Electrolytic coating of circuit board or printed circuit, other than selected area coating

Industry

CPC
Y10S205/92

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S205/00Electrolysis: processes, compositions used therein, and methods of preparing the compositions

Current Industry

Y10S205/92Electrolytic coating of circuit board or printed circuit, other than selected area coating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Production method and device of surface roughened copper plate, and...
- Patent number 9,758,890
- Issue date Sep 12, 2017
- Furukawa Electric Co., Ltd.
- Hajime Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing a surface roughened copper plate
- Patent number 8,815,072
- Issue date Aug 26, 2014
- Furukawa Electric Co., Ltd.
- Hajime Watanabe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation of vertical devices by electroplating
- Patent number 8,247,905
- Issue date Aug 21, 2012
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Grant
Electroplating cell with hydrodynamics facilitating more uniform de...
- Patent number 8,226,804
- Issue date Jul 24, 2012
- The United States of America as represented by the Secretary of the Air Force
- Lawrence E. Gebhart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,024,856
- Issue date Sep 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of operating an electroplating cell with hydrodynamics facil...
- Patent number 7,947,161
- Issue date May 24, 2011
- Faraday Technology, Inc.
- Lawrence E. Gebhart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of vertical devices by electroplating
- Patent number 7,608,538
- Issue date Oct 27, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor having a substantially uniform layer of electroplated...
- Patent number 7,405,007
- Issue date Jul 29, 2008
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package substrate with plated...
- Patent number 7,041,591
- Issue date May 9, 2006
- Phoenix Precision Technology Corporation
- Pei-Ching Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for electroplating metal onto a layer of low conductivity m...
- Patent number 7,001,492
- Issue date Feb 21, 2006
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential electrodeposition of metals using modulated electric fie...
- Patent number 6,863,793
- Issue date Mar 8, 2005
- Faraday Technology Marketing Group, LLC
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Platable engineered polyolefin alloys and articles containing same
- Patent number 6,824,889
- Issue date Nov 30, 2004
- Solvay Engineered Polymers, Inc.
- Scott Matteucci
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of direct electroplating on a low conductivity material, and...
- Patent number 6,723,219
- Issue date Apr 20, 2004
- Micron Technology, Inc.
- Dale W. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-sensitive lithographic printing plate precursor
- Patent number 6,637,334
- Issue date Oct 28, 2003
- Fuji Photo Film Co., Ltd.
- Keiji Akiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Support circuit with a tapered through-hole for a semiconductor chi...
- Patent number 6,627,824
- Issue date Sep 30, 2003
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming magnetic layer pattern and method of manufacturin...
- Patent number 6,605,196
- Issue date Aug 12, 2003
- TDK Corporation
- Yoshitaka Sasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of electroplating a nickel-iron alloy film with a graduated...
- Patent number 6,599,411
- Issue date Jul 29, 2003
- Hitachi Global Storage Technologies Netherlands, B.V.
- Thomas Edward Dinan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sequential build circuit board plating process
- Patent number 6,582,581
- Issue date Jun 24, 2003
- Shipley Company, L.L.C.
- Robert L. Goldberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposition of metals in small recesses using modulated elect...
- Patent number 6,524,461
- Issue date Feb 25, 2003
- Faraday Technology Marketing Group, LLC
- E. Jennings Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin, electronic module using conductive resin, and met...
- Patent number 6,510,059
- Issue date Jan 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Mitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Platable engineered polyolefin alloys
- Patent number 6,509,107
- Issue date Jan 21, 2003
- Solvay Engineered Polymers
- Ruidong Ding
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat sensitive printing plate precursors
- Patent number 6,487,969
- Issue date Dec 3, 2002
- Agfa-Gevaert
- Tu Vinh Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Platable engineered polyolefin alloys
- Patent number 6,413,652
- Issue date Jul 2, 2002
- Solvay Engineered Polymers
- Ruidong Ding
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Programmed pulse electroplating process
- Patent number 6,402,924
- Issue date Jun 11, 2002
- Shipley Company LLC
- James L. Martin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making a support circuit for a semiconductor chip assembly
- Patent number 6,402,970
- Issue date Jun 11, 2002
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the electrolytic processing especially of flat items an...
- Patent number 6,395,163
- Issue date May 28, 2002
- Atotech Deutschland GmbH
- Reinhard Schneider
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bismuth thin films structure and method of construction
- Patent number 6,358,392
- Issue date Mar 19, 2002
- The Johns Hopkins University
- Fengyuan Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making a support circuit with a tapered through-hole for...
- Patent number 6,350,386
- Issue date Feb 26, 2002
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sequential electrodeposition of metals using modulated electric fie...
- Patent number 6,309,528
- Issue date Oct 30, 2001
- Faraday Technology Marketing Group, LLC
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method
- Patent number 6,261,435
- Issue date Jul 17, 2001
- Nihon Techno Kabushiki Kaisha
- Ryushin Omasa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
- Publication number 20140339094
- Publication date Nov 20, 2014
- Hajime WATANABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...
- Publication number 20110209991
- Publication date Sep 1, 2011
- Lawrence E. Gebhart
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
- Publication number 20100304176
- Publication date Dec 2, 2010
- Hajime Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
- Publication number 20090294989
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Application
Method for manufacturing printed circuit board
- Publication number 20090083976
- Publication date Apr 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
- Publication number 20080166874
- Publication date Jul 10, 2008
- International Business Machines Corporation
- Hariklia Deligianni
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...
- Publication number 20080035475
- Publication date Feb 14, 2008
- FARADAY TECHNOLOGY, INC.
- Lawrence E. Gebhart
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Platable engineered polyolefin alloys and articles containing same
- Publication number 20040005473
- Publication date Jan 8, 2004
- Scott Matteucci
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of direct electroplating on a low conductivity material, and...
- Publication number 20030183527
- Publication date Oct 2, 2003
- Dale W. Collins
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of direct electroplating on a low conductivity material, and...
- Publication number 20030183528
- Publication date Oct 2, 2003
- Dale W. Collins
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of direct electroplating on a low conductivity material, and...
- Publication number 20030038036
- Publication date Feb 27, 2003
- Dale W. Collins
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive resin, electronic module using conductive resin, and met...
- Publication number 20020185306
- Publication date Dec 12, 2002
- Tsutomu Mitani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of electroplating a nickel-iron alloy film with a graduated...
- Publication number 20020153255
- Publication date Oct 24, 2002
- Thomas Edward Dinan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrodeposition of metals in small recesses using modulated elect...
- Publication number 20020056645
- Publication date May 16, 2002
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sequential electrodeposition of metals using modulated electric fie...
- Publication number 20020038764
- Publication date Apr 4, 2002
- E. Jennings Taylor
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Heat-sensitive lithographic printing plate precursor
- Publication number 20020033108
- Publication date Mar 21, 2002
- Keiji Akiyama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Platable engineered polyolefin alloys
- Publication number 20020023845
- Publication date Feb 28, 2002
- Ruidong Ding
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming magnetic layer pattern and method of manufacturin...
- Publication number 20010035357
- Publication date Nov 1, 2001
- TDK CORPORATION
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sensitive printing plate precursors
- Publication number 20010018877
- Publication date Sep 6, 2001
- Tu Vinh Chau
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Electrolytic coating of circuit board or printed circuit, other than selected area coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Production method and device of surface roughened copper plate, and...

Method for producing a surface roughened copper plate

Formation of vertical devices by electroplating

Electroplating cell with hydrodynamics facilitating more uniform de...

Method for manufacturing printed circuit board

Method of operating an electroplating cell with hydrodynamics facil...

Formation of vertical devices by electroplating

Semiconductor having a substantially uniform layer of electroplated...

Method for fabricating semiconductor package substrate with plated...

Systems for electroplating metal onto a layer of low conductivity m...

Sequential electrodeposition of metals using modulated electric fie...

Platable engineered polyolefin alloys and articles containing same

Method of direct electroplating on a low conductivity material, and...

Heat-sensitive lithographic printing plate precursor

Support circuit with a tapered through-hole for a semiconductor chi...

Method of forming magnetic layer pattern and method of manufacturin...

Method of electroplating a nickel-iron alloy film with a graduated...

Sequential build circuit board plating process

Electrodeposition of metals in small recesses using modulated elect...

Conductive resin, electronic module using conductive resin, and met...

Platable engineered polyolefin alloys

Heat sensitive printing plate precursors

Platable engineered polyolefin alloys

Programmed pulse electroplating process

Method of making a support circuit for a semiconductor chip assembly

Process for the electrolytic processing especially of flat items an...

Bismuth thin films structure and method of construction

Method of making a support circuit with a tapered through-hole for...

Sequential electrodeposition of metals using modulated electric fie...

Plating method

Patents Applicationslast 30 patents

PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...

ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...

PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...

FORMATION OF VERTICAL DEVICES BY ELECTROPLATING

Method for manufacturing printed circuit board

FORMATION OF VERTICAL DEVICES BY ELECTROPLATING

ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DE...

Platable engineered polyolefin alloys and articles containing same

Method of direct electroplating on a low conductivity material, and...

Method of direct electroplating on a low conductivity material, and...

Method of direct electroplating on a low conductivity material, and...

Conductive resin, electronic module using conductive resin, and met...

Method of electroplating a nickel-iron alloy film with a graduated...

Electrodeposition of metals in small recesses using modulated elect...

Sequential electrodeposition of metals using modulated electric fie...

Heat-sensitive lithographic printing plate precursor

Platable engineered polyolefin alloys

Method of forming magnetic layer pattern and method of manufacturin...

Heat sensitive printing plate precursors