 24, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure of polymer-matrix conductive film and method for fabricat...
- Patent number 7,605,474
- Issue date Oct 20, 2009
- Industrial Technology Research Institute
- Ruoh Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of polymer-matrix conductive film and method for fabricat...
- Patent number 7,598,609
- Issue date Oct 6, 2009
- Industrial Technology Research Institute
- Ruoh Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating structure of polymer-matrix conductive film
- Patent number 7,526,861
- Issue date May 5, 2009
- Industrial Technology Research Institute
- Ruoh Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making noble metal conductive leads for suspension assem...
- Patent number 7,388,733
- Issue date Jun 17, 2008
- Hutchinson Technology Incorporated
- Kurt C. Swanson
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit substrate manufacturing method
- Patent number 7,222,421
- Issue date May 29, 2007
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making noble metal conductive leads for suspension assem...
- Patent number 7,142,395
- Issue date Nov 28, 2006
- Hutchinson Technology Incorporated
- Kurt C. Swanson
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing wiring substrate
- Patent number 7,093,356
- Issue date Aug 22, 2006
- Shinko Electric Industries Co., Ltd.
- Kei Imafuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20240292533
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...
- Publication number 20240122073
- Publication date Apr 11, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SOLDER PASTE STENCIL WITH APERTURE WALL COATING
- Publication number 20220159842
- Publication date May 19, 2022
- Western Digital Technologies, Inc.
- Fakhrozi Bin Che Ani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...
- Publication number 20200066966
- Publication date Feb 27, 2020
- Butterfly Network, Inc.
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
CIRCUIT BOARD PAD RESONANCE CONTROL SYSTEM
- Publication number 20190320529
- Publication date Oct 17, 2019
- Dell Products L.P.
- Vasa Mallikarjun Goud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALIZATION OF FLEXIBLE POLYMER SHEETS
- Publication number 20180355495
- Publication date Dec 13, 2018
- Global Solar Energy, Inc.
- Scott WIEDEMAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
- Publication number 20180235089
- Publication date Aug 16, 2018
- OLYMPUS CORPORATION
- Kazuaki KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20180223412
- Publication date Aug 9, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi MOGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20180063950
- Publication date Mar 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...
- Publication number 20170365774
- Publication date Dec 21, 2017
- Jonathan M. Rothberg
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20160183380
- Publication date Jun 23, 2016
- MASAFUMI ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20160157356
- Publication date Jun 2, 2016
- JX NIPPON MINING & METALS CORPORATION
- MICHIYA KOHIKI
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...
- Publication number 20140239475
- Publication date Aug 28, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACT...
- Publication number 20140141274
- Publication date May 22, 2014
- Nan Ya Plastics Corporation
- MING-JEN TZOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20130313011
- Publication date Nov 28, 2013
- Unimicron Technology Corp.
- Dyi-Chung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20130313004
- Publication date Nov 28, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20130256140
- Publication date Oct 3, 2013
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Plugged Substrates with No Adhesive Between Metal and Polyimide
- Publication number 20110147934
- Publication date Jun 23, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Fabricating Carrier Board Having No Conduction Line
- Publication number 20110061234
- Publication date Mar 17, 2011
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate and manufacturing method thereof
- Publication number 20090169837
- Publication date Jul 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Yong An
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed circuit board
- Publication number 20090083976
- Publication date Apr 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process of preparing copper foil for use in fine geometry circuit b...
- Publication number 20090057155
- Publication date Mar 5, 2009
- James F. Battey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal plugged substrates with no adhesive between metal and polyimide
- Publication number 20080307644
- Publication date Dec 18, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate manufacturing method
- Publication number 20070130762
- Publication date Jun 14, 2007
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING NOBLE METAL CONDUCTIVE LEADS FOR SUSPENSION ASSEM...
- Publication number 20070041123
- Publication date Feb 22, 2007
- Hutchinson Technology Incorporated
- Kurt C. Swanson
- G11 - INFORMATION STORAGE
Information Patent Application
Structure of polymer-matrix conductive film and method for fabricat...
- Publication number 20060249834
- Publication date Nov 9, 2006
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of polymer-matrix conductive film and method for fabricat...
- Publication number 20060243972
- Publication date Nov 2, 2006
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electroplating pcb components
- Publication number 20060175203
- Publication date Aug 10, 2006
- Micro Relay Holdings Pty Ltd.
- Timothy J. Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electroform spring built on mandrel transferable to other surface
- Publication number 20060085976
- Publication date Apr 27, 2006
- FormFactor, Inc.
- Benjamin N. Eldridge
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Electroforming

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder paste stencil with aperture wall coating

Electrical contact arrangement for microfabricated ultrasonic trans...

Electrodeposited copper foil and copper clad laminate

Copper foil with minimized bagginess and tear, electrode comprising...

Circuit board pad resonance control system

Electrical contact arrangement for microfabricated ultrasonic trans...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Roughened copper foil, copper clad laminate, and printed circuit board

Surface-treated copper foil, copper foil with carrier, substrate, r...

Copper foil provided with carrier, laminate, printed wiring board,...

Metalization of flexible polymer sheets

Surface-treated copper foil, copper foil with carrier, substrate, r...

Manufacturing method of interposed substrate

Copper foil provided with carrier, laminate, printed wiring board,...

Copper foil structure having blackened ultra-thin foil and manufact...

Copper foil structure having blackened ultra-thin foil and manufact...

Interposed substrate and manufacturing method thereof

Method of manufacturing a package substrate

Metal plugged substrates with no adhesive between metal and polyimide

Method for manufacturing printed circuit board

Method of fabricating a semiconductor device

Circuit substrate manufacturing method

Method of manufacturing a resilient contact

Structure of polymer-matrix conductive film and method for fabricat...

Structure of polymer-matrix conductive film and method for fabricat...

Method for fabricating structure of polymer-matrix conductive film

Method for making noble metal conductive leads for suspension assem...

Circuit substrate manufacturing method

Method for making noble metal conductive leads for suspension assem...

Method for producing wiring substrate

Patents Applicationslast 30 patents

WIRING BOARD

ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...

SOLDER PASTE STENCIL WITH APERTURE WALL COATING

ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...

CIRCUIT BOARD PAD RESONANCE CONTROL SYSTEM

METALIZATION OF FLEXIBLE POLYMER SHEETS

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD

ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

ELECTRICAL CONTACT ARRANGEMENT FOR MICROFABRICATED ULTRASONIC TRANS...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...

COPPER FOIL STRUCTURE HAVING BLACKENED ULTRA-THIN FOIL AND MANUFACT...

INTERPOSED SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE

ELECTROLYTIC COPPER FOIL

Metal Plugged Substrates with No Adhesive Between Metal and Polyimide

Method For Fabricating Carrier Board Having No Conduction Line

Package substrate and manufacturing method thereof

Method for manufacturing printed circuit board

Process of preparing copper foil for use in fine geometry circuit b...

Metal plugged substrates with no adhesive between metal and polyimide

Circuit substrate manufacturing method

METHOD FOR MAKING NOBLE METAL CONDUCTIVE LEADS FOR SUSPENSION ASSEM...

Structure of polymer-matrix conductive film and method for fabricat...

Structure of polymer-matrix conductive film and method for fabricat...

Electroplating pcb components

Electroform spring built on mandrel transferable to other surface