Electromagnetic band-gap structures

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H05K1/0236

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0236Electromagnetic band-gap structures

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Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic interference shielding enclosure with thermal condu...
- Patent number 12,167,530
- Issue date Dec 10, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-wideband electromagnetic band gap (EBG) structure and circuit...
- Patent number 12,095,135
- Issue date Sep 17, 2024
- ANHUI UNIVERSITY
- Xingang Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF filter device for aircraft nacelle access door gap
- Patent number 12,016,164
- Issue date Jun 18, 2024
- The Boeing Company
- Kyu-Pyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic band gap element structure and fabrication methods
- Patent number 11,937,380
- Issue date Mar 19, 2024
- Nano Dimension Technologies, LTD.
- Minoru Yamada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wireless board-to-board interconnect for high-rate wireless data tr...
- Patent number 11,870,507
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Anton Sergeevich Lukyanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit and circuit board
- Patent number 11,729,901
- Issue date Aug 15, 2023
- FUJIFILM Business Innovation Corp.
- Daisuke Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic band gap structure and package structure
- Patent number 11,658,375
- Issue date May 23, 2023
- NEC Corporation
- Masaharu Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,553,590
- Issue date Jan 10, 2023
- LG Electronics Inc.
- Seungmin Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit and circuit board
- Patent number 11,497,113
- Issue date Nov 8, 2022
- FUJIFILM Business Innovation Corp.
- Daisuke Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow shielding structure for different types of circuit elements...
- Patent number 11,445,645
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Keon Kuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic band gap structure apparatus
- Patent number 11,375,608
- Issue date Jun 28, 2022
- Realtek Semiconductor Corporation
- Hsin-Chan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave antenna apparatus
- Patent number 11,350,522
- Issue date May 31, 2022
- Sony Corporation
- Wasif Tanveer Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and electronic device comprising antenna device
- Patent number 11,324,112
- Issue date May 3, 2022
- Samsung Electronics Co., Ltd.
- Junho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure for solid state drives
- Patent number 11,259,403
- Issue date Feb 22, 2022
- SK Hynix Inc.
- Wenwei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic band gap structutre for antenna array
- Patent number 11,197,366
- Issue date Dec 7, 2021
- Delta Electronics, Inc.
- Chieh-Tsao Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EBG structure, EBG component, and antenna device
- Patent number 10,985,455
- Issue date Apr 20, 2021
- THE ANTENNA COMPANY INTERNATIONAL N.V.
- Shady Keyrouz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and switching power supply
- Patent number 10,980,109
- Issue date Apr 13, 2021
- Rohm Co., Ltd.
- Shingo Hashiguchi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electronic device
- Patent number 10,966,314
- Issue date Mar 30, 2021
- LG Electronics Inc.
- Seungmin Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhancing signaling bandwidth in an integ...
- Patent number 10,880,991
- Issue date Dec 29, 2020
- Marvell Asia Pte, Ltd.
- Thomas T. Ngo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit with capacitor in different layer than transmiss...
- Patent number 10,862,185
- Issue date Dec 8, 2020
- Semiconductor Components Industries, LLC
- Kimberly Dawn Eilert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D electromagnetic bandgap circuit
- Patent number 10,856,405
- Issue date Dec 1, 2020
- Realtek Semiconductor Corp.
- Yu-Cong Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,791,622
- Issue date Sep 29, 2020
- National University Corporation Okayama University
- Yoshitaka Toyota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for affixing a frequency selective surface to...
- Patent number 10,764,993
- Issue date Sep 1, 2020
- Walter S. Wall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and switching power supply for electronic app...
- Patent number 10,667,383
- Issue date May 26, 2020
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,660,198
- Issue date May 19, 2020
- LG Electronics Inc.
- Seungmin Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer film stencil process for fan-out wafer-level packaging of s...
- Patent number 10,617,010
- Issue date Apr 7, 2020
- Brewer Science, Inc.
- Tony D. Flaim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 10,542,622
- Issue date Jan 21, 2020
- National University Corporation Okayama University
- Yoshitaka Toyota
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Defected ground structure with void having resistive material along...
- Patent number 10,499,489
- Issue date Dec 3, 2019
- Hewlett Packard Enterprise Development LP
- Karl J. Bois
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and switching power supply
- Patent number 10,470,295
- Issue date Nov 5, 2019
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and radar apparatus
- Patent number 10,454,160
- Issue date Oct 22, 2019
- DENSO TEN LIMITED
- Takahiro Shinojima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD WITH ELECTROMAGNETIC BANDGAP STRUCTURE FOR LA...
- Publication number 20240196520
- Publication date Jun 13, 2024
- NXP B.V.
- Manuel Alfredo MONEDERO MIRANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-WIDEBAND ELECTROMAGNETIC BAND GAP (EBG) STRUCTURE AND CIRCUIT...
- Publication number 20240120633
- Publication date Apr 11, 2024
- ANHUI UNIVERSITY
- Xingang REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC BAND GAP ELEMENT STRUCTURE AND FABRICATION METHODS
- Publication number 20230397340
- Publication date Dec 7, 2023
- NANO-DIMENSION TECHNOLOGIES LTD.
- Minoru Yamada
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BAND...
- Publication number 20230232528
- Publication date Jul 20, 2023
- NXP USA, Inc.
- Yu-Ting David Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER
- Publication number 20230178480
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Anton Sergeevich LUKYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION DEVICE AND METHOD FOR IMPROVING THE SAME
- Publication number 20230156987
- Publication date May 18, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Hsin-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT AND CIRCUIT BOARD
- Publication number 20220312581
- Publication date Sep 29, 2022
- FUJIFILM Business Innovation Corp.
- Daisuke HORIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT AND CIRCUIT BOARD
- Publication number 20220312582
- Publication date Sep 29, 2022
- FUJIFILM Business Innovation Corp.
- Daisuke HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS BOARD-TO-BOARD INTERCONNECT FOR HIGH-RATE WIRELESS DATA TR...
- Publication number 20220131571
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Anton Sergeevich LUKYANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC BAND GAP STRUCTURE APPARATUS
- Publication number 20210185799
- Publication date Jun 17, 2021
- REALTEK SEMICONDUCTOR CORPORATION
- Hsin-Chan HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210168932
- Publication date Jun 3, 2021
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING ENCLOSURE WITH THERMAL CONDU...
- Publication number 20210153340
- Publication date May 20, 2021
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION DEVICE
- Publication number 20210029821
- Publication date Jan 28, 2021
- Delta Electronics, Inc.
- Chieh-Tsao HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND ELECTRONIC DEVICE COMPRISING ANTENNA DEVICE
- Publication number 20200413530
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Junho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND WIRING SUBSTRATE
- Publication number 20200352024
- Publication date Nov 5, 2020
- NEC Corporation
- Yoshiaki KASAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROWAVE ANTENNA APPARATUS
- Publication number 20200315001
- Publication date Oct 1, 2020
- SONY CORPORATION
- Wasif Tanveer KHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT
- Publication number 20200253039
- Publication date Aug 6, 2020
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200245452
- Publication date Jul 30, 2020
- LG ELECTRONICS INC.
- Seungmin WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOISE SUPPRESSION CIRCUIT DEVICE
- Publication number 20200163202
- Publication date May 21, 2020
- Inventec (Pudong) Technology Corp.
- Yen-Hao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EBG STRUCTURE, EBG COMPONENT, AND ANTENNA DEVICE
- Publication number 20200076072
- Publication date Mar 5, 2020
- THE ANTENNA COMPANY INTERNATIONAL N.V.
- Shady KEYROUZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT
- Publication number 20200022253
- Publication date Jan 16, 2020
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D ELECTROMAGNETIC BANDGAP CIRCUIT
- Publication number 20190357349
- Publication date Nov 21, 2019
- Realtek Semiconductor Corp.
- Yu-Cong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEG...
- Publication number 20190313523
- Publication date Oct 10, 2019
- Marvell World Trade Ltd.
- Thomas T. Ngo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190246494
- Publication date Aug 8, 2019
- National University Corporation Okayama University
- Yoshitaka TOYOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT WITH CAPACITOR IN DIFFERENT LAYER THAN TRANSMISS...
- Publication number 20190173148
- Publication date Jun 6, 2019
- Semiconductor Components Industries, LLC
- Kimberly Dawn EILERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190098750
- Publication date Mar 28, 2019
- LG ELECTRONICS INC.
- Seungmin WOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT
- Publication number 20180263110
- Publication date Sep 13, 2018
- Rohm Co., Ltd.
- Shingo Hashiguchi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED ANTENNAS AND PHASED ARRAYS WITH MODE-FREE ELECTROMAGNETI...
- Publication number 20180108964
- Publication date Apr 19, 2018
- The Regents of the University of California
- Enver Adas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC BANDGAP STRUCTURE AND METHOD FOR MANUFACTURING THE...
- Publication number 20180070441
- Publication date Mar 8, 2018
- Electronics and Telecommunications Research Instit ute
- Hongyeal LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER FILM STENCIL PROCESS FOR FAN-OUT WAFER-LEVEL PACKAGING OF S...
- Publication number 20180063963
- Publication date Mar 1, 2018
- BREWER SCIENCE INC.
- Tony D. Flaim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Electromagnetic band-gap structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electromagnetic interference shielding enclosure with thermal condu...

Ultra-wideband electromagnetic band gap (EBG) structure and circuit...

RF filter device for aircraft nacelle access door gap

Electromagnetic band gap element structure and fabrication methods

Wireless board-to-board interconnect for high-rate wireless data tr...

Electronic circuit and circuit board

Electromagnetic band gap structure and package structure

Electronic device

Electronic circuit and circuit board

Hollow shielding structure for different types of circuit elements...

Electromagnetic band gap structure apparatus

Microwave antenna apparatus

Antenna device and electronic device comprising antenna device

Printed circuit board structure for solid state drives

Electromagnetic band gap structutre for antenna array

EBG structure, EBG component, and antenna device

Printed circuit board and switching power supply

Electronic device

Apparatus and methods for enhancing signaling bandwidth in an integ...

Integrated circuit with capacitor in different layer than transmiss...

3D electromagnetic bandgap circuit

Printed wiring board

Method and apparatus for affixing a frequency selective surface to...

Printed circuit board and switching power supply for electronic app...

Electronic device

Polymer film stencil process for fan-out wafer-level packaging of s...

Printed wiring board

Defected ground structure with void having resistive material along...

Printed circuit board and switching power supply

Antenna device and radar apparatus

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD WITH ELECTROMAGNETIC BANDGAP STRUCTURE FOR LA...

ULTRA-WIDEBAND ELECTROMAGNETIC BAND GAP (EBG) STRUCTURE AND CIRCUIT...

ELECTROMAGNETIC BAND GAP ELEMENT STRUCTURE AND FABRICATION METHODS

POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BAND...

WIRELESS INTERCONNECT FOR HIGH-RATE DATA TRANSFER

SIGNAL ISOLATION DEVICE AND METHOD FOR IMPROVING THE SAME

ELECTRONIC CIRCUIT AND CIRCUIT BOARD

ELECTRONIC CIRCUIT AND CIRCUIT BOARD

WIRELESS BOARD-TO-BOARD INTERCONNECT FOR HIGH-RATE WIRELESS DATA TR...

ELECTROMAGNETIC BAND GAP STRUCTURE APPARATUS

ELECTRONIC DEVICE

ELECTROMAGNETIC INTERFERENCE SHIELDING ENCLOSURE WITH THERMAL CONDU...

COMMUNICATION DEVICE

ANTENNA DEVICE AND ELECTRONIC DEVICE COMPRISING ANTENNA DEVICE

STRUCTURE AND WIRING SUBSTRATE

MICROWAVE ANTENNA APPARATUS

PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT

ELECTRONIC DEVICE

NOISE SUPPRESSION CIRCUIT DEVICE

EBG STRUCTURE, EBG COMPONENT, AND ANTENNA DEVICE

PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT

3D ELECTROMAGNETIC BANDGAP CIRCUIT

APPARATUS AND METHODS FOR ENHANCING SIGNALING BANDWIDTH IN AN INTEG...

PRINTED WIRING BOARD

INTEGRATED CIRCUIT WITH CAPACITOR IN DIFFERENT LAYER THAN TRANSMISS...

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND SWITCHING POWER SUPPLY EMPLOYING IT

INTEGRATED ANTENNAS AND PHASED ARRAYS WITH MODE-FREE ELECTROMAGNETI...

ELECTROMAGNETIC BANDGAP STRUCTURE AND METHOD FOR MANUFACTURING THE...

POLYMER FILM STENCIL PROCESS FOR FAN-OUT WAFER-LEVEL PACKAGING OF S...